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1. 发明专利

JP2020134943A n型コンタクト間の改善された電気的分離を有するフォトニック集積回路审中-公开
公开(公告)号：JP2020134943A
公开(公告)日：2020-08-31
申请号：JP2020022195
申请日：2020-02-13
申请人：エフェクトフォトニクスベーハー , EFFECT Photonics B.V.
发明人：クインダースマ・ピエター・イディス , ドクター・ボウデヴァイン
IPC分类号： G02B6/12 , H01S5/026 , H01L31/0232 , G02F1/025
摘要：【課題】PICの異なる光電子デバイスのn型ドープ・コンタクト領域間の改善された電気的分離を有するPICを提供する。【解決手段】第1の光電子デバイス10および第2の光電子デバイス12が、ひ化リン化インジウムガリウムを含む非意図的ドープ導波層9内に製造される受動光導波路14によって光学的に相互接続される第1および第2の光電子デバイスのそれぞれのn型コンタクト領域の間に電気的バリアを提供するための少なくとも1つの選択p型ドープ管状領域6が設けられるn型リン化インジウム・ベースのコンタクト層3を備えるエピタキシャル層スタック2を有する半導体ウェハ上に製造され、非意図的ドープ導波層が、n型コンタクト層の上に配置され、少なくとも1つの選択p型ドープ管状領域の第1の部分15が、第1の光電子デバイスと第2の光電子デバイスとの間の受動光導波路の真下に配置される。【選択図】図3

2. 发明申请

WO2014148901A1 INTEGRATED PHOTONIC COMPONENT AND METHOD OF DESIGNING THE SAME 审中-公开
标题翻译：集成光电元件及其设计方法
公开(公告)号：WO2014148901A1
公开(公告)日：2014-09-25
申请号：PCT/NL2014/050170
申请日：2014-03-20
申请人： EFFECT PHOTONICS B.V.
发明人： DOCTER, Boudewijn
IPC分类号： G02B6/12
CPC分类号： G02B6/12023 , G02B6/12009 , G02B6/12014 , G02B6/12019 , G02B6/2773 , G02B6/29302 , G02B6/29344 , G02B6/29352 , G02B6/2938 , G02B6/29395
摘要： The invention provides an integrated photonic component (100) for polarization insensitive wavelength multiplexing comprising an arrayed waveguide grating, AWG, (1) having a predetermined polarization splitting and a MZI-based polarization beam splitter (8) that is configured to compensate the predetermined polarization splitting of the AWG (1). The result is a fabrication tolerant integrated photonic component (100) that is operable over a wide number of limited bandwidth wavelength channels of a wavelength division multiplexing, WDM, system. The invention further provides a photonic integrated circuit, PIC, (200) for use in a WDM system. The PIC (200) comprises the integrated photonic component (100) of the invention. Furthermore, the invention provides a method of designing the integrated photonic component (100) set forth.
摘要翻译：本发明提供了一种用于偏振不敏感波长多路复用的集成光子分量（100），其包括阵列波导光栅AWG（1）和具有预定偏振分束的基于MZI的偏振分束器（8），其被配置为补偿预定极化分裂AWG（1）。结果是可以在波分复用WDM系统的大量有限带宽波长信道上操作的制造容限集成光子分量（100）。本发明还提供了一种用于WDM系统的光子集成电路PIC（200）。 PIC（200）包括本发明的集成光子组件（100）。此外，本发明提供了一种设计集成光子组件（100）的方法。

