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91. 发明公开

EP2857744A1 LED light module and lighting system 审中-公开
标题翻译： LED-Lichtmodul和Beleuchtungssystem
公开(公告)号：EP2857744A1
公开(公告)日：2015-04-08
申请号：EP13187514.8
申请日：2013-10-07
申请人： Hella KGaA Hueck & Co
发明人： Kerpe, Alexander
IPC分类号： F21V29/00 , F21V31/00 , F21V19/04 , F21V3/02 , F21Y101/02 , F21K99/00
CPC分类号： F21V19/045 , F21K9/00 , F21V3/02 , F21V29/713 , F21V29/87 , F21V31/005 , F21Y2115/10
摘要： The invention addresses a light module (6) comprising a carrier (2) which at least in parts consists of a heat conductive material; comprising a light emitting diode (4) which is mounted to a front side of the carrier (2) and designed for light emission into a main light exit direction (22); comprising a support structure (1) providing a carrier support (10) which support structure (1) consists of an at least partial transparent and/or translucent material and which support structure (1) is designed for light transmission; means for connecting the support structure (1) and the carrier (2); and an inner space (13) which is built between the carrier (2) and the support structure (1) with the at least one light emitting diode (4) being positioned inside the inner space (13), wherein a soft thermal interface is provided which covers at least one third of a back side of the carrier, preferred more than 50 % of the back side of the carrier and even more preferred the complete back side of the carrier.
摘要翻译：本发明涉及一种包括载体（2）的光模块（6），所述载体（2）至少部分地由导热材料组成; 包括安装在所述载体（2）的前侧并被设计用于发光到主光出射方向（22）的发光二极管（4）。包括支撑结构（1），其提供载体支撑件（10），支撑结构（1）由至少部分透明和/或半透明材料组成，并且所述支撑结构（1）被设计用于光透射; 用于连接支撑结构（1）和载体（2）的装置; 以及内部空间（13），所述内部空间（13）被构建在所述载体（2）和所述支撑结构（1）之间，所述至少一个发光二极管（4）位于所述内部空间（13）的内部，其中软热界面被设置为覆盖载体的背面的至少三分之一，优选载体背面的50％以上，甚至更优选载体的完整背面。

92. 发明授权

EP2564115B1 LED-BASED ILLUMINATION MODULE ATTACHMENT TO A LIGHT FIXTURE 失效转让
标题翻译：固定基于LED的发光模块中的固定装置
公开(公告)号：EP2564115B1
公开(公告)日：2015-03-25
申请号：EP11717119.9
申请日：2011-04-18
申请人： Xicato, Inc.
发明人： HARBERS, Gerard , ENG, Gregory, W. , REED, Christopher, R. , TSENG, Peter, K. , YRIBERRI, John, S.
IPC分类号： F21V19/00 , F21V29/00 , F21Y101/02
CPC分类号： F21V29/70 , F21K9/00 , F21V17/14 , F21V19/045 , F21V29/004 , F21V29/505 , F21V29/67 , F21V29/677 , F21V29/74 , F21V29/773 , F21V29/89 , F21Y2115/10
摘要： An led based illumination module (100) mounting interface comprising: a mounting collar including an elastic member, wherein the mounting collar is operable to capture an led based illumination module by a movement of the mounting collar relative to a light fixture, and wherein the movement deforms the elastic member and generates a compressive force between the led based illumination module and the light fixture.

93. 发明公开

EP2833047A4 LED LAMP CONVENIENT TO ASSEMBLE AND DISSEMBLE 有权
标题翻译：用实际安装和拆卸LED灯
公开(公告)号：EP2833047A4
公开(公告)日：2015-02-25
申请号：EP13787701
申请日：2013-04-25
申请人： SHANGHAI SANSI ELECTRONICS ENGINEERING CO LTD , SHANGHAI SANSI SCIENCE AND TECHNOLOGY DEV CO LTD , JIASHAN SANSI PHOTOELECTRIC TECHNOLOGY CO LTD
发明人： CHEN BISHOU , XU LI , CHEN MIN , CAI LING
IPC分类号： F21S2/00 , F21K99/00 , F21S8/04 , F21V19/00 , F21Y101/02 , F21Y103/00
CPC分类号： F21K9/17 , F21K9/20 , F21S8/04 , F21V19/0025 , F21V19/045 , F21V23/06 , F21V31/005 , F21Y2103/10 , F21Y2115/10

94. 发明授权

EP2411732B1 LED-LEUCHTE 失效转让
公开(公告)号：EP2411732B1
公开(公告)日：2015-01-14
申请号：EP10712039.6
申请日：2010-03-23
申请人： Tridonic Jennersdorf GmbH , Tridonic GmbH & Co. KG
发明人： PLATZER, Christoph , KREUZBICHLER, Jürgen , RIEDLER, Thomas
IPC分类号： F21V19/00 , F21V19/04 , F21V23/00 , F21V29/00 , F21Y101/02 , F21V17/10 , F21V21/30 , F21V23/02 , H01R33/46
CPC分类号： F21V19/001 , F21V17/14 , F21V19/0065 , F21V19/045 , F21V21/30 , F21V23/02 , F21V23/06 , F21V29/77 , F21Y2115/10 , H01R33/46

