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    • 95. 发明公开
    • METHOD AND SYSTEM FOR PROVIDING PROCESS TOOL CORRECTABLES USING AN OPTIMZED SAMPLING SCHEME WITH SMART INTERPOLATION
    • 方法和系统提供PROZESSWERKZEUGKORRIGIERBARER使用优化的扫描方案智能插值
    • EP2537180A4
    • 2016-05-04
    • EP11745086
    • 2011-02-14
    • KLA TENCOR CORP
    • IZIKSON PAVELKANDEL DANIELROBINSON JOHN
    • H01L21/66H01L21/027
    • H01L22/20H01L2924/0002H01L2924/00
    • The present invention may include performing a first measurement on a wafer of a first lot of wafers via an omniscient sampling process, calculating a first set of process tool correctables utilizing one or more results of the measurement performed via an omniscient sampling process, randomly selecting a set of field sampling locations of the wafer of a first lot of wafers, calculating a second set of process tool correctables by applying an interpolation process to the randomly selected set of field sampling locations, wherein the interpolation process utilizes values from the first set of process tool correctables for the randomly selected set of field sampling locations in order to calculate correctables for fields of the wafer of the first lot not included in the set of randomly selected fields, and determining a sub-sampling scheme by comparing the first set of process tool correctables to the second set of correctables.
    • 本发明可以包括经由在全知采样处理的第一批晶圆的晶片上执行第一测量,计算第一组处理工具可校正值的利用通过在全知采样过程所执行的测量的一个或多个结果,随机地选择一个 集的第一批晶圆的晶片的场的采样位置的,通过施加到内插处理,以随机选择的组场采样位置的,worin内插处理计算第二组处理工具可校正值的利用来自所述第一组工艺的值 工具可校正值用于为了计算可校正值对未包括在所述一组随机选择的视野的第一批次的晶片的字段中的随机选择的组场采样位置的,和确定性采矿子采样方案,通过比较所述第一组处理工具的 可校正值到第二组可校正值的。