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1. 发明申请

WO1991018422A1 METHOD OF MANUFACTURING THERMOELECTRIC DEVICE 审中-公开
标题翻译：制造热电装置的方法
公开(公告)号：WO1991018422A1
公开(公告)日：1991-11-28
申请号：PCT/JP1991000633
申请日：1991-05-14
申请人： KABUSHIKI KAISHA KOMATSU SEISAKUSHO , KOMATSU ELECTRONICS INC. , YAMASHITA, Masao; , IMAIZUMI, Hisaakira; , MORI, Yukoh
发明人： KABUSHIKI KAISHA KOMATSU SEISAKUSHO , KOMATSU ELECTRONICS INC.
IPC分类号： H01L35/34
CPC分类号： H01L35/04 , H01L35/34
摘要： This method is characterized in that the thermoelectric elements of a thermoelectric device are made by forming solder plating layers (3) on the surfaces of P- and N-type semiconductors (10a and 10b) each having the Peltier effect, and then by cutting the semiconductors into pieces of desired shapes.

2. 发明专利

JP2008112806A Thermoelectric module, and metallized substrate 有权
标题翻译：热电模块和金属化基板
公开(公告)号：JP2008112806A
公开(公告)日：2008-05-15
申请号：JP2006293960
申请日：2006-10-30
申请人： Komatsu Electronics Inc , 小松エレクトロニクス株式会社
发明人： KONISHI AKIO , YAMANASHI MASATAKA , HAJIME TAKAFUMI , FUJIKAWA SHINGO
IPC分类号： H01L35/32 , F25B21/02 , H01L23/38 , H01L35/30
CPC分类号： H01L35/32 , H01L35/04 , H01L35/08 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a small-sized and power-saved thermoelectric module having a small-sized cross-section of a thermoelectric element and also a metallized substrate in the upper part of the cooling side that is not so small from the viewpoint of assembling in order to solve a problem that the thermoelectric element is broken with a thermal stress generated in the assembling process or with a thermal stress generated in the preliminary soldering process conducted when an object to be cooled is mounted because total mechanical strength of the thermoelectric module is lowered due to reduction in the rate of area of the element for the metallized substrate area of the thermoelectric module. SOLUTION: In the thermoelectric module 1 utilizing the Pertier effect, a slit is given to the metallized layers 4a, 4b of the thermoelectric module having an element occupation area rate of 40% or less that is defined in a rate of total sum of the cross-section perpendicular to the current feeding direction of the thermoelectric elements 5a, 5b for the area of an insulated substrate 2a in contact with a cooling object via the metallized layer 4a. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种小型和省电的热电模块，其具有热电元件的小尺寸横截面，并且在冷却侧的上部中还具有金属化基板，其尺寸不那么小从组装的观点出发，为了解决在组装过程中产生的热应力或者在安装被冷却物体时进行的预备焊接工艺中产生的热应力时，热电元件断裂的问题，因为总的机械强度由于热电模块的金属化基板区域的元件的面积的减小而导致热电模块的温度降低。解决方案：在利用Pertier效应的热电模块1中，向热电模块的金属化层4a，4b施加狭缝，该热电模块的元件占用面积率为总和的总和的40％以下垂直于热电元件5a，5b的电流馈送方向的横截面，用于经由金属化层4a与冷却对象接触的绝缘基板2a的区域。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2008077575A Temperature controller and control method for fluid 有权
标题翻译：温度控制器和流体控制方法
公开(公告)号：JP2008077575A
公开(公告)日：2008-04-03
申请号：JP2006258995
申请日：2006-09-25
申请人： Komatsu Electronics Inc , 小松エレクトロニクス株式会社
发明人： MIMURA KAZUHIRO
IPC分类号： G05D23/00 , G05B11/36 , G05B13/04 , G05D23/19
CPC分类号： G05D23/19
