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1. 发明公开

KR20180020685A 발광 다이오드 패키지 및 그것을 제조하는 방법 审中-公开
标题翻译：发光二极管封装及其制造方法
公开(公告)号：KR20180020685A
公开(公告)日：2018-02-28
申请号：KR20160105403
申请日：2016-08-19
申请人： SEOUL SEMICONDUCTOR CO LTD
发明人： PARK BYOUNG KYU , NEI MASAMI , YOU JONG KYUN
IPC分类号： H01L33/48 , H01L33/50 , H01L33/52 , H01L33/62
CPC分类号： H01L33/48 , F21S41/141 , F21W2102/00 , F21Y2101/00 , H01L33/486 , H01L33/502 , H01L33/505 , H01L33/52 , H01L33/62 , H01L2924/12041
摘要： 발광다이오드패키지가제공된다. 일실시예에따른발광다이오드패키지는, 제1 전극및 제2 전극을갖는베이스기판; 베이스기판상에배치되고, 발광다이오드를실장하기위한제1 캐비티를정의하는측벽을갖는하우징; 제1 캐비티내에실장되어제1 및제2 전극에전기적으로접속된발광다이오드; 및발광다이오드의상면에배치된파장변환판을포함한다.
摘要翻译：提供发光二极管封装。根据一个实施例，发光二极管封装包括：具有第一电极和第二电极的基础衬底; 设置在所述基底基板上并具有限定用于安装所述发光二极管的第一空腔的侧壁的外壳; 发光二极管，安装在第一腔体中并电连接到第一和第二电极; 以及设置在发光二极管的上表面上的波长转换板。

2. 发明公开

KR20180018938A 차량 헤드램프 및 차량 헤드램프 시스템 审中-公开
标题翻译：车辆前大灯和车辆前大灯系统
公开(公告)号：KR20180018938A
公开(公告)日：2018-02-22
申请号：KR20160102333
申请日：2016-08-11
申请人： SEOUL SEMICONDUCTOR CO LTD
发明人： LEE CHUNG HOON , JEONG YOUNG
IPC分类号： F21V23/04
CPC分类号： F21S41/645 , F21S41/63 , F21S41/141 , F21S41/24 , F21S45/33 , F21V23/0442 , F21W2102/00 , F21Y2101/00
摘要： 차량헤드램프및 차량헤드램프시스템이제공된다. 이차량헤드램프시스템은, 광을생성하는광원부; 광원부로부터전달된광을조절하기위한광 조절부; 대상물체를감지하여감지신호를생성하는센싱부; 센싱부의감지신호에기초하여제어신호를생성하는제어부; 및제어부의제어신호에따라광 조절부를구동하는구동회로부를포함하고, 광조절부는광원부로부터전달된광의진행방향, 휘도또는온-오프를조절한다. 이에따라, 광원의개수를과도하게증가시키지않고도상향등자동전환기술을적용할수 있는차량헤드램프시스템이제공될수 있다.
摘要翻译：提供车辆前照灯和车辆前照灯系统。辅助前照灯系统包括：用于产生光的光源部分; 一种用于调节从光源传输的光的调光器; 感测单元，用于感测目标物体以产生感测信号; 控制单元，用于基于感测单元的感测信号产生控制信号; 以及驱动电路单元，用于根据控制单元的控制信号来驱动光控制单元，并且光控制单元调节从光源单元发送的光的行进方向，亮度或开关。因此，可以提供可应用于自动上转换技术的车辆前照灯系统，而不会过度增加光源的数量。

