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1. 发明申请

WO1991000847A1 OXIDE SUPERCONDUCTOR AND METHOD OF PRODUCING THE SAME 审中-公开
标题翻译：氧化物超导体及其制造方法
公开(公告)号：WO1991000847A1
公开(公告)日：1991-01-24
申请号：PCT/JP1990000877
申请日：1990-07-07
申请人： INTERNATIONAL SUPERCONDUCTIVITY TECHNOLOGY CENTER , KABUSHIKI KAISHA KOBE SEIKO SHÖ , MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , KYOCERA CORPORATION , MITSUBISHI METAL CORPORATION , THE TOKYO ELECTRIC POWER COMPANY INCORPORATED , MIYATAKE, Takayuki , KOSHIZUKA, Naoki , HAYASHI, Seiji , SHIBUTANI, Kazuyuki , KAWATE, Yoshio , MASUDA, Yoshio , OGAWA, Rikuo , FUKUMOTO, Yoshito , WADA, Takahiro , KORIYAMA, Shin-Ichi , SAKURAI, Takeshi , SUZUKI, Nobuo , YAMAUCHI, Hisao , TANAKA, Shogi
发明人： INTERNATIONAL SUPERCONDUCTIVITY TECHNOLOGY CENTER , KABUSHIKI KAISHA KOBE SEIKO SHÖ , MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , KYOCERA CORPORATION , MITSUBISHI METAL CORPORATION , THE TOKYO ELECTRIC POWER COMPANY INCORPORATED
IPC分类号： C01G03/00
CPC分类号： H01L39/248 , C01G3/006 , C01P2002/72 , C01P2002/77 , C01P2002/88 , C01P2004/80 , C01P2006/14 , C04B35/4504 , H01L39/126
摘要： An oxide superconductor having the characteristics of two superconductors, i.e. a high critical temperature of RBa2Cu307 (wherein R represents at least one element selected from the group consisting of yttrium and lanthanide series elements) and a high-temperature stability of RBa2Cu4O8, which comprises RBa2Cu4O8 wherein 0.1 to 50 atomic % of R is replaced by calcium. It can be produced by various processes, among which the hot isostatic process for sintering the powdery starting materials is particularly effective. Although the Tc can be raised merely by applying this process, a more efficient production becomes possible by preventing the formation of (R1-xCax)Ba2Cu4O7 as an intermediate. The obtained superconductor can be applied in the production of wire material by virtue of the high critical temperature and high-temperature stability thereof.
摘要翻译：具有两个超导体特性的氧化物超导体，即RBa2Cu307的高临界温度（其中R表示选自钇和镧系元素的至少一种元素）和RBa 2 Cu 4 O 8的高温稳定性，其包含RBa 2 Cu 4 O 8，其中 0.1〜50原子％的R被钙取代。它可以通过各种方法生产，其中用于烧结粉末起始材料的热等静压方法是特别有效的。虽然仅通过应用该方法可以提高Tc，但是通过防止形成（R1-xCax）Ba2Cu4O7作为中间体，可以实现更有效的生产。获得的超导体可以通过高临界温度和高温稳定性应用于线材生产中。

2. 发明申请

WO2008122586A1 THIN FILM TRANSISTOR 审中-公开
标题翻译：薄膜晶体管
公开(公告)号：WO2008122586A1
公开(公告)日：2008-10-16
申请号：PCT/EP2008/054056
申请日：2008-04-03
申请人： CAMBRIDGE DISPLAY TECHNOLOGY LIMITED , MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , HOTTA, Sadayoshi , BURROUGHES, Jeremy Henley , WHITING, Gregory Lewis
发明人： HOTTA, Sadayoshi , BURROUGHES, Jeremy Henley , WHITING, Gregory Lewis
IPC分类号： H01L51/05 , H01L51/52
CPC分类号： H01L27/3274 , H01L21/31683 , H01L51/0541 , H01L51/105 , H01L51/5206
摘要： A method of making a top-gate organic thin film transistor, comprising forming source and drain contacts on a substrate; oxidising portions of the source and drain contacts; depositing an organic semiconductor layer to form a bridge between the oxidised portions of the source and drain contacts; depositing a gate insulating layer over the organic semiconductor layer; and forming a gate electrode over the gate insulating layer.
摘要翻译：一种制造顶栅有机薄膜晶体管的方法，包括在衬底上形成源极和漏极接触; 源极和漏极触点的氧化部分; 沉积有机半导体层以形成源极和漏极接触的氧化部分之间的桥; 在所述有机半导体层上沉积栅极绝缘层; 以及在所述栅绝缘层上形成栅电极。

