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1. 发明授权

US06494767B2 Polish and applying buffing mitt, kit and method 失效
标题翻译：波兰语和应用抛光手套，套件和方法
公开(公告)号：US06494767B2
公开(公告)日：2002-12-17
申请号：US09810459
申请日：2001-03-19
申请人： Kurt W. Fisher
发明人： Kurt W. Fisher
IPC分类号： B24B730
CPC分类号： A47L23/05 , A47L13/19 , A47L23/10
摘要： A disposable polish applying and buffing mitt comprising a multilayered mitt with a polish impervious layer removably attached to an impervious buffing mitt. A disposable polish applying and buffing mitt comprising a multilayered mitt with a sponge-like layer having an impervious backing removably attached to a buffing mitt. A disposable polish applying and buffing kit comprising a multilayered mitt with a first layer of polish impervious material removably secured to a second layer of polish impervious material forming a compartment therebetween which can hold a polish. The first layer of polish impervious material is removed from the second layer of polish impervious material to expose the polish for application. After the polish is applied to the object, the second layer of polish impervious material is removed to expose the buffing mitt.
摘要翻译：一次性抛光施用和抛光手套，其包括多层手套，其具有可拆卸地附接到不透水的抛光手套的不透光层。一次抛光施用和抛光手套，其包括具有海绵状层的多层手套，其具有可拆卸地附接到抛光手套的不可渗透的背衬。一次性抛光涂抹和抛光试剂盒，其包括多层手套和第一层不透光材料，其可移除地固定到第二层不透光材料上，在其间形成可容纳抛光剂的隔室。将第一层不透光材料从第二层不透光材料中取出，以露出抛光剂以供涂抹。将抛光剂施加到物体上之后，去除第二层不透光材料，露出抛光手套。

2. 发明授权

US06685543B2 Compensating chemical mechanical wafer polishing apparatus and method 有权
标题翻译：补偿化学机械晶圆抛光装置及方法
公开(公告)号：US06685543B2
公开(公告)日：2004-02-03
申请号：US10117088
申请日：2002-04-08
申请人： Jer-Shyong Lai , Wen-Chueh Pan , Yang-Jiann Fann , Yih-Hsing Wang , Chien-Cheng He , Chaug-Liang Hsu
发明人： Jer-Shyong Lai , Wen-Chueh Pan , Yang-Jiann Fann , Yih-Hsing Wang , Chien-Cheng He , Chaug-Liang Hsu
IPC分类号： B24B730
CPC分类号： B24B37/107 , B24B37/013 , B24B53/017 , B24B57/02 , H01L21/30625
摘要： A compensating chemical mechanical wafer polishing apparatus and its related polishing method, which makes end point detection easy, minimizes slurry consumption, and requires less installation space and, in which a main polishing head of diameter smaller than the wafer and a compensating polishing head are used to polish the wafer, which is upwardly disposed in contact with the polishing heads. By means of the operation of the compensating polishing head to polish the wafer over the area where the main polishing head cannot effectively evenly polish, satisfactory polishing effect is achieved.
摘要翻译：一种补偿化学机械晶片抛光装置及其相关的抛光方法，其使端点检测容易，使浆料消耗最小化，并且需要较少的安装空间，并且其中使用直径小于晶片的主抛光头和补偿抛光头以抛光与抛光头接触的向上设置的晶片。通过补偿抛光头的操作，在主抛光头不能有效均匀抛光的区域上抛光晶片，实现了令人满意的抛光效果。

3. 发明授权

US06241580B1 Polish applying and buffing mitt, kit and method 失效
标题翻译：波兰应用和抛光手套，套件和方法
公开(公告)号：US06241580B1
公开(公告)日：2001-06-05
申请号：US09421375
申请日：1999-10-20
申请人： Kurt W. Fisher
发明人： Kurt W. Fisher
IPC分类号： B24B730
CPC分类号： A47L23/05 , A47L13/19 , A47L23/10
摘要： A disposable polish applying and buffing mitt comprising a multilayered mitt with a polish impervious layer removably attached to a material pervious to polish such that the material pervious to polish would stain the hand of the user if used to apply the polish but is suitable for buffing the object to which the polish has been applied. A disposable polish applying and buffing kit comprising a multilayered mitt with a first layer of polish impervious material removably secured to a second layer of polish impervious material forming a compartment therebetween which can hold a polish. The first layer of polish impervious material is removed from the second layer of polish impervious material to expose the polish for application. After the polish is applied to the object, the second layer of polish impervious material is removed to expose the buffing mitt.
摘要翻译：一次性抛光施用和抛光手套，其包括多层手套，其具有可抛光地附着到可抛光的材料上的抛光不透水层，使得如果用于施用抛光剂，则可透过抛光剂的材料将污染使用者的手，但适于抛光抛光剂已被应用的对象。一次性抛光涂抹和抛光试剂盒，其包括多层手套和第一层不透光材料，其可移除地固定到第二层不透光材料上，在其间形成可容纳抛光剂的隔室。将第一层不透光材料从第二层不透光材料中取出，以露出抛光剂以供涂抹。将抛光剂施加到物体上之后，去除第二层不透光材料，露出抛光手套。

