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1. 发明公开

EP3227968A1 EDGE ASSEMBLY FOR ATTACHING TO FLEXIBLE SUBSTRATES 审中-公开
标题翻译：边缘组件用于连接柔性基板
公开(公告)号：EP3227968A1
公开(公告)日：2017-10-11
申请号：EP15801618.8
申请日：2015-11-16
申请人： Osram Sylvania Inc.
发明人： SPEER, Richard , GROSSMAN, Kenneth
IPC分类号： H01R12/71 , H01R12/79 , H05K3/36 , F21V23/06
CPC分类号： H01R12/772 , F21S8/04 , F21V19/003 , F21V23/06 , F21Y2105/10 , F21Y2107/70 , H01R12/7011 , H01R12/714 , H01R12/777 , H01R12/79 , H05K3/365 , H05K2201/10106 , H05K2201/1059 , H05K2201/10606
摘要： There is described an edge assembly for attaching to flexible substrates. An example assembly may comprise at least a first edge component and a compression retainer component. The first edge component may include at least one conductor to mate with one or more conductors on a surface of a flexible substrate after the first edge component is affixed to an edge of the flexible substrate by the compression retainer component. The edge assembly may also comprise a second edge component, wherein the flexible substrate may be compressed between the first and second edge components and held in place by the compression retainer component. The first edge component may further comprise an extension, including the at least one conductor, that may be used to convey power from a power source to the flexible substrate. The extension is accessible from outside the flexible substrate via a port in the compression retainer component.
摘要翻译：包括至少第一边缘部件（110A，110B，110），柔性衬底（102）和将所述第一边缘部件（110A，110B，110）附接到所述第一边缘部件（110A，110B）的压缩保持器部件（118）的边缘组件柔性衬底（102）。第一边缘组件（110A，110B，110）包括至少一个导体（112A，112B，112）以在柔性衬底（102）的第一边缘组件（110A）之后与一个或多个导体，110B）通过压缩保持器部件（118）固定到柔性基板（102）的边缘。边缘组件（108,108'）还可包括第二边缘部件（116），其中柔性基板（102）可被压缩在第一和第二边缘部件（106）之间并由压缩保持器部件 118）。第一边缘部件（110A，110B，110）还包括用于将来自电源（404）的功率传送到柔性衬底（114）的包括至少一个导体（112A，112B，112）的延伸部（102）。延伸部114可从柔性衬底102的外部经由压缩保持器部件118中的端口124进入。

2. 发明公开

EP3684163A1 HORTICULTURAL LIGHT MODULE ASSEMBLY 审中-公开
公开(公告)号：EP3684163A1
公开(公告)日：2020-07-29
申请号：EP18788942.3
申请日：2018-09-21
申请人： Osram Sylvania Inc.
发明人： SPEER, Richard
IPC分类号： A01G9/26 , F21V8/00

3. 发明公开

EP3066899A1 FLEXIBLE CIRCUIT BOARD FOR LED LIGHTING FIXTURES 有权转让
标题翻译：柔性板LED路灯
公开(公告)号：EP3066899A1
公开(公告)日：2016-09-14
申请号：EP14802554.7
申请日：2014-11-05
申请人： Osram Sylvania Inc.
发明人： SPEER, Richard , HAMBY, David , SELVERIAN, John
IPC分类号： H05K3/10 , H05K1/18 , H01L33/48 , F21S4/00 , H05K1/02 , H01L25/13
CPC分类号： H01L25/0753 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0016 , H01L2933/0033 , H01L2933/0058 , H01L2933/0066 , H05K1/0274 , H05K1/0287 , H05K1/181 , H05K1/189 , H05K3/103 , H05K2201/10106 , H05K2201/1028 , H05K2201/2054 , H05K2203/063 , H01L2924/00
摘要： Techniques are disclosed for making a flexible laminated circuit board using a metal conductor onto which a SMD may be attached. Conductive metal strips may be laminated to form a flexible substrate and the metal strips may then be perforated for the placement of LED package leads. The LED packages may be attached to the conductive strips using solder or a conductive epoxy and the upper laminate layer may include perforations exposing portions of the metal strips for the attachment of the LED packages. Alternatively, strings of LED packages may be fabricated by attaching LED packages to conductive strips and these strings may be laminated between flexible sheets to form a laminated LED circuit. Plastic housings may aid in attaching the LED packages to the conductive strips. The plastic housings and/or the laminate sheets may be made of a reflective material.

4. 发明授权

EP3141091B1 TECHNIQUES FOR ADHERING SURFACE MOUNT DEVICES TO A FLEXIBLE SUBSTRATE 有权
公开(公告)号：EP3141091B1
公开(公告)日：2020-09-16
申请号：EP15725930.0
申请日：2015-05-08
申请人： Osram Sylvania Inc.
发明人： SPEER, Richard , HAMBY, David , SCOTCH, Adam
IPC分类号： H05K1/18 , H05K3/32

5. 发明公开

EP3658870A1 IRRADIANCE-CONTROLLED FIXTURE FOR HORTICULTURAL APPLICATIONS 审中-公开
公开(公告)号：EP3658870A1
公开(公告)日：2020-06-03
申请号：EP18749926.4
申请日：2018-07-12
申请人： Osram Sylvania Inc.
发明人： HAMBY, David , SPEER, Richard , SELVERIAN, John , SARKISIAN, Alan , PEREYRA, Rodrigo, M.
IPC分类号： G01J1/08 , G01J1/32

