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1. 发明申请

US20090021325A1 FRONT-END MODULE 审中-公开
标题翻译：前端模块
公开(公告)号：US20090021325A1
公开(公告)日：2009-01-22
申请号：US12176173
申请日：2008-07-18
申请人： Jae CHAN LEE , Joong Han Yoon , Gi Ho Han , Seok Min Woo , Dong Hyun Kim , Hyun Hak Kim
发明人： Jae CHAN LEE , Joong Han Yoon , Gi Ho Han , Seok Min Woo , Dong Hyun Kim , Hyun Hak Kim
IPC分类号： H03H7/38
CPC分类号： H03H7/40 , H04B1/005 , H04B1/18
摘要： A front end module is disclosed. The front end module includes a plurality of antennas receiving different frequency band signals, respectively, an impedance matching circuit unit comprising a plurality of tuners respectively connected to the plurality of antennas to control impedance matching, a selection unit selecting one frequency band signal from multiple frequency band signals passing through the impedance matching circuit unit, a measuring unit measuring signal strength of a received signal selected at the selection unit, and a control unit controlling an operation of the selection unit and an impedance of the tuner according to the signal strength of the received signal measured at the measuring unit.
摘要翻译：公开了一种前端模块。前端模块包括分别接收不同频带信号的多个天线，阻抗匹配电路单元，包括分别连接到多个天线的多个调谐器以控制阻抗匹配;选择单元，从多个频率中选择一个频带信号通过阻抗匹配电路单元的频带信号，测量在选择单元处选择的接收信号的信号强度的测量单元，以及控制单元根据信号强度来控制选择单元和调谐器的阻抗的控制单元在测量单元测量的接收信号。

2. 发明申请

US20060284203A1 Side-emitting LED package and manufacturing method of the same 有权
标题翻译：侧面发光LED封装及其制造方法相同
公开(公告)号：US20060284203A1
公开(公告)日：2006-12-21
申请号：US11444397
申请日：2006-06-01
申请人： Kyung Han , Hun Hahm , Dae Kim , Ho Ahn , Seong Han , Young Park , Seon Lee
发明人： Kyung Han , Hun Hahm , Dae Kim , Ho Ahn , Seong Han , Young Park , Seon Lee
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L24/97 , H01L25/0753 , H01L33/0095 , H01L33/486 , H01L33/54 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/15787 , H01L2924/181 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to a side-emitting LED package and a manufacturing method of the same. The invention provides a side-emitting LED package for emitting light from a light source sideward including a substrate with an electrode formed thereon. The package also includes a light source disposed on the substrate, a molded part that covers and protects the substrate with the light source thereon, and a reflective layer that covers an outer surface of the molded part. The molded part with the reflective layer forms a light transmitting surface in one side thereof. The invention allows easy manufacture of a reflecting surface in a desired shape, miniaturization regardless of the LED chip size, mass-production in an LED array, significantly improving productivity.
摘要翻译：本发明涉及一种侧面发光LED封装及其制造方法。本发明提供一种用于从侧向发光的侧光发射LED封装件，其包括形成有电极的基板。封装还包括设置在基板上的光源，覆盖并保护其上具有光源的基板的模制部件和覆盖模制部件的外表面的反射层。具有反射层的模制部件在其一侧形成透光表面。本发明允许容易地制造所需形状的反射表面，而不管LED芯片尺寸如何，小型化，LED阵列中的批量生产，显着提高生产率。

3. 发明申请

US20120050992A1 SUPERCAPACITOR MODULE 审中-公开
标题翻译：超级模块
公开(公告)号：US20120050992A1
公开(公告)日：2012-03-01
申请号：US13219135
申请日：2011-08-26
申请人： Senug Hyun Ra , Bae Kyun Kim , Yong Wook Kim
发明人： Senug Hyun Ra , Bae Kyun Kim , Yong Wook Kim
IPC分类号： H05K7/20
CPC分类号： H01G11/10 , H01G11/18 , Y02E60/13 , Y02T10/7022
摘要： Provided is a supercapacitor module including a plurality of supercapacitors, a water cooling jacket including containing parts for containing the supercapacitors, respectively, and radiating heat emitted from side surfaces of the supercapacitors, an inlet port for introducing cooling water supplied into the water cooling jacket from the exterior, and an outlet port for releasing the cooling water discharged from the water cooling jacket to the exterior. Therefore, it is possible to provide the supercapacitor module capable of increasing a radiation effect.
摘要翻译：提供了一种超级电容器模块，包括多个超级电容器，水冷套管，其分别包含用于容纳超级电容器的容纳部分，并且辐射从超级电容器的侧表面发射的热;入口，用于将供应到水冷套中的冷却水引入外部和用于将从水冷却套排出的冷却水释放到外部的出口。因此，可以提供能够增加辐射效果的超级电容器模块。