3. 发明申请

WO2008110251A1 CAPACITOR MODULE 审中-公开
标题翻译：电容器模块
公开(公告)号：WO2008110251A1
公开(公告)日：2008-09-18
申请号：PCT/EP2008/001231
申请日：2008-02-18
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , MEINCKE, Steffen , BOGDAN, Holger , GLAPA, Norbert , DODT, Thomas
发明人： MEINCKE, Steffen , BOGDAN, Holger , GLAPA, Norbert , DODT, Thomas
IPC分类号： H01G4/38 , H01G9/08 , H01G9/26
CPC分类号： H01G4/38 , H01G9/08 , H01G9/26 , Y02E60/13
摘要： The present invention relates to a capacitor module having at least two capacitor cells (10, 20; 40) of the same type of cells, which cells being provided at one of their rear and front faces with an over-pressure valve for electrolyte contained within said cells, and which cells are electrically connected to each other and arranged in a substantially horizontal orientation within said capacitor module when in its operating position. By using merely one type of cells, the manufacturing costs can be substantially reduced. In case of a series connection of the capacitor cells (10, 20; 40), simple connection of the capacitor cells at the opposed faces thereof is possible. Therefore, as the cells are arranged in a substantially horizontal orientation, inadvertent leackage of electrolyte out of the over-pressure valves is prevented. By means of different additional features, sufficient cooling of the capacitor module is guaranteed.
摘要翻译：本发明涉及一种具有至少两个相同类型电池的电容器电池（10,20; 40）的电容器模块，该电池单元在其后表面和前表面中的一个处设置有电解液的过压阀所述电池以及哪个电池在其工作位置时彼此电连接并且在所述电容器模块内以基本上水平的方向布置。通过仅使用一种类型的电池，可以显着降低制造成本。在电容器单元（10,20; 40）的串联连接的情况下，可以在其相对面处简单地连接电容器单元。因此，由于电池被布置成基本水平的方向，因此防止电解液从过压阀中的无意中的泄漏。通过不同的附加功能，可以保证电容器模块的充分冷却。

4. 发明申请

WO2008102517A1 HERMETIC COMPRESSOR 审中-公开
标题翻译： HERMETIC压缩机
公开(公告)号：WO2008102517A1
公开(公告)日：2008-08-28
申请号：PCT/JP2007/075377
申请日：2007-12-26
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , YANASE, Seigo
发明人： YANASE, Seigo
IPC分类号： F04B39/02 , F16C19/10 , F16C35/06
CPC分类号： F04B39/0246 , F04B39/0215 , F16C19/10
摘要： A hermetic compressor of the present invention includes a thrust-ball bearing having balls (168) disposed in a holder (170) in a manner that the balls (168) roll along at least two tracks (182a, 182b, 184a and 184b). The invented structure decreases the number of balls (168) that roll along each of the tracks (182a, 182b, 184a and 184b), and reduces a frequency of sliding between the balls (168) and the tracks (182a, 182b, 184a and184b), thereby alleviating wear of the tracks.
摘要翻译：本发明的封闭式压缩机包括具有滚珠（168）的推力球轴承，滚珠（168）以滚珠（168）沿着至少两个轨道（182a，182b，184a和184b）滚动的方式设置在支架（170）中。本发明的结构减少了沿着每个轨道（182a，182b，184a和184b）滚动的滚珠（168）的数量，并且减小了滚珠（168）和轨道（182a，182b，184a和184b）之间的滑动频率），从而减轻轨道的磨损。