摘要： PROBLEM TO BE SOLVED: To restrain the number of temperature sensors without impairing a degree of freedom for control, in a temperature controller for a fluid.
SOLUTION: An estimation device 6 estimates an outlet temperature of the fluid in an outlet of a heating vessel 15a provided with no outlet temperature sensor. A control part 5 determines a control input based on the measured outlet temperature and a target temperature, in the heating vessel 15a provided with an outlet temperature sensor 16, and determines the control input based on the estimated temperature estimated by the estimation device 6 and the target temperature, in the heating vessel 15a provided with no outlet temperature sensor.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：在流体的温度控制器中，为了抑制温度传感器的数量而不损害控制的自由度。解决方案：估计装置6估计没有出口温度传感器的加热容器15a的出口中的流体的出口温度。控制部件5在设置有出口温度传感器16的加热容器15a中基于所测量的出口温度和目标温度来确定控制输入，并且基于由估计装置6估计的估计温度和在没有出口温度传感器的加热容器15a内的目标温度。版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2008077165A Fluid temperature controller and fluid temperature control method 审中-公开
标题翻译：流体温度控制器和流体温度控制方法
公开(公告)号：JP2008077165A
公开(公告)日：2008-04-03
申请号：JP2006252628
申请日：2006-09-19
申请人： Komatsu Electronics Inc , 小松エレクトロニクス株式会社
发明人： MIMURA KAZUHIRO
IPC分类号： G05D23/19 , G05D23/00
摘要： PROBLEM TO BE SOLVED: To regulate a temperature without impairing stability, while enhancing responsiveness, in a fluid temperature controller.
SOLUTION: A feedforward control part 51 calculates required electric power, based on a target temperature of a fluid, a flow rate per unit time, and an inlet temperature. Further, the required electric power is distributed to each heater 25 to determine a manipulated variable MVj_a for operating each heater 25 according to the distributed electric power. A target temperature SVj for each heating vessel 15 is also calculated. A feedback control part 52 in each stage determines a manipulated variable MVj_b for operating each heater 25, based on the target temperature SVj for each heating vessel 15 and an outlet temperature Toutj. A power module 28 in each stage controls the heater 25 based on total manipulated variable.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：在流体温度控制器中同时提高响应性的同时调节温度而不损害稳定性。解决方案：前馈控制部件51基于流体的目标温度，每单位时间的流量和入口温度来计算所需的电力。此外，所需的电力被分配到每个加热器25，以确定用于根据分布式电力来操作每个加热器25的操纵变量MVj_a。还计算每个加热容器15的目标温度SVj。基于每个加热容器15的目标温度SVj和出口温度Toutj，每个阶段中的反馈控制部分52确定用于操作每个加热器25的操纵变量MVj_b。每个级中的功率模块28基于总操作变量来控制加热器25。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2006234362A Heat exchanger and method of manufacturing the same 审中-公开
标题翻译：热交换器及其制造方法
公开(公告)号：JP2006234362A
公开(公告)日：2006-09-07
申请号：JP2005053629
申请日：2005-02-28
申请人： Komatsu Electronics Inc , 小松エレクトロニクス株式会社
发明人： TAKAHASHI NORIO , KIYOZAWA KO
IPC分类号： F25B21/02
CPC分类号： F25B21/04 , F25B2321/023 , H01L35/08 , H01L35/32
摘要： PROBLEM TO BE SOLVED: To improve a yield in manufacturing a heat exchanger by securing insulation between a heat exchanging member and a thermoelectric converting element module.
