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    • 1. 发明公开
    • MEMORY MODULE HAVING A COOLING MEANS, METHOD FOR PRODUCING THE MEMORY MODULE HAVING A COOLING MEANS, AND DATA PROCESSING DEVICE COMPRISING A MEMORY MODULE HAVING A COOLING MEANS
    • 具有冷却装置的存储模块,用于生产具有冷却装置的存储模块的方法,以及包含具有冷却装置的存储模块的数据处理装置
    • KR20070094572A
    • 2007-09-20
    • KR20070026344
    • 2007-03-16
    • QIMONDA AG
    • LEGEN ANTONMORGENROTH LUTZNEUMAIER KLAUSWOOD STEVE
    • G06F1/20
    • H01L23/3672H01L2924/0002H01L2924/00
    • A memory module having a cooling unit, a method for producing the memory module having the cooling unit, and a data processing device including a memory module with the cooling unit are provided to avoid overheated memory modules by improving heat dissipation from the memory modules by enabling improved air flowing between adjacent memory modules. A memory module(100) includes a board with a surface(2) where at least one first electronic component and at least one second electronic component, and a cooling element(210) having a first section(214) with a first end part(216), which is arranged on the surface of the board and extended in a first direction, and a second end part(217) which is extended in a first direction. At least one or more stabilizing elements(211,212) are arranged to be extended in the first direction to the first end part and the second end part of the first section of the cooling element. The cooling element has a second section(215). The cooling element has a surface(213) spaced from the surface of the board. The surface(213) of the first section of the cooling element is away from a first distance(D1) from the surface of the board. The surface(213) of the first section of the cooling element is away from a second distance(D2) from the surface of the board, and the first distance and the second distance are different from each other.
    • 具有冷却单元的存储模块,用于制造具有冷却单元的存储器模块的方法以及包括具有冷却单元的存储器模块的数据处理装置,以通过使得能够通过使能存储器模块的散热来改善来自存储器模块的散热来避免过热的存储器模块 在相邻存储器模块之间改进的空气流动。 存储器模块(100)包括具有表面(2)的板,其中至少一个第一电子部件和至少一个第二电子部件以及具有第一部分(214)的冷却元件(210),该第一部分具有第一端部 216),其布置在所述板的表面上并沿第一方向延伸;以及第二端部(217),其沿第一方向延伸。 至少一个或多个稳定元件(211,212)被布置成沿着第一方向延伸到冷却元件的第一部分的第一端部部分和第二端部部分。 冷却元件具有第二部分(215)。 冷却元件具有与板的表面间隔开的表面(213)。 冷却元件的第一部分的表面(213)离开板的表面离开第一距离(D1)。 冷却元件的第一部分的表面(213)远离板的表面的第二距离(D2),并且第一距离和第二距离彼此不同。
    • 4. 发明公开
    • METHOD OF SYSTEM BOOTING WITH A DIRECT MEMORY ACCESS IN A NEW MEMORY ARCHITECTURE
    • 在新的存储器架构中使用直接存储器访问的系统方法
    • KR20070077463A
    • 2007-07-26
    • KR20070006722
    • 2007-01-22
    • QIMONDA AG
    • KAO ROM SHEN
    • G06F9/24G06F9/44G06F9/445G06F12/00
    • G06F9/4403G06F8/751G06F9/24G06F9/4401G06F9/445G06F9/44578G06F12/1081G06F13/1673
    • A method for booting a computer system, the method for loading a boot code, a DRAM device, and an embedded system including the same are provided to reduce complexity of a host processor and the embedded system by offloading processing load for booting the embedded system to a volatile memory from the host processor. The embedded system includes the host processor(102), a NAND flash memory(130), and the DRAM device(110). The DRAM device includes a processor interface, a NAND flash memory interface(122), buffer(106,116), an SRAM array(108), and a DMA(Direct Memory Access) engine(120). The DRM engine automatically performs DMA transfer for transferring the boot code to the buffer from the NAND flash memory by detecting booting of the embedded system. The processor reads and executes the boot code stored in the buffer, and issues a command to the DMA engine in response to execution of the boot code. The DMA engine automatically transfers an OS(Operating System) code to the SRAM array from the NAND flash memory by responding to the issued command.
