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1. 发明公开

US20230393480A1 MANUFACTURING METHOD OF FLEXOGRAPHIC PRINTING PLATE 审中-公开
公开(公告)号：US20230393480A1
公开(公告)日：2023-12-07
申请号：US18452721
申请日：2023-08-21
申请人： FUJIFILM Corporation
发明人： Kenji KANO
IPC分类号： G03F7/12 , B41C1/10
CPC分类号： G03F7/12 , B41C1/1008 , B41C2210/04
摘要： Provided is a manufacturing method of a flexographic printing plate, which achieves both a depth of a concave portion and reproducibility of independent dots by eliminating an insufficient depth of the concave portion and increasing a cured region around the independent dots. The manufacturing method of a flexographic printing plate includes an exposure step of irradiating, with an energy ray, a flexographic printing plate precursor which includes, in the following order, at least a support, a photosensitive layer, and a mask portion on which an image is formed, through the mask portion to expose the photosensitive layer, and a development step of removing a non-exposed portion of the photosensitive layer. The exposure step includes a step of radiating the energy ray in a state in which, from the photosensitive layer side, the mask portion and a film-like optical element are present in this order between an energy source and the photosensitive layer. The film-like optical element is an element which converges the incident energy ray to enhance directivity and emits the energy ray to the mask portion.

2. 发明申请

US20220199117A1 MAGNETIC TAPE DEVICE, MAGNETIC TAPE, AND MAGNETIC TAPE CARTRIDGE 有权
公开(公告)号：US20220199117A1
公开(公告)日：2022-06-23
申请号：US17645699
申请日：2021-12-22
申请人： FUJIFILMCorporation
发明人： Norihito KASADA
IPC分类号： G11B15/093 , G11B5/008 , G11B5/78
摘要： A magnetic tape device; a magnetic tape; and a magnetic tape cartridge, in which the magnetic tape is caused to run between a winding reel and a cartridge reel in a state where a tension is applied in a longitudinal direction and a maximum value of the tension is 0.50 N or more, and the magnetic tape after running in a state where the tension is applied is wound around the cartridge reel by applying a tension of 0.40 N or less in the longitudinal direction of the magnetic tape, and the number of recesses having an equivalent circle diameter of 0.20 μm to 0.50 μm existing on a surface of the magnetic layer of the magnetic tape is 10 to 500 per 40 μm×40 μm area.

3. 发明授权

US07550813B2 Photoelectric converting film stack type solid-state image pickup device, and method of producing the same 有权
标题翻译：光电转换膜堆叠式固态摄像装置及其制造方法
公开(公告)号：US07550813B2
公开(公告)日：2009-06-23
申请号：US11133381
申请日：2005-05-20
申请人： Nobuo Suzuki
发明人： Nobuo Suzuki
IPC分类号： H01L31/18
CPC分类号： H01L27/14636 , H01L27/14609 , H01L27/14647 , H01L27/14687
摘要： A solid-state image pickup device comprises: a plurality of photoelectric converting films stacked via an insulating layer, the photoelectric converting films being above a semiconductor substrate in which a signal read circuit is formed, in which each of the photoelectric converting films is sandwiched between a pixel electrode film and an opposing electrode film, wherein the pixel electrode film of an upper one of the photoelectric converting films is connected to the signal read circuit by a longitudinal line passing through a lower one of the photoelectric converting films, and, in the longitudinal line, a passing portion which passes through the lower photoelectric converting film is formed by filling an opening with a conductive material, the opening being formed from a same plane of the pixel electrode film stacked on the lower photoelectric converting film to an upper end face of the insulating layer stacked above the photoelectric converting film.
摘要翻译：一种固态摄像装置，包括：多个通过绝缘层堆叠的光电转换膜，所述光电转换膜位于形成有信号读取电路的半导体衬底之上，其中每个光电转换膜夹在像素电极膜和相对电极膜，其中上部光电转换膜的像素电极膜通过穿过下一个光电转换膜的纵向线连接到信号读取电路，并且在纵向线，通过下部光电转换膜的通过部分通过用导电材料填充开口而形成，该开口由堆叠在下部光电转换膜上的像素电极膜的同一平面形成为上端面的绝缘层堆叠在光电转换膜上。

