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1. 发明授权

CN101623867B 一种使机器人高精度跟踪指定路径的设备和方法失效许可
公开(公告)号：CN101623867B
公开(公告)日：2010-12-01
申请号：CN200810012274.7
申请日：2008-07-11
申请人：中国科学院沈阳自动化研究所
发明人：罗振军 , 王琛元 , 贺云 , 姜春英 , 邹媛媛 , 田永利
IPC分类号： B25J9/10 , B25J9/22 , B25J19/02
CPC分类号： B25J9/1684 , B23K26/0884 , G05B2219/36405 , G05B2219/36407 , G05B2219/4705
摘要：本发明涉及一种使机器人高精度跟踪指定路径的设备和方法，是一种综合利用同轴视觉传感系统和焊缝位置测量传感系统来进行路径跟踪和偏差补偿的机器人加工系统和路径跟踪方法，用于激光焊接等高精度加工。将实施过程分成三个阶段；前两个阶段综合利用焊缝位置测量信息和同轴视觉测量信息计算前方焊缝位置和机器人工具中心点与焊缝之间的偏差，获得机器人工具中心点轨迹偏差的补偿数据和焊缝位置参考数据；实际焊接阶段利用焊缝位置测量信息和焊缝位置参考数据进行跟踪与补偿控制，通过位置修正装置修正机器人系统的运动，使机器人工具中心点沿着指定路径连续前进，且与指定路径的偏差小于机器人的路径重复精度。本发明可以广泛用于各种需要提高机器人运动路径精度的场合。

2. 发明公开

CN101623867A 一种使机器人高精度跟踪指定路径的设备和方法失效许可
公开(公告)号：CN101623867A
公开(公告)日：2010-01-13
申请号：CN200810012274.7
申请日：2008-07-11
申请人：中国科学院沈阳自动化研究所
发明人：罗振军 , 王琛元 , 贺云 , 姜春英 , 邹媛媛 , 田永利
IPC分类号： B25J9/10 , B25J9/22 , B25J19/02
CPC分类号： B25J9/1684 , B23K26/0884 , G05B2219/36405 , G05B2219/36407 , G05B2219/4705
摘要：本发明涉及一种使机器人高精度跟踪指定路径的设备和方法，是一种综合利用同轴视觉传感系统和焊缝位置测量传感系统来进行路径跟踪和偏差补偿的机器人加工系统和路径跟踪方法，用于激光焊接等高精度加工。将实施过程分成三个阶段；前两个阶段综合利用焊缝位置测量信息和同轴视觉测量信息计算前方焊缝位置和机器人工具中心点与焊缝之间的偏差，获得机器人工具中心点轨迹偏差的补偿数据和焊缝位置参考数据；实际焊接阶段利用焊缝位置测量信息和焊缝位置参考数据进行跟踪与补偿控制，通过位置修正装置修正机器人系统的运动，使机器人工具中心点沿着指定路径连续前进，且与指定路径的偏差小于机器人的路径重复精度。本发明可以广泛用于各种需要提高机器人运动路径精度的场合。

3. 发明授权

US5483138A System and method for automated positioning of a substrate in a processing chamber 失效
标题翻译：用于在处理室中自动定位衬底的系统和方法
公开(公告)号：US5483138A
公开(公告)日：1996-01-09
申请号：US249095
申请日：1994-04-21
申请人： Simon Shmookler , Andrew G. Weinberg , Martin J. McGrath
发明人： Simon Shmookler , Andrew G. Weinberg , Martin J. McGrath
IPC分类号： B25J9/10 , B25J9/22 , G05D3/00 , H01L21/00 , H01L21/68 , G05B11/01
CPC分类号： H01L21/67259 , H01L21/681 , G05B2219/36405 , G05B2219/37283 , G05B2219/37608 , G05B2219/45031 , G05B2219/49299 , G05B2219/50151
摘要： An improved position control means for robotic handling systems; particularly, a system and method for determining the centerpoint of a moving object, such as a semiconductor wafer, and calibration of the object support, using an array of sensors positioned generally transverse to the arcuate path of movement of the object and its support to detect the relative positions of the object and the support to a selected destination point for the purpose of precisely positioning the object relative to the selected destination point.
摘要翻译：一种用于机器人处理系统的改进的位置控制装置; 特别地，使用传感器阵列来确定诸如半导体晶片的运动物体的中心点以及对象支架的校准的系统和方法，所述传感器阵列大致横向于物体及其支撑件的弓形运动路径，以检测为了精确地定位对象相对于所选择的目的地点，目标和支持对所选择的目的地点的相对位置。

