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5. 发明专利

DE4423058A1 Profiled dough stamping roller 未知
公开(公告)号：DE4423058A1
公开(公告)日：1996-01-04
申请号：DE4423058
申请日：1994-07-01
申请人： PAUL WOLF GMBH
IPC分类号： A21C11/04 , A21C11/08
摘要： The profiled roller to stamp shapes out of dough has at least two drillings (7, 7) in the roller mantle (6), behind each other at the mounting location for a stamping mould (1) in the direction of roller rotation. Each stamping mould (1) has two projections at the under side with pins (5, 5) to fit into the drillings (7, 7) in the roller mantle (6). The drillings (7, 7) and pins (5, 5) are aligned at the same angle ( alpha , alpha ) to each other.

10. 发明专利

GB771712A Improvements relating to the manufacture of wafers 未知
公开(公告)号：GB771712A
公开(公告)日：1957-04-03
申请号：GB1925955
申请日：1955-07-04
申请人： PAUL WOLF
IPC分类号： A21C15/00
摘要： 771,712. Making wafer sandwiches. WOLF, P. July 4, 1955 [July 13, 1954], No. 19259/55. Class 28(1) Filled wafer strips are made by placing a layer of standard-size wafer sheets on a table or conveyer with the sheets abutting one another longitudinally and if desired transversely, spreading a layer of filling over the wafer sheets and then placing a further layer of wafer sheets on top so that the joints between separate wafer sheets in the upper layer do not coincide with the joints between wafer sheets in the lower layer. As shown, wafer sheets are deposited on to conveyer belt 1 and are fed, assisted by a feed roll 2, under a device 3 to receive a layer of filling. A layer of wafer sheets is placed on to the filling and the strip is then compressed by a roll 4. A second layer of filling may be deposited from device 5 on to the strip and a further layer of wafer sheets deposited on the filling, the joints between these wafer sheets being offset from the joints between those of the layer immediately beneath. A further roller 4 1 compresses the strip again. Further layers of filling and wafer sheets may be added as required. The finished strip is cut up.

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