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    • 1. 发明授权
    • Process for a low back-action, quasi-hermetic covering of susceptible
physical structures
    • 低反作用,准密封覆盖易感物理结构的过程
    • US4464419A
    • 1984-08-07
    • US418245
    • 1982-09-14
    • Klaus Horn
    • Klaus Horn
    • B32B7/04B32B17/06B32B19/04G01B7/16G01L1/22G12B9/04H05K5/00
    • G01L1/2287Y10S33/13
    • A method for quasi-hermetically covering physical structures on structure supports is described, which is low in its back-action on the structures to be protected and is especially suited for covering strain guage strips on cantilever beam measuring springs. In the method films made of a vacuum-tight, inorganic material are used as the covering substance, these films intimately joining both the structure to be protected and the surface zone of the support in the immediate vicinity of the structure. The use of films of monocrystalline structure, for instance mica films, is especially recommended, and it also is recommended to decrease the thickness of these films, once they are deposited, by suitable procedures such as etching or cleaving off crystal layers.
    • 描述了一种用于准气密地覆盖结构支架上的物理结构的方法,其对待保护结构的反作用低,并且特别适用于在悬臂梁测量弹簧上覆盖应变片。 在该方法中,使用由真空密封的无机材料制成的膜作为覆盖物质,这些膜紧密结合待结构的被保护结构和支撑体的表面区域。 特别推荐使用单晶结构的膜,例如云母膜,并且通过适当的方法,例如蚀刻或切除晶体层,建议降低这些膜的厚度。