95. 发明公开

EP2756221A2 ASSEMBLY AND INTERCONNECTION METHOD FOR HIGH-POWER LED DEVICES 失效
标题翻译：安排和相关程序功能强大的LED器件
公开(公告)号：EP2756221A2
公开(公告)日：2014-07-23
申请号：EP12831269.1
申请日：2012-09-14
申请人： Air Motion Systems, Inc.
发明人： BROWN, Michael, H., Jr.
IPC分类号： F21S2/00 , F21V21/002 , F21Y101/02
CPC分类号： H01R4/36 , F21S2/005 , F21S4/28 , F21V19/0055 , F21V19/045 , F21V23/06 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , H01R11/09 , Y10T29/49002
摘要： An LED array with a plurality of easily replaceable LED assemblies. The LED assemblies are attached to a mounting substrate, e.g., by threaded, electrically insulative fasteners. The LED assemblies are electrically connected in a series by detachable power connect clamps and interconnect clamps. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. 37 C.F.R. § 1.72(b).

96. 发明公开

EP2748529A1 SOLID STATE LIGHTING MODULE WITH IMPROVED HEAT SPREADER 有权
标题翻译： FESTKÖRPERBELEUCHTUNGSMODULMIT VERBESSERTEMWÄRMEVERTEILER
公开(公告)号：EP2748529A1
公开(公告)日：2014-07-02
申请号：EP12808480.3
申请日：2012-11-06
申请人： Koninklijke Philips N.V.
发明人： CREUSEN, Martinus Petrus , TREURNIET, Theodoor Cornelis , PEETERS,Henricus Marie
IPC分类号： F21V17/14 , F21V29/00
CPC分类号： G05D23/2451 , F21K9/00 , F21K9/20 , F21V19/001 , F21V19/045 , F21V29/70 , F21V29/745 , F21V29/763 , F21Y2105/10 , F21Y2115/10
摘要： A solid state lighting module (102) for attachment to a socket (103) through rotation of the solid state lighting module around an axis of rotation (111). The solid state lighting module (102) comprises at least one solid state light-source (112); a heat spreading member (104) having two surfaces arranged opposite each other and in thermal connection with each other, the first surface (114) being in thermal connection with the solid state light- source (112); and fastening means (109) arranged to co-operate with fastening means (113) comprised in the socket (103) to bring the second surface (115) of the heat spreading member (104) in thermal connection with a heat sink (110) comprised in the socket (103). The second surface (115) of the heat spreading member (104) has a surface topography with at least one peak (119) and at least one valley (120) arranged concentrically in relation to the axis of rotation (111).
摘要翻译：固体照明模块（102），用于通过固态照明模块围绕旋转轴线（111）的旋转来附接到插座（103）。固态照明模块（102）包括至少一个固态光源（112）; 具有彼此相对布置且彼此热连接的两个表面的散热构件（104），所述第一表面（114）与所述固态光源（112）热连接; 以及紧固装置（109），其布置成与包括在所述插座（103）中的紧固装置（113）配合，以使所述散热构件（104）的第二表面（115）与散热器（110）热连接，包括在插座（103）中。散热构件（104）的第二表面（115）具有至少一个峰（119）和至少一个相对于旋转轴线（111）同心设置的谷部（120）的表面形貌。

97. 发明公开

EP2719938A1 Lighting device 审中-公开
标题翻译：照明设备
公开(公告)号：EP2719938A1
公开(公告)日：2014-04-16
申请号：EP13187891.0
申请日：2013-10-09
申请人： OSRAM GmbH , OSRAM S.P.A. - SOCIETA' RIUNITE OSRAM EDISON CLERICI
发明人： Zanotto, Alberto , Caldon, Matteo , Zanon, Franco , Bobbo, Simon
IPC分类号： F21K99/00 , F21V19/00 , F21Y105/00
CPC分类号： F21V19/0045 , F21V19/004 , F21V19/045 , F21V29/763 , F21Y2105/10 , F21Y2115/10
摘要： A lighting device (10), of the LED type for example, to be mounted on a mounting surface (S) comprises a planar solid state lighting module (12) having a light radiation emission region (12b) and a frame-like housing (14) for the lighting module (12). The housing (14) can be fixed, with screws (V) for example, to the mounting surface (S), and has a window (14a) to expose the light radiation emission region (12b) of the lighting module (12). The housing (14) has a recess (14d) for the insertion of the lighting module (12) into the housing (14) whereby, with the housing (14) applied to the mounting surface (S), the lighting module (12) is insertable into housing (14) and removable therefrom by sliding over the mounting surface (S). A set of elastic assemblies (20) acting between the housing (14) and the lighting module (12) enables the lighting module (12) to be urged to bear on the mounting surface (S) and enables it to be held in an inserted position in the housing (14).
摘要翻译：例如LED类型的照明装置（10）将被安装在安装表面（S）上，该照明装置包括具有光辐射发射区域（12b）和框架状外壳（12b）的平面固态照明模块（12） 14）用于照明模块（12）。外壳（14）可以用螺钉（V）例如固定到安装表面（S），并且具有暴露照明模块（12）的光辐射发射区域（12b）的窗口（14a）。外壳（14）具有用于将照明模块（12）插入外壳（14）中的凹部（14d），借此在外壳（14）施加到安装表面（S）的情况下，照明模块（12）可插入壳体（14）中并可通过在安装表面（S）上滑动而从其中移除。作用在壳体（14）和照明模块（12）之间的一组弹性组件（20）使得照明模块（12）能够被推动以支承在安装表面（S）上并且使得它能够保持插入在外壳（14）中的位置。

