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1. 发明公开

EP1671925A1 Micromachining process for forming microstructures having arbitrarily sloped and/or profiled sidewalls or substructures 审中-公开
标题翻译：用于与任意倾斜和/或成型的侧边缘或子结构产生的微结构的微机械方法
公开(公告)号：EP1671925A1
公开(公告)日：2006-06-21
申请号：EP04028817.7
申请日：2004-12-06
申请人： Liu, Wai Yip
发明人： Liu, Wai Yip
IPC分类号： B81C1/00 , G03F7/00 , B29C59/02
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00
摘要： The object of the present invention is to provide a three-dimensional microfabrication apparatus and method for photolithographic mass-fabrication of three-dimensional microstructures having arbitrarily sloped and/or profiled sidewalls or substructures. The process comprises: locating photo-curable material in a suitable reservoir; dehydrating the photo-curable material; annealing areas forming the upper boundaries of sloped or profiled sidewalls or substructures; providing one or more metal layers masking the areas of the photo-curable material where said material in the micro structure is not required; photolithographically patterning areas to be deformed using polymeric masks; mechanically disrupting the flatness of areas between or enclosed by the annealed areas to form the required sub-structures whilst the photocurable material is cooling; and selectively photopolymerising the regions required for forming the end microstructures.
摘要翻译：本发明的目的是提供一种用于具有任意倾斜和/或成型的侧壁或子结构的三维微结构的光刻质量制造三维微加工装置和方法。该方法包括：在合适的储存器定位光固化材料; 脱水可光固化材料; 退火区域中形成倾斜的或异型的侧壁或子结构的上边界; 提供一个或多个金属层掩蔽在不要求所述的材料在微观结构中的光固化材料的区域; 光刻图案化区域使用聚合物掩模变形; 机械破碎的之间或区域的平坦性由退火区域包围，以形成所需要的子结构而光固化性材料是冷却; 和选择性光聚合物伊辛用于形成微结构结束所需要的区域。

2. 发明公开

EP1659450A1 Apparatus for the fabrication of microstructures 审中-公开
标题翻译： Herstellung von Mikrostrukturen
公开(公告)号：EP1659450A1
公开(公告)日：2006-05-24
申请号：EP05000788.9
申请日：2005-01-17
申请人： Liu, Wai Yip
发明人： Liu, Wai Yip
IPC分类号： G03F7/20 , G03F7/00
CPC分类号： G03F7/7035 , G03F7/707 , G03F7/70991
摘要： The present invention relates to an apparatus for the microfabrication of one or more microstructures. The apparatus includes a first part, at least one supporting member (8) for supporting any or any combination of a mask, an imprinting stamp (5) and/or a wafer (18) in relation to said first part, and a control means. The supporting member (8) is arranged to be selectively movable relative to said first part by way of one or more piezoelectric members under the control of the control means.
摘要翻译：本发明涉及一种用于微细加工一种或多种微结构的装置。该装置包括第一部分，至少一个用于相对于所述第一部分支撑掩模，压印印模（5）和/或晶片（18）的任何或任何组合的支撑部件（8），以及控制装置。支撑构件（8）被布置成在控制装置的控制下通过一个或多个压电构件相对于所述第一部件选择性地可移动。

3. 发明专利

GB2413009A Microfabrication apparatus 未知
公开(公告)号：GB2413009A
公开(公告)日：2005-10-12
申请号：GB0500529
申请日：2005-01-12
申请人： LIU WAI YIP
发明人： LIU WAI YIP
IPC分类号： G03F7/00 , G03F7/20 , H01L21/68
摘要： An apparatus for the microfabrication of microstructures on a semiconductor wafer 18 includes a holder 4 supporting either a photomask or imprinting stamp 5 in relation to a support 13. The holder 4 comprises one or more piezoelectric elements (63, 64 Fig 7b) which expand and contract in the z-direction upon application of a control voltage. By using piezoelectric elements the mask or stamp 5 may be accurately positioned such that vibrations due to noise are reduced. The apparatus also includes two or more operative units 1, 2, 3 which are selectively moved into an operative position at different stages of the microfabrication process. The operative units include a visualization and alignment unit 1, an exposure unit 2 or a hot air injection unit 3.

