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1. 发明授权

US5894980A Jet soldering system and method 失效
标题翻译：射流焊接系统及方法
公开(公告)号：US5894980A
公开(公告)日：1999-04-20
申请号：US718607
申请日：1996-09-23
申请人： Melissa E. Orme-Marmarelis , Eric Phillip Muntz
发明人： Melissa E. Orme-Marmarelis , Eric Phillip Muntz
IPC分类号： B23K3/06 , B23K37/06
CPC分类号： B23K3/0623 , B22F2009/0836 , B22F2999/00 , B23K2201/42
摘要： An apparatus for depositing a selected pattern of solder onto a substrate comprising: a substrate support having structure for bearing a substrate on which one or more electronic components are to be mounted; a solder ejector that defines a cavity for containing molten solder and an orifice for ejecting a stream of molten solder; a heater for heating the solder to a temperature above the melting point of solder; a vibrator coupled to the solder ejector to form droplets in the stream at the desired frequency for deposition onto the substrate; and a cooler, adapted to receive a coolant, disposed between the heater and the vibrator to maintain the temperature of the vibrator below that which would detrimentally affect the performance of the vibrator.
摘要翻译：一种用于将选择的焊料图案沉积到衬底上的装置，包括：具有用于承载要在其上安装一个或多个电子部件的衬底的结构的衬底支撑件; 焊料喷射器，其限定用于容纳熔融焊料的空腔和用于喷射熔融焊料流的孔口; 用于将焊料加热到高于焊料熔点的温度的加热器; 耦合到所述焊料喷射器的振动器，以在所述流中以期望的频率形成液滴以沉积到所述衬底上; 以及设置在加热器和振动器之间的适于接收冷却剂的冷却器，以将振动器的温度保持在低于不利地影响振动器性能的温度。

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