SOLUTION: Resins 5, 6 as insulating layers are placed between heat radiation-side and heat absorption-side heat exchanging members 2, 3 and between heat radiation-side and heat absorption-side electrodes 41, 42 of the thermoelectric converting element module 4, respectively. The resin 5 is welded to the heat radiation-side heat exchanging member 2, and the resin 6 is welded to the heat absorption-side heat exchanging member 3. A material of the resin 5, 6 is, for example, thermosetting plastic. The thermosetting plastic is softened by heating, and then hardened. In welding the resin 5, 6 to the heat exchanging members 2, 3, the heat exchanging members 2, 3 and the resins 5, 6 are heated and pressed. Then, the resins 5, 6 are softened and intrude into cavities and scratches on surfaces of the heat exchanging members 2, 3. The resins 5, 6 intruding in the cavities and scratches are hardened to bury the cavities existing on the surfaces of the heat exchanging members 2, 3.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：通过确保热交换构件和热电转换元件模块之间的绝缘来提高热交换器的制造成品率。解决方案：作为绝缘层的树脂5,6被放置在热辐射侧和吸热侧热交换构件2,3之间以及热电转换元件的散热侧和吸热侧电极41,42之间模块4。将树脂5焊接到散热侧热交换构件2，并且将树脂6焊接到吸热侧热交换构件3.树脂5,6的材料例如是热固性塑料。热固性塑料通过加热软化，然后硬化。在将树脂5,6焊接到热交换构件2,3的同时，将热交换构件2,3和树脂5,6加热并加压。然后，树脂5,6被软化并侵入到热交换构件2,3的表面上的空腔和划痕中。侵入空腔和划痕中的树脂5,6被硬化以掩埋存在于热表面上的空腔交换成员2，3。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2006210732A Device for discriminating temperature adjustment target 有权
标题翻译：用于分辨温度调节目标的装置
公开(公告)号：JP2006210732A
公开(公告)日：2006-08-10
申请号：JP2005022168
申请日：2005-01-28
申请人： Komatsu Electronics Inc , 小松エレクトロニクス株式会社
发明人： HOZUMI YOSHIYUKI
IPC分类号： H01L21/02
CPC分类号： H01L21/67288 , H01L21/67253
摘要： PROBLEM TO BE SOLVED: To enable automatic discrimination of a temperature adjustment target and elimination of a set error for a target flow. SOLUTION: Of a characteristic (a) of a process chamber 21a having a large pressure loss and a characteristic (b) of a process chamber 21b having a small pressure loss, a threshold A (flow value Q3, pressure value P3) is set on the characteristic (a). The threshold A is set in a controller 9. When the amount of flow passed through pipe lines 1, 2 and a passage of the process chamber 21 is increased, the flow amount is measured by a flow meter 4, and the pressure of the flow is measured by a pressure switch 5. When the pressure reaches the value P3 upon arrival of the flow amount at the value Q3, the pressure switch 5 is actuated. In this case, the controller 9 determines that the process chamber 21a having the large pressure loss is connected to the pipe lines 1, 2. When the pressure fails to reach the value P3, the controller 9 determines that the process chamber 21b having the small pressure loss is connected to the pipe lines 1, 2. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：能够自动区分温度调节目标并消除目标流量的设定误差。解决方案：在压力损失大的处理室21a的特征（a）和压力损失小的处理室21b的特性（b）中，阈值A（流量值Q3，压力值P3）设置在特性（a）上。阈值A设置在控制器9中。当流经管线1,2的流量和处理室21的通过量增加时，流量由流量计4测量，流量压力由压力开关5测量。当流量达到值Q3时压力达到值P3时，压力开关5被致动。在这种情况下，控制器9确定具有大的压力损失的处理室21a连接到管道1,2。当压力未达到值P3时，控制器9确定处理室21b具有小的压力损失与管道1,2连接。版权所有：（C）2006，JPO＆NCIPI