98. 发明公开

EP2694875A2 VORRICHTUNG ZUM BEFESTIGEN UND KONTAKTIEREN EINES LEUCHTMITTELS UND/ODER EINES LEUCHTMODULS, SOWIE LEUCHTE 有权转让
标题翻译：装置用于固定和接触的球和/或光模块和光
公开(公告)号：EP2694875A2
公开(公告)日：2014-02-12
申请号：EP12721692.7
申请日：2012-04-03
申请人： Tridonic Connection Technology GmbH & Co Kg
发明人： MOSER, Peter , RIEDLER, Thomas
IPC分类号： F21V19/04 , F21V19/00 , F21V29/00 , F21Y101/02
CPC分类号： F21V15/012 , F21K9/20 , F21V19/0005 , F21V19/045 , F21V29/507 , F21V29/77 , F21Y2115/10
摘要： The invention relates to a device for fastening and contacting a lighting means and/or a lighting module, in particular an LED module (2), wherein the device (1) has at least one socket housing (3), wherein the lighting means and/or lighting module, in particular LED module (2), is arranged in the socket housing (3) of the device (1) and is pressed onto a heat sink (4) connected to the device (1), wherein said pressing is performed at least by means of spring means (5) of the device (1), wherein the spring means (5) are an integral part of the socket housing (3). The invention further relates to a device having a ground (25), which is contacted by the socket housing (3) directly on the heat sink (4), and to a lamp having such a device.

99. 发明授权

EP2345836B1 A light source unit for a semiconductor-type light source of vehicle lighting device and a vehicle lighting device 有权转让
标题翻译：一种用于车辆的照明装置的半导体类型的光源和车辆用照明装置的光源单元
公开(公告)号：EP2345836B1
公开(公告)日：2013-10-09
申请号：EP11151056.6
申请日：2011-01-17
申请人： Ichikoh Industries, Ltd.
发明人： Hayashi, Masateru , Nakano, Katsuaki , Kojima, Masaru
IPC分类号： F21K99/00 , F21V29/00 , F21S8/10 , F21Y101/02
CPC分类号： F21V19/045 , F21K9/00 , F21S41/143 , F21S41/155 , F21S41/19 , F21S41/192 , F21S45/47 , F21S45/48 , F21V19/003 , F21Y2115/10
摘要： The present invention includes a light source 10 and a socket 11. The light source 10 includes a base plate 3, light emitting chips 41 to 44 for a semiconductor-type light source, resistors 51, 52, diodes 53, 54 and wiring 6. The socket 11 includes an insulating member 7, a radiating member 8 and feed members 91 to 93. The light source 10 is attached to the socket 11. The base plate 3 is attached to the radiating member 8. Such a structure of the present invention can be implemented in reduced size and with an enhanced heat radiation effect.

100. 发明公开

EP2641016A2 BOARD ASSEMBLIES, LIGHT EMITTING DEVICE ASSEMBLIES, AND METHODS OF MAKING THE SAME 审中-公开
标题翻译：板订单，订单LED器件及其制造方法
公开(公告)号：EP2641016A2
公开(公告)日：2013-09-25
申请号：EP11842312.8
申请日：2011-10-03
申请人： Cree, Inc.
发明人： LOPEZ, Peter , LAY, Michael
IPC分类号： F21V17/00 , F21V29/00
CPC分类号： F21V19/045 , F21V29/773 , F21V29/85 , F21V29/89 , F21Y2105/10 , F21Y2115/10 , H05K1/181 , H05K3/0061 , H05K2201/10106 , Y10T29/4913 , Y10T403/7005 , Y10T403/7007 , Y10T403/7015
摘要： Board assemblies, light emitting device assemblies and related methods are provided. An assembly can include a board comprising a face surface, a rear surface opposite the face surface and side edges around a periphery of the board. The assembly can also include a heat sink for dissipating heat from the board. The assembly can also include a retainer configured to secure the board to the heat sink. One or more light-emitting diode packages can be secured to the board for creating a light-emitting device assembly.

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