6. 发明公开

EP3141091A1 TECHNIQUES FOR ADHERING SURFACE MOUNT DEVICES TO A FLEXIBLE SUBSTRATE 有权
标题翻译：芙蓉蓉
公开(公告)号：EP3141091A1
公开(公告)日：2017-03-15
申请号：EP15725930.0
申请日：2015-05-08
申请人： Osram Sylvania Inc.
发明人： SPEER, Richard , HAMBY, David , SCOTCH, Adam
IPC分类号： H05K1/18 , H05K3/32
摘要： Techniques are disclosed for attaching SMDs to a flexible substrate using conductive epoxy bond pads. Each bond pad includes a set of elongated strips of conductive epoxy that are applied and cured onto the flexible substrate in an adjacent and parallel fashion. The bond pads are used to attach SMDs to the flexible substrate and also provide the conductive contacts for a printed circuit. A circuit may be printed on the flexible substrate using conductive ink that partially covers the bond pads, leaving a portion of the pads exposed. A second layer or strip of conductive epoxy may be applied over and across the exposed portions of the bond pad strips in order to attach an SMD. The number, size, and orientation of the epoxy bond pad strips may be determined by the amount of bending the flexible substrate is expected to withstand and/or the orientation of the bend.
摘要翻译：公开了使用导电环氧树脂接合垫将SMD连接到柔性基板上的技术。每个接合焊盘包括一组细长的导电环氧树脂条，其以相邻和平行的方式施加并固化到柔性基板上。接合焊盘用于将SMD连接到柔性基板上，并且还为印刷电路提供导电触点。可以使用部分覆盖接合焊盘的导电油墨将电路印刷在柔性基板上，从而使一部分焊盘露出。导电环氧树脂的第二层或带可以施加在接合焊盘条的暴露部分上并跨越接合焊盘条的暴露部分，以便附接SMD。环氧接合焊盘条的数量，尺寸和取向可以由柔性基板预期承受的弯曲量和/或弯曲的取向来确定。

7. 发明授权

EP3198189B1 FORMED THREE-DIMENSIONAL LIGHTING DEVICES 有权
公开(公告)号：EP3198189B1
公开(公告)日：2018-09-19
申请号：EP15775349.2
申请日：2015-09-23
申请人： Osram Sylvania Inc.
发明人： DAI, Qi , RADL, Bruce , SPEER, Richard , PEREYRA, Rodrigo , HUANG, Qiong , HARRIOTT, Douglas , WANG, Zhuo
IPC分类号： F21S4/00
CPC分类号： F21S4/22 , F21V19/003 , F21V23/06 , F21Y2103/10 , F21Y2107/00 , F21Y2115/10
摘要： A formed lighting device having a shape that extends in three dimensions is provided. The formed lighting device includes a formed flexible substrate having a shape, and a stretchable conductive trace located on the formable flexible substrate. A plurality of solid state light sources are attached to the stretchable conductive trace. The shape of the substrate, and thus the lighting device, extends in three dimensions and includes a three-dimensional structure that beam shapes light emitted from one of the solid state light sources. The three-dimensional structure may be a plurality of peaks and a corresponding plurality of valleys. A set of solid state light sources in the plurality of solid state light sources may be located in the plurality of valleys.

8. 发明公开

EP3198189A1 FORMED THREE-DIMENSIONAL LIGHTING DEVICES 有权
标题翻译：成形的三维照明装置
公开(公告)号：EP3198189A1
公开(公告)日：2017-08-02
申请号：EP15775349.2
申请日：2015-09-23
申请人： Osram Sylvania Inc.
发明人： DAI, Qi , RADL, Bruce , SPEER, Richard , PEREYRA, Rodrigo , HUANG, Qiong , HARRIOTT, Douglas , WANG, Zhuo
IPC分类号： F21S4/00
CPC分类号： F21S4/22 , F21V19/003 , F21V23/06 , F21Y2103/10 , F21Y2107/00 , F21Y2115/10
摘要： A formed lighting device having a shape that extends in three dimensions is provided. The formed lighting device includes a formed flexible substrate having a shape, and a stretchable conductive trace located on the formable flexible substrate. A plurality of solid state light sources are attached to the stretchable conductive trace. The shape of the substrate, and thus the lighting device, extends in three dimensions and includes a three-dimensional structure that beam shapes light emitted from one of the solid state light sources. The three-dimensional structure may be a plurality of peaks and a corresponding plurality of valleys. A set of solid state light sources in the plurality of solid state light sources may be located in the plurality of valleys.
摘要翻译：提供了具有三维延伸形状的成形照明装置。所形成的照明装置包括具有形状的成形柔性基板和位于可成形柔性基板上的可拉伸导电迹线。多个固态光源附接到可拉伸导电迹线。基板的形状以及由此的照明装置在三维上延伸，并且包括三维结构，该三维结构对从固态光源中的一个发射的光进行光束成形。三维结构可以是多个峰和相应的多个谷。多个固态光源中的一组固态光源可以位于多个谷中。

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