3. 发明公开

KR20180017751A 발광 다이오드 패키지 및 발광 다이오드 모듈 审中-公开
标题翻译：发光二极管封装和发光二极管模块
公开(公告)号：KR20180017751A
公开(公告)日：2018-02-21
申请号：KR20160102059
申请日：2016-08-10
申请人： SEOUL SEMICONDUCTOR CO LTD
发明人： HAN BO YONG
IPC分类号： H01L33/50 , H01L25/075 , H01L33/06
摘要： 발광다이오드패키지및 발광다이오드모듈이제공된다. 일실시예에따른발광다이오드패키지는, 제1 발광다이오드칩; 상기제1 발광다이오드칩에서방출된광을파장변환하는제1 파장변환부; 제2 발광다이오드칩; 및상기제2 발광다이오드칩에서방출된광을파장변환하는제2 파장변환부;를포함하고, 상기제1 파장변환부는상기제2 파장변환부에비해짧은피크파장을가지는광을방출하며, 상기제1 파장변환부에서방출된광의상기제2 파장변환부로의입사가차단되는, 발광다이오드패키지를제공한다. 본발명의일 실시예에따르면, 서로다른종류의형광체에의한간섭을방지하여, 발광다이오드칩에서방출되는빛의에너지변환효율을증가시키며백색발광다이오드패키지의시감도를향상시켜발광효율을향상시킬수 있다.
摘要翻译：提供了一种发光二极管封装和一种发光二极管模块。根据实施例的发光二极管封装包括第一发光二极管芯片; 第一波长转换器，用于波长转换从第一发光二极管芯片发射的光; 第二发光二极管芯片; 以及第二波长转换器，用于对从第二LED芯片发射的光进行波长转换，其中第一波长转换器发射具有比第二波长转换器短的峰值波长的光，并且从第一波长转换器发射到第二波长转换器中的光的入射被切断。在根据本发明的一个实施例中，彼此以避免干扰由其它种类的荧光体，提高从LED芯片发射的光的能量转换效率，以提高白光发光器件封装件的可见性可以提高发光效率。

4. 发明公开

KR20150101440A Light emitting diode 审中-公开
标题翻译：发光二极管
公开(公告)号：KR20150101440A
公开(公告)日：2015-09-03
申请号：KR20150115439
申请日：2015-08-17
申请人： SEOUL SEMICONDUCTOR CO LTD
发明人： KIM HYUCK JUN
IPC分类号： G03B15/03 , G03B33/06 , H01L27/146 , H01L33/48 , H04N5/225
摘要： 본 발명에 따르면, 카메라용 플래시 발광 다이오드로서,
카메라 또는 결상기기내 이미지 센서의 분광 감도(spectral sensitivity)와 매칭되는 분광 출력 분포(spectral power distribution; SPD)를 갖는 발광 다이오드가 개시된다.
摘要翻译：本发明涉及一种用于相机的闪光发光二极管。公开了一种具有与成像装置或照相机内的图像传感器的光谱灵敏度相匹配的光谱功率分布（SPD）的发光二极管。

5. 发明公开

KR20150051966A 모바일 단말기의 ＬＥＤ 플래쉬 모듈 审中-公开
标题翻译：移动终端中的LED闪光模块
公开(公告)号：KR20150051966A
公开(公告)日：2015-05-13
申请号：KR20150056262
申请日：2015-04-22
申请人： SEOUL SEMICONDUCTOR CO LTD
发明人： CHO JAE HO , KIM SEONG HEON , KIM BANG HYUN
IPC分类号： H01L33/00 , G03B15/05
摘要： 여기에서는, 케이싱의내측에메인보드를갖는모바일단말기의내부에설치되는 LED 플래쉬모듈이개시된다. 개시된 LED 플래쉬모듈은, 제 1 인쇄회로기판및 상기제 1 인쇄회로기판의상면에장착되는 LED를갖는발광유닛과; 상기메인보드와분리가능하게접속되는커넥터단자및 상기커넥터단자가장착되는제 2 인쇄회로기판을갖는커넥터유닛과; 상기제 1 인쇄회로기판과상기제 2 인쇄회로기판을연결하는연성회로기판을포함한다.
摘要翻译：公开了一种LED闪光灯模块，其安装在具有壳体内的主板的移动终端内部。 LED闪光灯模块包括：具有第一印刷电路板和安装在第一印刷电路板上的LED的发光单元; 连接器单元，具有可拆卸地连接到主板的连接器端子和其上安装有连接器端子的第二印刷电路板; 以及用于连接第一印刷电路板和第二印刷电路板的柔性电路板。