4. 发明授权

US5570187A Weld-position detector provided with an optical axis adjustment means and used with a robot welding machine 失效
标题翻译：焊接位置检测器，配有光轴调整装置，与机器人焊接机一起使用
公开(公告)号：US5570187A
公开(公告)日：1996-10-29
申请号：US603181
申请日：1996-02-20
申请人： Ryo Nihei , Yasuo Sasaki , Takahiro Hase
发明人： Ryo Nihei , Yasuo Sasaki , Takahiro Hase
IPC分类号： G01B11/26 , B23K9/095 , B23K9/127 , B23Q35/128 , B25J19/02 , G01B11/24
CPC分类号： B23K9/0956 , B23Q35/128 , G05B2219/36405 , G05B2219/4719
摘要： A weld-position detector, attached to an automatic welding machine such as a welding robot, having three independently produced indispensable units, i.e., a laser-beam projecting unit for projecting a detection laser-beam, a scanning unit for directing the detection laser-beam towards weld portions of a workpiece and scanning the detection laser-beam across the welded portions, and a light-receiving unit for detecting the detection laser-beam reflected by the workpiece to thereby detect the position of the weld portions. The weld-position detector further having a fixture provided with reference faces on which the three independent units are accurately mounted. The scanning means having a movable reflecting mirror is provided with an optical axis adjusting unit for adjusting the position and the posture of the scanning unit so as to adjust the optical axis of the detection laser-beam until the optical axis of the detection laser-beam, after being reflected from the workpiece, arrives at the light-receiving unit.
摘要翻译：焊接位置检测器，其安装在自动焊接机例如焊接机器人上，具有三个独立生产的不可缺少的单元，即用于投射检测激光束的激光束投射单元，用于引导检测激光束的扫描单元，射束到工件的焊接部分并扫描焊接部分上的检测激光束;以及光接收单元，用于检测由工件反射的检测激光束，从而检测焊接部分的位置。焊接位置检测器还具有设置有参考面的固定装置，三个独立的单元精确地安装在基准面上。具有可移动反射镜的扫描装置设置有用于调节扫描单元的位置和姿势的光轴调节单元，以便将检测激光束的光轴调节到检测激光束的光轴在从工件反射之后到达光接收单元。

5. 发明授权

US5563798A Wafer positioning system 失效
标题翻译：晶圆定位系统
公开(公告)号：US5563798A
公开(公告)日：1996-10-08
申请号：US224622
申请日：1994-04-05
申请人： Lloyd M. Berken , Frederik W. Freerks , William H. Jarvi , Hatice Sahin
发明人： Lloyd M. Berken , Frederik W. Freerks , William H. Jarvi , Hatice Sahin
IPC分类号： G05B19/402 , H01L21/68 , G05B11/01
CPC分类号： H01L21/681 , G05B19/402 , G05B2219/36405 , G05B2219/37286 , G05B2219/37608 , G05B2219/45026 , G05B2219/50151 , Y10S414/135
摘要： A wafer positioning system determines the position of a wafer during processing by monitoring the position of the wafer transport robot as the robot transports the wafer by one or more position sensors. The wafer positioning system incorporates a transparent cover on the surface of the wafer handling chamber and two optical position sensors disposed on the surface of the transparent cover. The position sensors direct light through the wafer handling chamber to reflectors near the floor of the chamber which reflect the light back to the position sensors. A detector within the position sensor detects when the beam path from the position sensor to the reflector is uninterrupted. As wafers are transported through the chamber, the edge of the transported wafer interrupts the position sensor beam path causing the output of the position sensor to switch states. When the position sensor output switches, the position of the wafer transport robot is measured. At least two data points are measured to establish the wafer position. If the wafer is not at its nominal position, the position of the wafer transport robot is adjusted to compensate for the wafer misalignment.
摘要翻译：晶片定位系统通过在机器人通过一个或多个位置传感器传送晶片时监视晶片传送机器人的位置来确定处理期间晶片的位置。晶片定位系统在晶片处理室的表面上并入透明盖，并设置在透明盖表面上的两个光学位置传感器。位置传感器将光通过晶片处理室引导到室内地板附近的反射器，反射器将光反射回位置传感器。位置传感器内的检测器检测何时从位置传感器到反射镜的光束路径不间断。当晶片被输送通过腔室时，输送的晶片的边缘中断位置传感器光束路径，导致位置传感器的输出切换状态。当位置传感器输出切换时，测量晶片传送机器人的位置。测量至少两个数据点以建立晶片位置。如果晶片不在其标称位置，则调整晶片传送机器人的位置以补偿晶片未对准。