    • 提供了引导计算机系统的方法,用于加载引导代码的方法,DRAM设备和包括其的嵌入式系统,以通过将用于引导嵌入式系统的处理负载卸载来降低主机处理器和嵌入式系统的复杂性 来自主处理器的易失性存储器。 嵌入式系统包括主处理器(102),NAND快闪存储器(130)和DRAM设备(110)。 DRAM设备包括处理器接口,NAND闪存接口(122),缓冲器(106,116),SRAM阵列(108)和DMA(直接存储器访问)引擎(120)。 DRM引擎自动执行DMA传输,通过检测嵌入式系统的引导,将启动代码从NAND闪存传输到缓冲区。 处理器读取并执行存储在缓冲器中的引导代码,并响应于引导代码的执行向DMA引擎发出命令。 DMA引擎通过响应发出的命令自动将NAND(NAND闪存)的OS(操作系统)代码传输到SRAM阵列。
    • 5. 发明公开
    • MEMORY DEVICE AND METHOD FOR OPERATING SUCH A MEMORY DEVICE
    • 用于操作这种存储器件的存储器件和方法
    • KR20070092124A
    • 2007-09-12
    • KR20070021831
    • 2007-03-06
    • QIMONDA AG
    • HOENIGSCHMID HEINZLIAW CORVIN
    • G11C13/02G11C7/00
    • H01L27/24G11C13/0004G11C2213/79
    • A memory device and a method for operating the same are provided to operate a memory device allowing a higher current through an active material related with the width of a switching device, and to provide a plurality of memory cells, especially PCM(Phase Change Material) memory cells, to the memory device. A memory device having at least one memory cell includes an active material(1) and a current supply line. A first switching device switches a first current through the active material from the current supply line. The memory cell includes at least one additional switching device switching an additional current through the active material from the current supply line. The memory cells are resistive switching memory cells.
    • 提供了一种存储器件及其操作方法以操作存储器件,其允许通过与开关器件的宽度相关的活性材料的较高电流,并提供多个存储器单元,特别是PCM(相变材料) 存储单元,到存储器件。 具有至少一个存储单元的存储器件包括活性材料(1)和电流供应线。 第一开关装置从当前电源线切换通过活性材料的第一电流。 存储单元包括至少一个额外的开关装置,从电流供应管线切换穿过活性材料的附加电流。 存储单元是电阻式开关存储单元。
    • 6. 发明公开
    • SEMICONDUCTOR DEVICE AND METHOD OF PRODUCTION
    • 半导体器件及其生产方法
    • KR20070089654A
    • 2007-08-31
    • KR20070020619
    • 2007-02-28
    • QIMONDA AG
    • OLLIGS DOMINIKPOLEI VERONIKA
    • H01L21/336H01L21/304
    • H01L21/0206H01L21/28061H01L21/32139H01L29/4941
    • A semiconductor device and its manufacturing method are provided to prevent the deposition of an unwanted material in a cleaning agent treatment on a hard mask by using an improved conductive cover layer structure. A semiconductor device includes a body, one or more metal films and a conductive cover layer. The body is made of a semiconductor material. The body has a main surface. The metal films are formed on the main surface of the body. The conductive cover layer(7) is formed on the metal films. The conductive cover layer is made of a different material from those of the metal films. A structural layer order is defined at the metal films and the conductive cover layer by a lateral boundary portion. The semiconductor device further includes a hard mask layer overlapped with the conductive cover layer. A nitride layer is capable of being additionally formed on the conductive cover layer. The conductive cover layer contains a semiconductor material. The conductive cover layer contains polysilicon.
    • 提供半导体器件及其制造方法,以通过使用改进的导电覆盖层结构来防止在清洁剂处理中的不需要的材料沉积在硬掩模上。 半导体器件包括主体,一个或多个金属膜和导电覆盖层。 身体由半导体材料制成。 身体有一个主表面。 金属膜形成在主体的主表面上。 导电覆盖层(7)形成在金属膜上。 导电覆盖层由与金属膜不同的材料制成。 通过横向边界部分在金属膜和导电覆盖层上限定结构层顺序。 半导体器件还包括与导电覆盖层重叠的硬掩模层。 能够在导电覆盖层上另外形成氮化物层。 导电覆盖层包含半导体材料。 导电覆盖层含有多晶硅。