4. 发明专利

HK1068690A1 Micromachining process for forming microstructureshaving sloping and/or profiled side walls or subs tructures. 未知
公开(公告)号：HK1068690A1
公开(公告)日：2005-04-29
申请号：HK05101009
申请日：2001-01-01
申请人： LIU WAI YIP
发明人： LIU WAI YIP
IPC分类号： B81C1/00 , G03F7/16 , G03F7/20 , G03F7/40 , G03F

5. 发明专利

GB202008087D0 Non-invasive monitor of liquid conductivity equipped with a suction based sensing head 未知
公开(公告)号：GB202008087D0
公开(公告)日：2020-07-15
申请号：GB202008087
申请日：2020-05-29
申请人： LIU WAI YIP , LIU WAI SHUN , LIU YUEN LAM , KANDWAL ABHISHEK , NGUYEN SON THANH , VIRDEE BAL

6. 发明专利

GB202008093D0 Non-invasive monitor of liquid conductivity equipped with a suction based sensing head 未知
公开(公告)号：GB202008093D0
公开(公告)日：2020-07-15
申请号：GB202008093
申请日：2020-05-29
申请人： LIU WAI YIP

7. 发明专利

GB2404454B Micromachining process for forming microstructures having sloping and/or profiled side walls or substructures. 未知
公开(公告)号：GB2404454B
公开(公告)日：2005-06-22
申请号：GB0408169
申请日：2004-04-13
申请人： LIU WAI YIP
发明人： LIU WAI YIP
IPC分类号： B81C1/00 , G03F7/16 , G03F7/20 , G03F7/40 , G03F7/00

8. 发明专利

GB2416599B Fabrication of hollow three dimensional structures 未知
公开(公告)号：GB2416599B
公开(公告)日：2006-11-29
申请号：GB0514003
申请日：2005-07-08
申请人： LIU WAI YIP
发明人： LIU WAI YIP
IPC分类号： G03F7/20 , B81C99/00 , G03F7/00

9. 发明专利

GB2416599A Photolithographical micro fabrication of hollow three dimensional structures with profiled side walls 未知
公开(公告)号：GB2416599A
公开(公告)日：2006-02-01
申请号：GB0514003
申请日：2005-07-08
申请人： LIU WAI YIP
发明人： LIU WAI YIP
IPC分类号： G03F7/00 , B81C99/00 , G03F7/20
摘要： A method for photolithographical mass fabrication of hollow three-dimensional microstructures (14) comprises the steps of: provision of a photocurable material (8, FIG 3) on a substrate (7); provision of light-blocking impurities to the photocurable material to form a photocurable composite (9, FIG 4) having decreased transparency at the photo-curing wavelengths; provision of metal layers (10 FIG 5) to mask off the areas wherein the photocurable composite is not required; deforming the surface of the photocurable composite (FIG 6) when cooling from semi-solid to solid; selectively photopolymerizing the areas which correspond to the hollow microstructures to be formed; and removal of non-polymerized composite underneath the shells (14') of the hollow microstructures by heating (see arrows under item 7).

10. 发明专利

GB2404454A Micro machining process for forming three dimensional micro structures having sloping and/or profiled side walls. 未知
公开(公告)号：GB2404454A
公开(公告)日：2005-02-02
申请号：GB0408169
申请日：2004-04-13
申请人： LIU WAI YIP
发明人： LIU WAI YIP
IPC分类号： B81C1/00 , G03F7/16 , G03F7/20 , G03F7/40 , G03F7/00
摘要： The object of the present invention is to provide a three-dimensional microfabrication method for photolithographic mass-fabrication of three-dimensional microstructures having arbitrarily sloped and/or profiled sidewalls or substructures. The process comprises: locating photo-curable material in a suitable reservoir; dehydrating the photo-curable material (eg by heating); annealing areas forming the upper boundaries of sloped or profiled sidewalls or substructures; providing one or more metal layers masking the areas of the photo-curable material where said material in the micro structure is not required; photolithographically patterning areas to be deformed using polymeric masks; re-heating the material before mechanically disrupting the surface of areas between or enclosed by the annealed areas to form the required sub-structures whilst the photocurable material is cooling; and selectively photopolymerising the regions required for forming the end microstructures.

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