4. 发明授权

US06589101B2 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives 失效
标题翻译：用金属复合研磨剂对微电子基板进行机械和化学机械平面化的方法和装置
公开(公告)号：US06589101B2
公开(公告)日：2003-07-08
申请号：US10278554
申请日：2002-10-22
申请人： Gundu M. Sabde , Scott Meikle
发明人： Gundu M. Sabde , Scott Meikle
IPC分类号： B24B730
CPC分类号： B24B37/245 , B24B21/004 , B24B37/04 , B24D11/00 , H01L21/3212 , H01L21/7684 , Y10S977/777 , Y10S977/883 , Y10S977/888
摘要： A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a fixed abrasive polishing pad having metal abrasive elements selected to be a compound of metal in the substrate. Alternatively, the metal abrasive elements can include a refractory metal where the substrate includes a refractory metal. Where the substrate includes two metals, the abrasive elements can be selected to planarize the first metal at a rate that is less than, approximately twice the rate at which it planarizes the second metal. A single fixed abrasive polishing pad and a single planarizing liquid can be used to planarize both metals.
摘要翻译：一种用于平面化微电子衬底的方法和装置。在一个实施例中，该装置可以包括固定的研磨抛光垫，其具有被选择为在基底中的金属化合物的金属研磨元件。或者，金属研磨元件可以包括难熔金属，其中基底包括难熔金属。在衬底包括两种金属的情况下，可以选择研磨元件以使其平坦化第二金属的速率小于其平坦化速率的两倍的速率来平坦化第一金属。可以使用单个固定的研磨抛光垫和单个平坦化液体来平坦化两种金属。

5. 发明授权

US06217423B1 Apparatus and method for mirror surface grinding of magnetic disc substrate 失效
标题翻译：磁盘基板的镜面研磨装置及方法
公开(公告)号：US06217423B1
公开(公告)日：2001-04-17
申请号：US09310208
申请日：1999-05-12
申请人： Hitoshi Ohmori , Nobuhide Itoh , Junichi Uchino , Susumu Shimizu , Shinji Ishii , Manabu Yamada
发明人： Hitoshi Ohmori , Nobuhide Itoh , Junichi Uchino , Susumu Shimizu , Shinji Ishii , Manabu Yamada
IPC分类号： B24B730
CPC分类号： B24B37/08 , B24B7/22 , B24B37/04 , B24B53/001 , B24B53/017 , Y10S451/905
摘要： A metal bond grinding wheel 12 having a horizontal working surface 12a, a holding and rotating means 14 for a workpiece having a horizontal supporting surface 14a opposite to said working surface 12a, a voltage applying means 16 having the metal bond grinding wheels and an electrode 16a installed oppositely to the working surfaces in an uncontacted state and applying a pulsed voltage between them, a grinding fluid feeding means 18 for feeding an electroconductive grinding fluid to the working surfaces are installed. The holding and rotating means 14 holds and rotate a disk-like magnetic disc substrate 1 or a truing grinding wheel 2 to closely contact to its supporting surface, has constitution capable of moving horizontally and vertically, wherein a surface for working 12a is processed to yield a flat surface on the machine, subsequently, alternative operations on the machine are carried out for grinding of the supporting surface 14a of the holding and rotating means of the workpiece simultaneously with electrolytic dressing of the metal bond grinding wheel and grinding of the magnetic disc substrate 1 attached to the holding and rotating means of the workpiece.
摘要翻译：具有水平加工面12a的金属结合砂轮12，具有与工作面12a相对的水平支承面14a的工件的保持转动装置14，具有金属结合砂轮的电压施加装置16和电极16a 安装在非接触状态的工作表面上并且在它们之间施加脉冲电压，安装用于将导电研磨流体供给到工作表面的研磨液供给装置18。保持旋转装置14保持并旋转盘状磁盘基片1或修整砂轮2以与其支撑表面紧密接触，具有能够水平和垂直移动的结构，其中处理工作12a的表面以产生机器上的平坦表面，随后在机器上进行替代操作，用于在金属粘结砂轮的电解修整和磁盘基板的研磨的同时用于研磨工件的保持和旋转装置的支撑表面14a 1连接到工件的保持和旋转装置。