5. 发明申请

WO2008092641A1 NETWORK-BASED AND HOST-BASED MOBILITY MANAGEMENT IN PACKET-BASED COMMUNICATION NETWORKS 审中-公开
标题翻译：基于分组通信网络的基于网络和基于主机的移动性管理
公开(公告)号：WO2008092641A1
公开(公告)日：2008-08-07
申请号：PCT/EP2008/000681
申请日：2008-01-29
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , WENIGER, Kilian , GENADI, Velev , BACHMANN, Jens , SCHURINGA, Jon , TAKASHI, Aramaki
发明人： WENIGER, Kilian , GENADI, Velev , BACHMANN, Jens , SCHURINGA, Jon , TAKASHI, Aramaki
IPC分类号： H04L29/06
CPC分类号： H04W8/06 , H04W80/04
摘要： The present invention describes a method for signalling to a mobility anchor point a position of a mobile node in a network using a network-based mobility management scheme for managing the mobility of the mobile node, said method comprising receiving, by a network element, from the mobile node, during or after network authentication of the mobile node, a sequence number used by a process implementing a mobile node-based mobility management scheme for managing the mobility of the mobile node, and transmitting, by the network element, to the mobility anchor point a message on a position of the mobile node in the network, wherein said message comprises the received sequence number. A common sequence number variable for BU and PBU messages is used, so that the HA is able to determine a correct transmission order of PBU/BU messages based on the sequence number in the message.
摘要翻译：本发明描述了一种用于使用基于网络的移动性管理方案向移动锚点向移动锚定点发信号的方法，所述方法包括：用于管理移动节点的移动性，所述方法包括：由网元从移动节点在移动节点的网络认证期间或之后，由实现基于移动节点的移动性管理方案的处理使用的序列号，用于管理移动节点的移动性，并且由网络元件将其发送到移动性定位在网络中的移动节点的位置上的消息，其中所述消息包括接收到的序列号。使用BU和PBU消息的公共序列号变量，使得HA能够基于消息中的序列号来确定PBU / BU消息的正确传输顺序。

6. 发明申请

WO2008088073A1 OBFUSCATION ASSISTING APPARATUS 审中-公开
标题翻译：辅助辅助装置
公开(公告)号：WO2008088073A1
公开(公告)日：2008-07-24
申请号：PCT/JP2008/050922
申请日：2008-01-17
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , NICOLSON, Kenneth, Alexander , ASAI, Rieko , SATO, Taichi , MATSUSHIMA, Hideki
发明人： NICOLSON, Kenneth, Alexander , ASAI, Rieko , SATO, Taichi , MATSUSHIMA, Hideki
IPC分类号： G06F21/22
CPC分类号： G06F21/14
摘要： To provide, in order that proper obfuscation of a source code (100) can be easily performed, an obfuscation assisting apparatus (11) which can sufficiently assist the obfuscation. The obfuscation assisting apparatus (11) includes: an analyzer (114) which identifies corresponding respective blocks in the source code (100) and in a transformed code (104) generated through the obfuscation of the source code (100); and a browser (119) which obtains obfuscation information relating to obfuscation of the respective blocks of the source code (100) and the transformed code (104), and causes an output device (1002) to display the respective parts of the source code (100) and the transformed code (104), and the obfuscation information in association with each other.
摘要翻译：为了提供能够容易地执行源代码（100）的适当混淆的混淆辅助装置（11），其能够充分地协助混淆。混淆辅助装置（11）包括：分析器（114），其识别源代码（100）中的相应各个块和通过模糊源代码（100）生成的变换代码（104）; 以及浏览器（119），其获得与源代码（100）和变换代码（104）的各个块的混淆有关的混淆信息，并且使得输出设备（1002）显示源代码 100）和变换代码（104），以及混淆信息彼此相关联。