4. 发明申请

US20100096178A1 NON-SHIRINKAGE CERAMIC SUBSTRATE AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：非衬底陶瓷基板及其制造方法
公开(公告)号：US20100096178A1
公开(公告)日：2010-04-22
申请号：US12478524
申请日：2009-06-04
申请人： Jin Waun KIM , Seung Gyo Jeong
发明人： Jin Waun KIM , Seung Gyo Jeong
IPC分类号： H05K1/11 , H05K3/42
CPC分类号： H05K3/4061 , H05K1/0306 , H05K3/4629 , H05K2201/09454 , H05K2201/096 , H05K2201/09909 , Y10T29/49163
摘要： A non-shrinkage ceramic substrate includes: a ceramic laminated body formed by laminating a plurality of green sheets; an electrode part including a via electrode penetratingly formed at the ceramic laminated body and an outer electrode formed on a surface of the ceramic laminated body and electrically connected with the via electrode; and an interface part formed between the ceramic laminated body and the electrode part to prevent an electrical connection between the electrodes from weakening.
摘要翻译：非收缩陶瓷基板包括：通过层压多个生片形成的陶瓷层叠体; 包括在陶瓷层叠体上贯通地形成的通孔电极的电极部件和形成在陶瓷层叠体的表面并与通孔电极电连接的外部电极; 以及形成在陶瓷层叠体和电极部之间的界面部，以防止电极之间的电连接变弱。

5. 发明申请

US20080069439A1 System, method and medium performing color correction of display images 有权
标题翻译：显示图像的系统，方法和介质执行颜色校正
公开(公告)号：US20080069439A1
公开(公告)日：2008-03-20
申请号：US11730693
申请日：2007-04-03
申请人： Young-shin Kwak , Xiao Kaida , Du-sik Park
发明人： Young-shin Kwak , Xiao Kaida , Du-sik Park
IPC分类号： G06K9/00
CPC分类号： H04N17/02 , H04N1/6052 , H04N1/62 , H04N9/643 , H04N9/77
摘要： A system, method and medium correcting a display image. The system includes a parameter calculation module to calculate a plurality of parameters required for a transform of a first image, based on a plurality of characteristic differences between the first image and a second image, into which the first image is to be transformed to visually match the second image, a first characteristic transform module to transform a first characteristic of the first image using the plurality of calculated parameters, the transformation resulting in an unrelated change to a second characteristic of the first image, and a second characteristic restoration module to restore the second characteristic changed by the transforming of the first characteristic.
摘要翻译：修正显示图像的系统，方法和介质。该系统包括参数计算模块，用于基于第一图像和第二图像之间的多个特征差来计算第一图像的变换所需的多个参数，第一图像将被转换到其中以便视觉匹配所述第二图像是第一特征变换模块，用于使用所述多个计算参数来变换所述第一图像的第一特征，所述变换导致与所述第一图像的第二特性的无关变化;以及第二特征恢复模块，第二个特征是通过转变第一个特征而改变的。

6. 发明申请

US20140158507A1 TOUCH PANEL 审中-公开
标题翻译：触控面板
公开(公告)号：US20140158507A1
公开(公告)日：2014-06-12
申请号：US13780152
申请日：2013-02-28
申请人： SUMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Sung Yeol Park , Suk Jin Ham , Jung Tae Park , Seung Heon Han , Jung Eun Noh
IPC分类号： H01H1/06
CPC分类号： G06F3/044
摘要： The touch panel according to a preferred embodiment of the present invention includes: a transparent substrate having one surface on which a first groove portion is formed and the other surface on which a second groove portion is formed; a first electrode formed on one surface of the transparent substrate so as to cross the first groove portion; and a second electrode formed on the other surface of the transparent substrate so as to cross the second groove portion.
摘要翻译：根据本发明的优选实施例的触摸面板包括：具有一个表面上形成有第一槽部的透明基板和形成有第二槽部的另一个表面; 形成在所述透明基板的一个表面上以与所述第一凹槽部分交叉的第一电极; 以及形成在所述透明基板的另一个表面上以与所述第二凹槽部分交叉的第二电极。