6. 发明授权

US06503125B1 Dust shroud for abrading machine 失效
标题翻译：研磨机用防尘罩
公开(公告)号：US06503125B1
公开(公告)日：2003-01-07
申请号：US09654639
申请日：2000-09-05
申请人： Raymond J. Harrington
发明人： Raymond J. Harrington
IPC分类号： B24B730
CPC分类号： B24B55/06
摘要： A dust shroud for use with a vacuum source and an abrading machine having a rotating abrading wheel includes a dust shroud housing adapted to be connected to the vacuum source and mounted to the abrading machine. The dust shroud housing includes a front wall with a front opening through which the abrading wheel may be accessed. A sliding door is slidably mounted to the front wall of the dust shroud housing for selectively covering the front opening.
摘要翻译：与真空源一起使用的防尘罩和具有旋转磨轮的研磨机包括适于连接到真空源并安装在研磨机上的防尘罩壳体。防尘罩壳体包括具有前开口的前壁，研磨轮可以通过该前开口被接近。滑动门可滑动地安装在防尘罩壳体的前壁上，用于选择性地覆盖前开口。

7. 发明授权

US06379224B1 Method of recovering optical disk substrate and optical disk substrate recovering apparatus 失效
标题翻译：光盘基板和光盘基板回收装置的回收方法
公开(公告)号：US06379224B1
公开(公告)日：2002-04-30
申请号：US09540868
申请日：2000-03-31
申请人： Tomoaki Ito
发明人： Tomoaki Ito
IPC分类号： B24B730
CPC分类号： G11B23/505 , B29B17/02 , B29K2705/00 , B29L2009/005 , B29L2017/00 , B29L2017/005 , Y02W30/622
摘要： An optical disk substrate recovering apparatus A includes an optical disk storing portion 10, an abrader 20 for abrading a reflecting layer and a recording layer of the optical disk D, a powder collecting device 30 for collecting powdered reflecting materials and recording materials, and an optical disk transferring device 40 for transferring the optical disk D from the optical disk storing portion 10 to the abrader 20 one by one and for transferring the abraded disk substrate 1 to the abraded disk substrate storing portion 50. The devices 20, 30, 40 are sequentially operated to thereby obtain a pure and transparent abraded disk substrate 1 made of synthetic resin from which the reflecting layer and the recording layer are removed.
摘要翻译：光盘基板回收装置A包括光盘存储部10，用于研磨反射层的研磨器20和光盘D的记录层，用于收集粉末状反射材料和记录材料的粉末收集装置30以及光学用于将光盘D从光盘存储部分10一个一个地传送到研磨器20的光盘传送装置40，并将磨损的盘基片1传送到研磨的盘基片存储部分50.装置20,30,40顺序地操作，从而获得由合成树脂制成的纯透明研磨盘基片1，其中去除了反射层和记录层。

8. 发明授权

US06206763B1 Deburring machine 失效
标题翻译：去毛刺机
公开(公告)号：US06206763B1
公开(公告)日：2001-03-27
申请号：US09274695
申请日：1999-03-23
申请人： Allen E. Mackall
发明人： Allen E. Mackall
IPC分类号： B24B730
CPC分类号： B24B29/005 , B24B9/007
摘要： A brush deburring machine includes upper and lower synchronized dogged conveyors that translate workpieces between a pair of cylindrical wire brushes to remove burrs from the ends of the workpieces. A first support surface is defined on each of the dogs of the upper conveyor, and a second support surface is defined on each of the dogs of the lower conveyor. Workpieces are retained between the first and second support surfaces to prevent the workpieces from becoming unstable and shifting diagonally between the wire brushes, yet are permitted to rotate with respect to the first and second support surfaces to cause the entire circumference of the ends of the workpieces to be deburred. A keyless bushing permits the upper conveyor to be infinitely adjustable between a minimum position and a maximum position with respect to the lower conveyor without interfering with the synchronization between the upper and lower conveyor, thus permitting the deburring machine to remove burrs from workpieces having different outer diameters. The workpieces are translated between wire brushes contained in a fixed head and an adjustable head, the adjustable head being adjustable to permit the deburring machine to remove the burrs from workpieces of different lengths.
摘要翻译：刷毛去毛刺机包括上下同步的带状输送机，其将工件在一对圆柱形丝刷之间转移，以从工件的端部移除毛刺。第一支撑表面被限定在上部输送机的每个狗上，并且第二支撑表面限定在下部输送机的每个狗上。工件被保持在第一和第二支撑表面之间以防止工件变得不稳定并且在钢丝刷之间对角地移动，但是允许工件相对于第一和第二支撑表面旋转以使工件的端部的整个周长被去除。无钥匙套管允许上部输送机相对于下部输送机在最小位置和最大位置之间无级调节，而不会干扰上部和下部输送机之间的同步，从而允许去毛刺机器从具有不同外部的工件上除去毛刺直径。工件在包含在固定头部和可调整头部中的线刷之间平移，该可调节头部是可调节的，以允许去毛刺机器从不同长度的工件移除毛刺。