7. 发明申请

WO2008081969A1 CONNECTING METHOD OF ELECTRONIC COMPONENT 审中-公开
标题翻译：电子元件的连接方法
公开(公告)号：WO2008081969A1
公开(公告)日：2008-07-10
申请号：PCT/JP2007/075369
申请日：2007-12-26
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , SAKAI, Tadahiko , EIFUKU, Hideki
发明人： SAKAI, Tadahiko , EIFUKU, Hideki
IPC分类号： H05K3/36 , H05K3/32 , H01L21/60
CPC分类号： H01R12/62 , H01R12/592 , H05K3/323 , H05K3/361 , H05K2203/0195 , H05K2203/0278 , H05K2203/111 , Y10T29/49126 , Y10T29/4913
摘要： It is to provide an electronic component connecting method capable of performing dehumidification within a short time without giving a thermal influence to an electronic component which has already been mounted on a wiring board. When a first connection terminal group 5 formed on a connection area 3 of a rigid board 1 is connected to a flexible board 2 where a second connection terminal group 6 has been formed by employing a thermosetting resin in an electrically conductive manner, since a connection area 3 which is heated in a step for thermally hardening the thermosetting resin is locally preheated, moisture, and oils and fats contained in the connection area 3 among such moisture, and oils and fats, which have been absorbed in the rigid board 1 are dehumidified. Thereafter, the thermosetting resin interposed between the first connection terminal group 5 and the second connection terminal group 6 is thermally hardened. Since the connection area 3 is locally preheated, the dehumidification can be carried out within a short time without giving a thermal influence to an electronic component 4 which has already been mounted on the rigid board 1.
摘要翻译：本发明提供能够在短时间内对已经安装在布线基板上的电子部件产生热影响的短时间内进行除湿的电子部件连接方法。当形成在刚性基板1的连接区域3上的第一连接端子组5通过以导电方式使用热固性树脂而连接到已经形成第二连接端子组6的柔性板2时，由于连接区域在热固性树脂热固化的步骤中被加热的3被除湿，并且包含在这些湿气中的连接区域3中的油和脂肪以及已被吸收在刚性板1中的油和脂肪被除湿。此后，插入在第一连接端子组5和第二连接端子组6之间的热固性树脂被热硬化。由于连接区域3被局部预热，所以除湿可以在短时间内进行，而不会对已经安装在刚性板1上的电子部件4产生热影响。

8. 发明申请

WO2008081968A1 MANUFACTURING METHOD OF SEMICONDUCTOR CHIP 审中-公开
标题翻译：半导体芯片的制造方法
公开(公告)号：WO2008081968A1
公开(公告)日：2008-07-10
申请号：PCT/JP2007/075368
申请日：2007-12-26
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , ARITA, Kiyoshi , HAJI, Hiroshi
发明人： ARITA, Kiyoshi , HAJI, Hiroshi
IPC分类号： H01L21/78 , H01L21/308 , H01L21/304
CPC分类号： H01L21/78 , H01L21/304 , H01L21/67092
摘要： An object is to provide a manufacturing method of a semiconductor chip, by which while a semiconductor wafer is not broken when the semiconductor wafer is transported before plasma dicing is carried out, a time required for the plasma dicing can be shortened, so that a manufacturing efficiency of the semiconductor chips can be improved. After a resist film 6 has been formed on a ground rear plane 1q of a semiconductor wafer 1, partial portions (6a and 1b) of cutting margin areas (6a, 1b, 1c, 3c) along dicing lines 2 are removed by a blade 13 corresponding to a mechanical cutting means, and thickness "t" of remaining cutting margin areas 1c of the semiconductor wafer 1 along a thickness direction thereof are made thinner, which never causes any problem when the semiconductor wafer 1 is transported. Thereafter, all of the remaining cutting margin areas (1c, 3a) are removed by performing a plasma etching process.
摘要翻译：本发明的目的是提供一种半导体芯片的制造方法，通过该半导体芯片的制造方法，在半导体晶片在进行等离子体切割之前被输送时半导体晶片不破裂的情况下，可以缩短等离子体切割所需的时间，从而制造可以提高半导体芯片的效率。在半导体晶片1的接地背面1q上形成抗蚀剂膜6之后，沿着切割线2切割边缘区域（6a，1b，1c，3c）的部分部分（6a和1b）被刀片13 对应于机械切割装置，并且半导体晶片1的厚度方向上的剩余切割边缘区域1c的厚度“t”变薄，当半导体晶片1被输送时，这不会产生任何问题。此后，通过进行等离子体蚀刻处理除去所有剩余的切割边缘区域（1c，3a）。