7. 发明申请

US20140068891A1 POWER FACTOR CORRECTION CIRCUIT, POWER SUPPLY DEVICE AND VACUUM CLEANER USING THE SAME 审中-公开
标题翻译：功率因数校正电路，电源装置和使用其的真空清洁器
公开(公告)号：US20140068891A1
公开(公告)日：2014-03-13
申请号：US13770502
申请日：2013-02-19
申请人： SUMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Hyung Joon Kim , Han Kyung Bae , Hong Chul Shin
IPC分类号： H02M5/44
CPC分类号： H02M5/44 , A47L5/362 , A47L9/246 , A47L9/2868 , H01F37/00 , H02M1/4266 , Y02B70/123
摘要： A power factor correction circuit, a power supply device and a vacuum cleaner using the same. The power supply device for a vacuum cleaner is applicable to a vacuum cleaner having a flexible hose. The power supply device for a vacuum cleaner includes: A power factor correction unit correcting a power factor of an AC voltage supplied from an AC power source; a rectifying unit rectifying the AC voltage power factor-corrected by the power factor correction unit into a direct current (DC) voltage and outputting the DC voltage; a smoothing unit smoothing the DC voltage output from the rectifying unit and outputting the smoothed the DC voltage; an a converting unit converting the smoothed DC voltage from the smoothing unit into an AC voltage, wherein the power factor correction unit uses a conductive line included in the flexible hose, as an inductor.
摘要翻译：功率因数校正电路，电源装置和使用其的真空吸尘器。用于真空吸尘器的电源装置适用于具有柔性软管的真空吸尘器。用于真空吸尘器的电源装置包括：功率因数校正单元，校正从AC电源提供的AC电压的功率因数; 整流单元，将由功率因数校正单元校正的交流电压功率因数整流为直流（DC）电压，并输出直流电压; 平滑单元，对从整流单元输出的直流电压进行平滑并输出平滑的直流电压; a转换单元，将平滑单元的平滑直流电压转换成AC电压，其中功率因数校正单元使用包括在柔性软管中的导线作为电感器。

8. 发明申请

US20130168132A1 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20130168132A1
公开(公告)日：2013-07-04
申请号：US13729666
申请日：2012-12-28
申请人： SUMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Chang Bae Lee , Jin Gu Kim , Young Do Kweon
IPC分类号： H05K3/00 , H05K1/11
CPC分类号： H05K3/00 , H05K1/111 , H05K1/113 , H05K3/244 , H05K3/26 , H05K3/282 , H05K2201/09745 , H05K2201/099 , H05K2203/095
摘要： Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes a base substrate; a circuit layer including a connection pad having a vertically etched upper portion and formed on the upper portion of the base substrate; a solder resist layer formed on the upper portion of the base substrate and including an opening part exposing the connection pad; and a surface treatment layer formed on the upper portion of the connection pad exposed by the opening part.
摘要翻译：这里公开了一种印刷电路板及其制造方法。印刷电路板包括基底; 电路层，包括具有垂直蚀刻的上部并形成在所述基底基板的上部上的连接焊盘; 形成在所述基底基板的上部并且包括暴露所述连接垫的开口部的阻焊层; 以及形成在由开口部暴露的连接焊盘的上部的表面处理层。

9. 发明申请

US20050284657A1 Double-sided printed circuit board without via holes and method of fabricating the same 审中-公开
标题翻译：无通孔的双面印刷电路板及其制造方法
公开(公告)号：US20050284657A1
公开(公告)日：2005-12-29
申请号：US11199484
申请日：2005-08-08
申请人： Chang-Sup Ryu , Jang-Kyu Kang , Byung-Kook Sun
发明人： Chang-Sup Ryu , Jang-Kyu Kang , Byung-Kook Sun
IPC分类号： H05K1/14 , H05K1/11 , H05K3/28 , H05K3/40 , H01R12/04
CPC分类号： H05K3/403 , H05K1/118 , H05K3/28 , H05K2201/055 , H05K2201/056 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155
摘要： Disclosed is a method of fabricating a double-sided PCB without via holes, functioning to transport electric signals between both sides of the PCB, by folding a flexible substrate, in which circuit patterns are formed on only one side of the flexible substrate, and the double-sided PCB without the via holes fabricated by the method. Therefore, the method is advantageous in that it allows PCB manufacturers to save the efforts for forming and protecting the via holes because the double-sided PCB does not need via holes, and reduces its fabricating cost and time, due to simplicity of this method.
摘要翻译：公开了一种制造无通孔的双面PCB的方法，其功能是在PCB的两侧之间传输电信号，通过折叠柔性基板，其中电路图案仅形成在柔性基板的一侧上，并且双面PCB，无通孔的方法。因此，该方法的优点在于，由于双面PCB不需要通孔，所以PCB制造商可以节省形成和保护通孔的努力，并且由于该方法的简单性而降低了其制造成本和时间。

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