9. 发明授权

US06805615B1 Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies 失效
标题翻译：用于微电子器件衬底组件的机械或化学机械平面化的平面化解决方案，平面化机器和方法
公开(公告)号：US06805615B1
公开(公告)日：2004-10-19
申请号：US09706493
申请日：2000-11-02
申请人： Karl M. Robinson , Scott G. Meikle
发明人： Karl M. Robinson , Scott G. Meikle
IPC分类号： B24B730
CPC分类号： B24B37/04 , B24B57/02 , H01L21/3212 , H01L21/7684
摘要： A method and apparatus for making and using slurries for planarizing microelectronic-device substrate assemblies in mechanical and/or chemical-mechanical planarization processes. In one aspect of the invention, a bi-modal slurry is fabricated by removing a first type of selected abrasive particles from a first abrasive particle solution to form a treated flow of the first solution. The treated flow of the first solution is then combined with a flow of a second solution having a plurality of second abrasive particles. The abrasive particles of the first type are accordingly removed from the first solution separately from the second solution such that the second abrasive particles in the second solution do not affect the removal of the abrasive particles of the first type from the first solution. In another aspect of the invention, a second type of selected abrasive particles are removed from the second solution prior to mixing with the first solution. Thus, by combining the treated flow of the first solution with either the treated or untreated flow of the second solution, a single flow of an abrasive slurry is produced having a first distribution of the first abrasive particles about a first mode and a second distribution of the second abrasive particles about a second mode.
摘要翻译：一种在机械和/或化学机械平面化工艺中制造和使用用于平坦化微电子器件衬底组件的浆料的方法和设备。在本发明的一个方面，通过从第一磨料颗粒溶液中除去第一类型的选定的磨料颗粒以形成第一溶液的处理流程来制造双模态浆料。然后将第一溶液的处理流体与具有多个第二磨料颗粒的第二溶液流合并。因此，第一类型的磨料颗粒与第二溶液分离地从第一溶液中除去，使得第二溶液中的第二磨料颗粒不影响从第一溶液中去除第一类型的磨料颗粒。在本发明的另一方面，在与第一溶液混合之前，从第二溶液中除去第二类型的选定磨料颗粒。因此，通过将处理过的第一溶液的流与第二溶液的处理流或未经处理的流组合，产生单流磨料浆料，其具有第一分散的第一研磨颗粒约第一模式，第二分布为关于第二模式的第二磨料颗粒。

10. 发明授权

US06568993B1 Fixture for clamping a gas turbine component and its use in shaping the gas turbine component 失效
标题翻译：用于夹紧燃气轮机部件的夹具及其在成形燃气轮机部件中的用途
公开(公告)号：US06568993B1
公开(公告)日：2003-05-27
申请号：US10015259
申请日：2001-12-13
申请人： Daniel Edward Jones , Jacques Juneau, Jr.
发明人： Daniel Edward Jones , Jacques Juneau, Jr.
IPC分类号： B24B730
CPC分类号： B23Q3/063 , B25B5/061 , B25B5/14
摘要： A turbine component such as a turbine blade is clamped into a fixture having a base upon which a remainder of the fixture is supported and a stop which limits the movement of the turbine component. The fixture further has two clamp arms affixed to the base and which controllably clamp against one pair of the pressure surfaces of the root to force the turbine component against the stop, which preferably is contacted by another pair of the pressure surfaces of the root. When the turbine component is clamped in this position, its root may be readily shaped as by grinding.
摘要翻译：诸如涡轮机叶片的涡轮机部件被夹紧到具有基座的固定装置中，固定装置的其余部分在该基座上被支撑，并且限制了涡轮机部件的移动。固定装置还具有固定在基座上的两个夹臂，并且可控制地夹紧根部的一对压力表面，以迫使涡轮机部件抵靠止动件，该止动件优选地与根部的另一对压力表面相接触。当涡轮机部件被夹紧在该位置时，其根部可以通过研磨而容易地成形。

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