4. 发明授权

US07855136B2 Method of mounting semiconductor chip to circuit substrate using solder bumps and dummy bumps 有权
标题翻译：使用焊锡凸块和虚拟凸块将半导体芯片安装到电路基板的方法
公开(公告)号：US07855136B2
公开(公告)日：2010-12-21
申请号：US12007933
申请日：2008-01-17
申请人： Hidenobu Takahira
发明人： Hidenobu Takahira
IPC分类号： H01L21/44
CPC分类号： H01L24/10 , H01L23/3114 , H01L23/525 , H01L24/13 , H01L24/81 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05124 , H01L2224/05572 , H01L2224/05647 , H01L2224/05666 , H01L2224/05684 , H01L2224/13 , H01L2224/13099 , H01L2224/14 , H01L2224/16 , H01L2224/16225 , H01L2224/81143 , H01L2224/8121 , H01L2224/8123 , H01L2224/81815 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/014 , H01L2924/14 , H01L2924/3511 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor chip comprises a silicon substrate on which semiconductor elements are formed, pads, each of which is formed on the silicon substrate and electrically connected to at least one of the semiconductor elements, a first insulating layer having an opening over each one of the pads, a first wiring layer formed on the first insulating layer, electrically connected to the pads and having connecting parts, a second insulating layer formed on the first wiring layer and having openings over the connecting parts of the first wiring layer, electrically functioning solder bumps, each of which is formed on one of the openings of the second insulating layer with electrically connecting to one of the pads via the first wiring layer, and dummy bumps for self adjustment, each of which is formed on one of the openings of the second insulating layer without electrically connecting to the pad.
摘要翻译：半导体芯片包括其上形成有半导体元件的硅衬底，每个衬底形成在硅衬底上并且与至少一个半导体元件电连接的焊盘，在每个焊盘上具有开口的第一绝缘层形成在所述第一绝缘层上的第一布线层，电连接到所述焊盘并具有连接部分，形成在所述第一布线层上并且在所述第一布线层的连接部分上方具有开口的第二绝缘层，电功能焊料凸块，每一个形成在第二绝缘层的一个开口上，经由第一布线层电连接到一个焊盘，以及用于自调整的虚拟凸块，每个都形成在第二绝缘层的一个开口上层，而不与垫连接。

5. 发明授权

US07385231B2 Porous thin-film-deposition substrate, electron emitting element, methods of producing them, and switching element and display element 有权
标题翻译：多孔薄膜沉积基板，电子发射元件，它们的制造方法以及开关元件和显示元件
公开(公告)号：US07385231B2
公开(公告)日：2008-06-10
申请号：US11513223
申请日：2006-08-31
申请人： Kiyoshi Fujimoto , Masakazu Nakamura
发明人： Kiyoshi Fujimoto , Masakazu Nakamura
IPC分类号： H01L29/74
CPC分类号： H01L51/0508 , H01J9/025 , Y10S977/938
摘要： A method of producing a porous thin-film-deposition substrate, which has the steps of: placing onto a substrate that has an electrostatic charge on its surface, fine particles with a surface electrostatic charge opposite to the electrostatic charge of the substrate surface, depositing a thin film on the fine-particle-placed substrate, and then removing the fine particles to form fine pores in the thin film; further, a method of producing an electron emitting element, which has the steps of: adding a catalyst metal on a substrate, placing fine particles onto the catalyst-added substrate, depositing a thin film on the fine-particle-placed substrate, then removing the fine particles to form fine pores in the film, and growing needle-shaped conductors on the catalyst metal that is exposed on a bottom face of the fine pore.
摘要翻译：一种多孔薄膜沉积基板的制造方法，其特征在于，具有以下步骤：在表面具有静电电荷的基板上放置表面静电电荷与基板表面的静电电荷相反的微粒，在微细颗粒放置的基板上的薄膜，然后除去细颗粒以在薄膜中形成细孔; 此外，制造电子发射元件的方法具有以下步骤：在基板上添加催化剂金属，将细颗粒放置在添加有催化剂的基板上，在被微粒放置的基板上沉积薄膜，然后除去该微细颗粒在膜中形成细孔，并且在细孔的底面上露出的催化剂金属上生长的针状导体。

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