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    • 5. 发明专利
    • DE2505278C3
    • 1987-01-22
    • DE2505278
    • 1975-02-07
    • TOAGOSEI CHEMICAL INDUSTRY CO., LTD., TOKIO/TOKYO, JP
    • MATSUBARA, TAKASHITAKEUCHI, JUKOHIROSE, TOSHIRO, NAGOYA, AICHI, JP
    • C09D161/06C09J5/02C09J163/02B32B15/08B32B27/42C09D3/56
    • A coated steel plate suitable for bonding with a polyamide adhesive comprising a steel plate having coated thereon (a) a composition comprising a thermosetting phenol resin and a bisphenol A type epoxy resin, the thermosetting phenol resin comprising the condensation product obtained on reacting under refluxing a phenol and formaldehyde in less than one mol per equivalent of the phenolic hydroxyl group in the presence of an alkali catalyst; (b) a composition comprising a thermosetting phenol resin and a bisphenol A type epoxy resin, the thermosetting phenol resin comprising the condensation product obtained by washing with water the condensation product obtained by reacting under refluxing a phenol and formaldehyde in less than one mol per equivalent of the phenolic hydroxyl group in the presence of an alkali catalyst and then heating the condensation product to temperatures above about 60 DEG C; (c) a composition comprising a thermosetting phenol resin and a bisphenol A type epoxy resin, the thermosetting phenol resin comprising the condensation product obtained by washing with water a condensation product obtained by reacting a phenol and formaldehyde in an amount more than about one mol per equivalent of the phenolic hydroxyl group under refluxing in the presence of an alkali catalyst and, then, further heating the condensation product to a temperature higher than about 60 DEG C with the addition of a phenol in an amount such that the total amount of the phenolic hydroxyl group is greater than one equivalent per mol of formaldehyde; or (d) mixtures thereof.