9. 发明申请

WO2008071276A1 LOCAL MOBILITY ANCHOR RELOCATION AND ROUTE OPTIMIZATION DURING HANDOVER OF A MOBILE NODE TO ANOTHER NETWORK AREA 审中-公开
标题翻译：在移动节点转移到另一个网络区域的本地移动锚点转移和路由优化
公开(公告)号：WO2008071276A1
公开(公告)日：2008-06-19
申请号：PCT/EP2007/009734
申请日：2007-11-09
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , VELEV, Genadi , HAKENBERG, Rolf , BACHMANN, Jens
发明人： VELEV, Genadi , HAKENBERG, Rolf , BACHMANN, Jens
IPC分类号： H04L29/06
CPC分类号： H04W8/082 , H04W8/087 , H04W80/04
摘要： The invention relates to a method for managing the mobility of a mobile node that moves to a different network, but keeps the same IP address. It is proposed to perform route optimization by a Proxy MIP agent on behalf of the MN, thereby shortening the data-path while allowing network-based mobility. At session setup with a correspondent node, the PCC system in the home network decides whether route optimization is to be performed for the communication session. The PMIPa requests relevant information for the route optimization, including the decision for route optimization and the addresses of MN and CN, from the PCC system in the home network, when the MN attaches to the new network area. Accordingly, route optimization is performed by using the Return Routability Procedure according to MIPv6, thereby applying the MN's IP address as Home Address, and the PMIPa's address as Care-of Address of the MN.
摘要翻译：本发明涉及一种用于管理移动到不同网络但保持相同IP地址的移动节点的移动性的方法。建议代表MN代理MIP代理执行路由优化，从而缩短数据路径，同时允许基于网络的移动性。在与对端节点的会话建立中，家庭网络中的PCC系统决定是否对通信会话执行路由优化。当MN连接到新的网络区域时，PMIPa从家庭网络的PCC系统请求路由优化的相关信息，包括路由优化的决定以及MN和CN的地址。因此，通过使用根据MIPv6的返回可路由性过程来执行路由优化，从而将MN的IP地址作为归属地址，将PMIPa的地址作为MN的转交地址。

10. 发明申请

WO2008056754A1 METHOD FOR COMPONENT MOUNTING 审中-公开
标题翻译：组件安装方法
公开(公告)号：WO2008056754A1
公开(公告)日：2008-05-15
申请号：PCT/JP2007/071748
申请日：2007-11-02
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , MAENISHI, Yasuhiro
发明人： MAENISHI, Yasuhiro
IPC分类号： H05K13/04
CPC分类号： H05K13/0408 , H05K13/0452 , H05K13/08 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/53174
摘要： A method for component mounting which reduces the length of time that a component mounter called alternate mounting component mounter takes for mounting components is a method for component mounting used for a component mounter including plural mounting heads which alternately mount components onto a board. The method includes specifying, as a first mounting head, one of the plural mounting heads which moves a shortest distance to the board (S2), and mounting the components onto the board which is brought into the component mounter, the mounting starting from the first mounting head (S14).
摘要翻译：一种用于部件安装的方法，其减少了称为备用安装部件安装器的部件安装器用于安装部件的时间长度，这是用于部件安装器的部件安装方法，该部件安装器包括将组件交替安装在板上的多个安装头。该方法包括将多个安装头中的一个安装到板（S2）上的最短距离的第一安装头中，并将组件安装到进入组件安装机的板上，从第一安装头开始安装头（S14）。

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