7. 发明专利

JP2004221259A Thermoelectric transducer module and electronic cooling device using this 审中-公开
公开(公告)号：JP2004221259A
公开(公告)日：2004-08-05
申请号：JP2003006002
申请日：2003-01-14
申请人： Komatsu Electronics Inc , 小松エレクトロニクス株式会社
发明人： HAJIME TAKAFUMI
IPC分类号： H01L23/38 , H01L35/32 , H01L35/34
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To effectively cool optical components without having effect on an optical pass when direct abutting with the whole surface of the optical components is performed. SOLUTION: In a Peltier module 10, an upper substrate 11a and a lower substrate 11b are constituted of transparent member like sapphire glass. Thermoelectric transducer elements 12a, 12b are arranged only in an outer peripheral part in a region forming a rectangle as a whole along the substrates 11a, 11b. The central part (unarrangement region 15 of thermoelectric transducer element) is a part where the element is not arranged. In the Peltier module 10 of this configuration, the transparent regions corresponding to the unarrangement regions 15 and the transparent regions corresponding to the unarrangement regions 15 in the upper and lower substrates 11a, 11b function as optical pass windows. Light can be passed through the upper substrate 11a and the lower substrate 11b. COPYRIGHT: (C)2004,JPO&NCIPI

8. 发明专利

JP2003056995A Heat exchanger 审中-公开
标题翻译：热交换器
公开(公告)号：JP2003056995A
公开(公告)日：2003-02-26
申请号：JP2001249138
申请日：2001-08-20
申请人： Komatsu Electronics Inc , 小松エレクトロニクス株式会社
发明人： ONISHI TETSUO , TAKAHASHI NORIO , MOCHIZUKI SADASHIGE
IPC分类号： F25B21/02 , F28F1/40 , F28F13/02 , F28F13/12 , H01L35/30 , H01L35/32
CPC分类号： F28F1/40
摘要： PROBLEM TO BE SOLVED: To provide a heat exchanger channel having high heat transfer performance and directivity by configuring a new channel heating surface profile which can not only accelerate total average heat transfer utilizing a secondary flow but also enhance heat transfer at some fixed part given in the circumferential direction of the pipe wall concentrically.
SOLUTION: In the heat exchanger for exchanging heat through a fluid 2 flowing through the inner channel of a circular tube 1, an annular elliptical member for inducing separation/secondary flow (rib part) 10 is provided in the circular tube 1 while inclining against the tube axis in order to generate a secondary flow in the downstream of the rib thus making thin the boundary layer in the vicinity of the heating surface and promoting heat transfer performance on the heating surface.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了通过配置新的通道加热表面轮廓来提供具有高传热性能和方向性的热交换器通道，其不仅可以加速使用二次流的总平均热传递，而且还可以增强在管壁的圆周方向同心。解决方案：在通过流过圆管1的内通道的流体2进行热交换的热交换器中，在圆管1中设置用于引导分离/二次流的环形椭圆形构件（肋部）10，以在肋的下游产生二次流，从而使加热表面附近的边界层变薄，并提高加热面上的热传递性能。

9. 发明专利

JP2008202816A Fluid temperature control device 有权
标题翻译：流体温度控制装置
公开(公告)号：JP2008202816A
公开(公告)日：2008-09-04
申请号：JP2007036592
申请日：2007-02-16
申请人： Komatsu Electronics Inc , 小松エレクトロニクス株式会社
发明人： TAKECHI HIROAKI
IPC分类号： F24H1/10 , H01L21/304 , H01L21/306
CPC分类号： F25B21/04 , F25B2400/01 , G05D23/19
摘要： PROBLEM TO BE SOLVED: To provide a fluid temperature control device capable of quickly and precisely performing temperature control to a temperature-controlled fluid, and minimizing a device as small as possible, with respect to the fluid temperature control device suitably used for management of the temperature of process liquid, in particular, in a manufacturing process of a semiconductor device. SOLUTION: This fluid temperature control device comprises a main body block provided with a channel groove, a heat transfer plate disposed on a surface of the main body block and forming a flow channel in which the temperature-controlled fluid passes, a heater for heating the temperature-controlled fluid passing through the flow channel through the heat transfer plate, and a thermoelectric module for heating and cooling the temperature-controlled fluid passing through the flow channel through the heat transfer plate. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种流体温度控制装置，其能够快速且精确地对温度控制的流体进行温度控制，并且使相对于适合用于尤其是在半导体器件的制造过程中，处理液的温度的管理。解决方案：该流体温度控制装置包括设置有沟槽的主体块，设置在主体块的表面上的传热板，形成温度控制流体通过的流路，加热器用于加热通过流路的温度控制流体通过传热板;以及热电模块，用于加热和冷却通过流路的温度控制流体通过传热板。版权所有（C）2008，JPO＆INPIT

10. 发明专利

JP2006066460A Thermoelectric element 审中-公开
标题翻译：热电元件
公开(公告)号：JP2006066460A
公开(公告)日：2006-03-09
申请号：JP2004244150
申请日：2004-08-24
申请人： Komatsu Electronics Inc , Komatsu Ltd , 小松エレクトロニクス株式会社 , 株式会社小松製作所
发明人： ISHIMABUSE HIRONOBU , SANO SEIJIRO , UMIBE HIROMASA , OMORI KEIICHI
IPC分类号： H01L35/32 , H01L35/08 , H02N11/00
摘要： PROBLEM TO BE SOLVED: To prevent breakdown of a thermoelectric element being employed in a thermoelectric module. SOLUTION: In the thermoelectric element, at least one of vertexes on face A touching an electrode is beveled. COPYRIGHT: (C)2006,JPO&NCIPI

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