6. 发明授权

US06198976B1 On the fly center-finding during substrate handling in a processing system 失效
标题翻译：在处理系统中的基板处理期间的飞行中心查找
公开(公告)号：US06198976B1
公开(公告)日：2001-03-06
申请号：US09034808
申请日：1998-03-04
申请人： Satish Sundar , Peter F. Ebbing
发明人： Satish Sundar , Peter F. Ebbing
IPC分类号： G05B1918
CPC分类号： H01L21/681 , G05B2219/36405 , G05B2219/37283 , G05B2219/37608 , G05B2219/45031 , G05B2219/49299 , G05B2219/50151
摘要： A substrate center-finding method and apparatus, for determining the center of a substrate being passed through a substrate handling chamber of a substrate processing system, includes any number of sensors arranged in any configuration and permits the substrate to pass through any trajectory that triggers the sensors. The locations of the sensors are calibrated by homing in on the sensors using a point, the reference point, near the tip of an arm assembly on a substrate handler. The substrate handler has an encoder for sensing the pivot angles of links in the arm assembly, whereby the coordinates of the reference point can be calculated from the angles and lengths of the links. When the substrate triggers a sensor, the location of the reference point is again calculated, and the coordinates of the trigger point on the edge of the substrate is determined relative to the reference point. A suitable number of trigger points on the edge of a circular substrate will define a circle, so the center of the circle can be calculated, and the location of the substrate can be adjusted to account for any offset from the reference point.
摘要翻译：用于确定通过衬底处理系统的衬底处理室的衬底的中心的衬底中心测定方法和装置包括以任何构造布置的任何数量的传感器，并允许衬底通过任何触发器件的轨迹传感器。传感器的位置通过使用在基板处理器上的臂组件的尖端附近的点（参考点）归位在传感器上来校准。衬底处理器具有用于感测臂组件中的链节的枢转角度的编码器，由此可以根据链节的角度和长度来计算参考点的坐标。当基板触发传感器时，再次计算参考点的位置，并且相对于参考点确定基板边缘上的触发点的坐标。在圆形基板的边缘上的合适数量的触发点将限定圆形，因此可以计算圆的中心，并且可以调整基板的位置以考虑到与参考点的任何偏移。

7. 发明授权

US5570458A Manipulator tracking apparatus and method for accurately tracking a path for sensors in low reliability conditions 失效
标题翻译：用于在低可靠性条件下精确跟踪传感器路径的操纵器跟踪装置和方法
公开(公告)号：US5570458A
公开(公告)日：1996-10-29
申请号：US411996
申请日：1995-03-28
申请人： Akira Umeno , Kiyoshi Nonaka , Takao Kakizaki
发明人： Akira Umeno , Kiyoshi Nonaka , Takao Kakizaki
IPC分类号： B25J9/10 , B25J9/18 , B25J13/08 , G05B19/42 , G05B19/425 , G05B19/04
CPC分类号： G05B19/425 , G05B2219/33263 , G05B2219/36405 , G05B2219/37425 , G05B2219/37522 , G05B2219/37525 , G05B2219/45104
摘要： A tracking apparatus and method for controlling the position and movement of a manipulator which holds an effector. An actual work path drawn on a workpiece is detected by a sensor. Predetermined taught path data is amended according to the detected work path, and the effector held by the manipulator is drawn to exactly track the work path on the workpiece. The effector is controlled so that the effector tracks the work path accurately even under conditions when detection data from the sensor has low reliability or contains errors.
摘要翻译：一种用于控制保持效应器的操纵器的位置和运动的跟踪装置和方法。通过传感器检测在工件上绘制的实际工作路径。根据检测到的工作路径修改预定的教导路径数据，并且绘制由操纵器保持的效应器以精确地跟踪工件上的工作路径。控制效应器使得即使在来自传感器的检测数据具有低可靠性或包含误差的情况下，效应器也能准确地跟踪工作路径。

8. 发明申请

WO2010003289A1 一种使机器人高精度跟踪指定路径的设备和方法审中-公开
公开(公告)号：WO2010003289A1
公开(公告)日：2010-01-14
申请号：PCT/CN2008/071687
申请日：2008-07-18
申请人：中国科学院沈阳自动化研究所 , 罗振军 , 王琛元 , 贺云 , 姜春英 , 邹媛媛 , 田永利
发明人：罗振军 , 王琛元 , 贺云 , 姜春英 , 邹媛媛 , 田永利
IPC分类号： B23K26/24 , B25J19/00 , B25J9/10
CPC分类号： B25J9/1684 , B23K26/0884 , G05B2219/36405 , G05B2219/36407 , G05B2219/4705

