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1. 发明公开

EP3128505A4 MOUNTING SUBSTRATE AND ELECTRONIC DEVICE 有权转让
标题翻译： MONTAGESUBSTRAT UND ELEKTRONISCHE VORRICHTUNG
公开(公告)号：EP3128505A4
公开(公告)日：2017-08-09
申请号：EP15774421
申请日：2015-03-17
申请人： SONY CORP
发明人： AOYAGI AKIYOSHI , KIKUCHI KEN , TOMODA KATSUHIRO
IPC分类号： G09F9/30 , G09F9/00 , G09F9/33 , H01L25/00 , H01L25/075 , H01L33/00 , H01L33/62
CPC分类号： H01L22/22 , F21V19/003 , F21Y2115/10 , G09G3/32 , G09G2300/0408 , G09G2300/0421 , H01L25/0753 , H01L25/167 , H01L33/54 , H01L33/58 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： A mounting substrate according to an embodiment of the present technology includes: a wiring substrate (30); a plurality of light-emitting elements (12) arranged in a matrix on the wiring substrate; and a plurality of drive ICs (13) that are arranged in a matrix on the wiring substrate, and control light emission of the light-emitting elements. The light-emitting elements and the drive ICs are mounted on a same surface. The wiring substrate includes a plurality of first wiring lines (16) on a mounting surface whre the light-emitting elements and the dive ICs are mounted. The first wiring lines electrically couple the light-emitting elements to the drive ICs.
摘要翻译：根据本技术的实施例的安装基板包括：布线基板（30）;布线基板多个发光元件（12），以矩阵形式布置在布线基板上; 以及多个驱动IC（13），所述多个驱动IC（13）以矩阵形式布置在布线基板上，并且控制发光元件的发光。发光元件和驱动IC安装在同一表面上。布线基板包括安装发光元件和潜水IC的安装表面上的多个第一布线（16）。第一布线将发光元件电耦合到驱动IC。

2. 发明公开

EP3128504A4 MOUNTING SUBSTRATE AND ELECTRONIC DEVICE 有权转让
标题翻译： MONTAGESUBSTRAT UND ELEKTRONISCHE VORRICHTUNG
公开(公告)号：EP3128504A4
公开(公告)日：2017-08-09
申请号：EP15773964
申请日：2015-03-17
申请人： SONY CORP
发明人： AOYAGI AKIYOSHI
IPC分类号： G09F9/30 , G09F9/33 , H01L33/00 , H05K3/46
CPC分类号： H01L25/167 , H01L2924/0002 , H05K1/185 , H05K3/4602 , H05K2201/10106 , H05K2201/10128 , H01L2924/00
摘要： A mounting substrate according to an embodiment of the present technology includes: a wiring substrate (30); a fine L/S layer (40) formed in contact with a top surface of the wiring substrate; and a plurality of elements (12, 13) arranged in a matrix on a top surface of the fine L/S layer. The wiring substrate includes a plurality of first wiring lines (SigB1, Gate2), and a plurality of vias (14) arranged at a period corresponding to an integral multiple of an arrangement period of the plurality of element, and two or more of the vias are provided for each of the first wiring lines. Two or more adjacent ones of the elements on the fine L/S layer are electrically coupled to common one of the vias through one or more second wiring lines (16).
摘要翻译：根据本技术的实施例的安装基板包括：布线基板（30）;布线基板形成为与布线基板的上表面接触的微细L / S层（40）和在精细L / S层的顶表面上以矩阵排列的多个元件（12,13）。布线基板包括以对应于多个元件的布置周期的整数倍的周期布置的多个第一布线（SigB1，Gate2）和多个通孔（14），并且两个或更多个通孔被提供用于每个第一布线。精细L / S层上的两个或更多个相邻的元件通过一个或多个第二布线（16）电耦合到公共的一个通孔。

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