6. 发明公开

KR20120068788A Led package 审中-公开
标题翻译： LED封装
公开(公告)号：KR20120068788A
公开(公告)日：2012-06-27
申请号：KR20120051010
申请日：2012-05-14
申请人： SEOUL SEMICONDUCTOR CO LTD
发明人： CHO WEON , JUNG CHAN SUNG
IPC分类号： H01L33/48 , H01L33/50 , H01L33/54
CPC分类号： H01L33/502 , H01L25/0753 , H01L33/505 , H01L33/54 , H01L33/56
摘要： PURPOSE: An LED package is provided to minimize a light loss by including a partition unit with light transmittance which limits an area around a wavelength converting unit near an LED chip. CONSTITUTION: An LED chip is mounted on a base unit. A partition unit(20) is formed on the base unit to surround the LED chip. A wavelength converting unit(30) includes fluorescent substances and is formed in the partition unit to cover the LED chip. The partition unit transmits a part of light from the wavelength converting unit. A sealing unit(40) is formed on the base unit to cover the partition unit and the wavelength converting unit.
摘要翻译：目的：提供LED封装以通过包括具有限制在LED芯片附近的波长转换单元周围的区域的透光率的分隔单元来最小化光损失。构成：LED芯片安装在基座上。分隔单元（20）形成在基座单元上以围绕LED芯片。波长转换单元（30）包括荧光物质，并且形成在分隔单元中以覆盖LED芯片。分隔单元透射来自波长转换单元的一部分光。密封单元（40）形成在基座单元上以覆盖分隔单元和波长转换单元。

7. 发明公开

KR20120000814A Light emitting diode package and method for fabricating the same 审中-公开
标题翻译：发光二极管封装及其制造方法
公开(公告)号：KR20120000814A
公开(公告)日：2012-01-04
申请号：KR20100061281
申请日：2010-06-28
申请人： SEOUL SEMICONDUCTOR CO LTD
发明人： OH KWANG YONG
IPC分类号： H01L33/52 , H01L33/48
CPC分类号： H01L33/54 , H01L33/20 , H01L33/50 , H01L33/62 , H01L2924/12041 , H01L2933/0033 , H01L2933/005
摘要： PURPOSE: An LED package and a manufacturing method thereof are provided to improve the problem a structure in which a first molding part is formed through a first resin injection port and a second molding part is formed through a second resin injection port. CONSTITUTION: A lead frame(22) is electrically connected to an LED chip. A cavity(211) equipped with one or more level differences(212) is formed in the inner wall of housing(21). The cavity comprises a first cavity(211a) which accepts the LED chip and a second cavity(211b) which is wider than the first cavity. Resin gates(213a-213d) which are connected to the cavity are formed in the lower side of the level difference. A plurality of molding units(25,26) is formed within the cavity by resin which is injected through the resin gate.
摘要翻译：目的：提供一种LED封装及其制造方法，以通过第一树脂注入口形成第一成型部，通过第二树脂注入口形成第二成型部的结构。构成：引线框架（22）电连接到LED芯片。在壳体（21）的内壁上形成配备有一个或多个水平差（212）的空腔（211）。空腔包括接受LED芯片的第一空腔（211a）和比第一空腔宽的第二空腔（211b）。连接到空腔的树脂门（213a-213d）形成在电平差的下侧。多个模制单元（25,26）通过树脂浇注在树脂浇口中的树脂形成在空腔内。

8. 发明公开

KR20120000813A Optical semiconductor device 审中-公开
标题翻译：光学半导体器件
公开(公告)号：KR20120000813A
公开(公告)日：2012-01-04
申请号：KR20100061280
申请日：2010-06-28
申请人： SEOUL SEMICONDUCTOR CO LTD
发明人： HAN JEONG A , KIM KUN YUL
IPC分类号： H01L33/58 , H01L33/48
CPC分类号： H01L33/58 , H01L33/483 , H01L33/50 , H01L33/52
摘要： PURPOSE: An optical semiconductor device is provided to prevent the degradation of a fluorescent substance due to by a heat by separately installing the fluorescent substance from an optical semiconductor. CONSTITUTION: An optical semiconductor is connected to a mounting part(21). The mounting part comprises a cavity(211) which exposes the optical semiconductor in the upper center. An optical device(23) is formed in order to cover the optical semiconductor. The encapsulating material(24) of a light-transmission material is formed within the cavity in order to protect the optical device from outside. The encapsulating material contains one and more fluorescent substances. A depression part is dented on the bottom surface of the cavity. The optical semiconductor is mounted within the depression part.
摘要翻译：目的：提供一种光学半导体器件，用于通过从光学半导体分开安装荧光物质来防止由于热而引起的荧光物质的劣化。构成：将光学半导体连接到安装部（21）。安装部分包括在上部中心露出光学半导体的空腔（211）。形成光学器件（23）以覆盖光学半导体。透光材料的封装材料（24）形成在空腔内，以保护光学器件免受外界的影响。封装材料含有一种或多种荧光物质。凹陷部分凹陷在腔的底表面上。光学半导体安装在凹陷部分内。