9. 发明申请

WO1994027199A1 METHOD AND APPARATUS FOR CONTROLLING ROBOT HAVING SENSOR 审中-公开
标题翻译：用于控制具有传感器的机器人的方法和装置
公开(公告)号：WO1994027199A1
公开(公告)日：1994-11-24
申请号：PCT/JP1994000762
申请日：1994-05-11
申请人： KOSAKA, Tetsuya , KOBAYASHI, Eiichi
IPC分类号： G05B19/42
CPC分类号： B23Q35/128 , B25J9/1684 , G05B2219/36405 , G05B2219/45104
摘要： The position of work contour is detected by a sensor. A real-time tracking on the work contour is executed by utilizing the output signals from the sensor for the correction of the path instructed to follow. The positional sensing for the welding contour in forward areas of a robot is executed by the sensor held by a robot hand in order to obtain the positional data on the sensing point kSm. The sensing data are transformed into the coordinate data s (k, m) for the coordinate system of the workpiece, and then, processed by use of the data on the zone Pk Pk+1 of the instructed path to which the sensing point kSm belongs. The data thus processed are stored in a buffer memory of a ring memory type together with the coordinate data on the sensing point. Immediately before the execution of the tracking, the required data are read from the buffer memory to obtain the target point of a tracking in a short period of time. The amounts of correction for the interpolating points and instructed points are calculated for the generation of the output for controlling each of the shafts, and transferred to a servocontrol system in order to allow the robot to move toward the target point of the tracking.
摘要翻译：工件轮廓的位置由传感器检测。通过利用传感器的输出信号来执行对工作轮廓的实时跟踪，以校正指示的路径。机器人前方区域的焊接轮廓的位置检测由机器人手持有的传感器执行，以便获得检测点kSm上的位置数据。将感测数据变换为工件的坐标系的坐标数据s（k，m），然后通过使用感测点kSm所属的指示路径的区域Pk Pk + 1上的数据进行处理。这样处理的数据与检测点上的坐标数据一起存储在环形存储器类型的缓冲存储器中。在执行跟踪之前，从缓冲存储器读取所需数据，以在短时间内获得跟踪的目标点。计算内插点和指示点的校正量，用于生成用于控制每个轴的输出，并且传送到伺服控制系统以允许机器人朝向跟踪的目标点移动。

10. 发明公开

EP1102311A3 Method of and apparatus for dynamic alignment of substrates 有权
标题翻译：用于基材的动态调整的方法和装置
公开(公告)号：EP1102311A3
公开(公告)日：2004-09-15
申请号：EP00310351.2
申请日：2000-11-22
申请人： LAM RESEARCH CORPORATION
发明人： Mooring, Benjamin W. , Freund, Charles W.
IPC分类号： H01L21/00
CPC分类号： G05B19/401 , G05B19/4083 , G05B2219/36405 , G05B2219/37283 , G05B2219/37512 , G05B2219/45031 , G05B2219/49299 , H01L21/681 , H01L21/682
摘要： A wafer is transported on a blade of a robot and along a path through a port and into a module of semiconductor manufacturing equipment. The port has a transverse axis that intersects the path. Dynamic alignment determines the position of the center of the wafer with respect to the center of the blade as the wafer is transported, and uses two through-beam sensors positioned along the transverse axis according to latency characteristics of the sensors. The positioning of the sensors assures that the moving wafer will break or make a beam of a first of the sensors and that the first sensor will generate a first transition signal before the moving wafer will break or make a beam of a second of the sensors and before the second sensor generates a second transition signal. The dynamic alignment may be performed with respect to wafers having different sizes. One of the sensors is positioned for operations with respect to both sizes of wafers, whereas the second of the sensors operates and is positioned along the transverse axis for only one size wafer, and a third of the sensors operates and is positioned along the transverse axis for only the other size wafer. Three sensors may be provided for the port at each facet of each module of the semiconductor equipment. Logic circuitry processes the transition signals from appropriate ones of the sensors to identify the particular one of the ports through which the wafer is being transported. The detected position information (e.g., having possible misalignment) is then used by the robot when the wafer is subsequently positioned into a given chamber. The subsequent positioning therefore compensates for any misalignment and ensures accurately placed wafers.

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