9. 发明公开

KR20100030805A Multi-chip light emitting diode package 有权
标题翻译：多芯片发光二极管封装
公开(公告)号：KR20100030805A
公开(公告)日：2010-03-19
申请号：KR20080089703
申请日：2008-09-11
申请人： SEOUL SEMICONDUCTOR CO LTD
发明人： JUNG JUNG HWA
IPC分类号： H01L33/48 , H01L33/58
CPC分类号： H01L2224/48091 , H01L2924/00014
摘要： PURPOSE: A multichip light emitting diode package is provided to implement white light with various color temperatures and the light with various colors and improve a radiation property of a light emitting diode package using ceramic, metal, metal alloy, or a substrate made of a semiconductor material with high thermal conductivity. CONSTITUTION: A substrate(10) has bonding pads which are electrically insulated. A separator(20) is attached on the substrate and includes a plurality of cavities. A light emitting diode chip(41,43) is mounted on the substrate corresponding to each cavity. A molding unit(51,53) covers the light emitting diode chips inside the cavity. A fluorescent material is positioned on one of cavities or inside the cavity.
摘要翻译：目的：提供多芯片发光二极管封装以实现具有各种色温的白光和具有各种颜色的光，并且使用陶瓷，金属，金属合金或由半导体制成的衬底提高发光二极管封装的辐射性能材料具有高导热性。构成：衬底（10）具有电绝缘的焊盘。分离器（20）附接在基板上并且包括多个空腔。发光二极管芯片（41,43）安装在对应于每个空腔的基板上。模制单元（51,53）覆盖空腔内的发光二极管芯片。荧光材料位于空腔之一或腔内。

10. 发明公开

KR20100003000A LIGHT EMITTING DIODE PACKAGE HAVING MULTI-FACE LEAD TERMINAL AND LEAD FRAME STRUCTURE FOR SURFACE MOUNT THEREOF 有权
标题翻译：具有多面引线端子的发光二极管封装及其表面安装的引线框架结构
公开(公告)号：KR20100003000A
公开(公告)日：2010-01-07
申请号：KR20080063078
申请日：2008-06-30
申请人： SEOUL SEMICONDUCTOR CO LTD
发明人： PARK KWANG IL
IPC分类号： H01L33/62
CPC分类号： H01L2224/45 , H01L2224/45139 , H01L2224/48247 , H01L2924/12041 , H01L2924/00014 , H01L2924/00
摘要： PURPOSE: An LED package and lead frame structure is provided to multiply the surface area of the lead terminals while enhancing the degree of freedom rule toward the light emitting direction of the LED chip. CONSTITUTION: The lead frame structure comprises the first and second lead frames(130, 132). The first and second lead frame locates in the equal level while each other. The lead frame structure more includes the first-four lead terminal (lead nodes). The first and second lead terminals(150, 152) locate in the equal level. The third and four lead terminals accomplish the right angle about the first and second lead terminals. The first and second lead terminals extend from the first lead frame. The second and four lead terminals extend from the second lead frame.
摘要翻译：目的：提供LED封装和引线框架结构，以增加引线端子的表面积，同时增强朝向LED芯片的发光方向的自由度。构成：引线框架结构包括第一和第二引线框架（130,132）。第一和第二引线框架彼此相等。引线框架结构更包括前四个引线端子（引线节点）。第一和第二引线端子（150,152）位于相同的电平。第三和四个引线端子围绕第一和第二引线端子实现直角。第一和第二引线端子从第一引线框架延伸。第二和四个引线端子从第二引线框架延伸。

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