3. 发明申请

WO2013141701A1 AN ASSEMBLY AND A CHIP PACKAGE 审中-公开
标题翻译：组装和芯片包装
公开(公告)号：WO2013141701A1
公开(公告)日：2013-09-26
申请号：PCT/NL2013/050200
申请日：2013-03-18
申请人： EFFECT PHOTONICS B.V.
发明人： MUSK, Robert William
IPC分类号： H01L23/498
CPC分类号： H01L23/4985 , G02B6/12 , H01L23/3142 , H01L24/14 , H01L2224/13144 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2924/01029 , H01L2924/01322 , H01L2924/10335 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： An assembly (60) comprising a substrate (1) that is provided with at least one electrical contact (3a), a flexible printed circuit membrane (51) comprising an electrically insulating film (6) and an electrically conducting layer (7) that is at least partially covering the insulating film (6).The conducting layer (7) is at least locally accessible from outside of the membrane (51).A connection means (10) is further provided for electrically connecting the at least one electrical contact (3a) and the conducting layer (7) at a position where the conducting layer (7) is accessible, to form an electrical connection between the substrate (1) and the membrane (51). A chip package (70) comprising a housing (15) having at least one electrically conducting terminal, and an assembly (60) as mentioned. The flexible printed circuit membrane (51) is arranged for electrically connecting the substrate (1) and the at least one terminal of the housing (15).
摘要翻译：一种包括设置有至少一个电触头（3a）的基板（1）的组件（60），包括电绝缘膜（6）和导电层（7）的柔性印刷电路膜（51）至少部分地覆盖绝缘膜（6）。导电层（7）至少可局部地从膜（51）的外部接近。一个连接装置（10）还被设置用于电连接至少一个电触头在导电层（7）可接近的位置处的导电层（7）和导电层（7）之间形成电连接。一种芯片封装（70），包括具有至少一个导电端子的壳体（15）和如上所述的组件（60）。柔性印刷电路膜（51）被布置用于电连接基板（1）和壳体（15）的至少一个端子。

4. 发明申请

WO2015012693A1 OPTICAL SUBASSEMBLY, OPTICAL SYSTEM AND METHOD 审中-公开
标题翻译：光学分组，光学系统和方法
公开(公告)号：WO2015012693A1
公开(公告)日：2015-01-29
申请号：PCT/NL2014/050509
申请日：2014-07-24
申请人： EFFECT PHOTONICS B.V.
发明人： MUSK, Robert William , KOENE, Tim
IPC分类号： G02B6/30 , G02B6/42
CPC分类号： G02B6/305 , G02B6/30 , G02B6/4212 , G02B6/4253
摘要： The invention relates to an optical subassembly (1) comprising a photonic integrated circuit (2), an external optical system (4) and an optical interface (6) that is arranged between the PIC and the external optical system. The optical subassembly comprises a third material (7) and a fourth material (8). The third material (7) at least partially fills the optical interface between the PIC and the external optical system in order to minimize contamination of any kind. The fourth material (8) being in contact at least with the third material for sealing at least the third material from ambient moisture. In this way a low-cost near-hermetic environmental protection barrier (7, 8) may be provided. The invention also relates to an optical system (14) comprising an optical subassembly according to the invention and to a method of fabricating such an optical subassembly.
摘要翻译：本发明涉及一种包括光子集成电路（2），外部光学系统（4）和布置在PIC和外部光学系统之间的光学接口（6）的光学子组件（1）。光学子组件包括第三材料（7）和第四材料（8）。第三材料（7）至少部分地填充PIC和外部光学系统之间的光学界面，以便使任何种类的污染最小化。所述第四材料（8）至少与所述第三材料接触，用于至少将来自周围水分的第三材料密封。以这种方式，可以提供低成本的近密闭环境保护屏障（7,8）。本发明还涉及包括根据本发明的光学子组件和制造这种光学子组件的方法的光学系统（14）。

5. 发明申请

WO2014148902A1 INTEGRATED PHOTONIC COMPONENT AND METHOD 审中-公开
标题翻译：集成光电子元件和方法
公开(公告)号：WO2014148902A1
公开(公告)日：2014-09-25
申请号：PCT/NL2014/050171
申请日：2014-03-20
申请人： EFFECT PHOTONICS B.V.
发明人： DOCTER, Boudewijn
IPC分类号： G02B6/12
CPC分类号： G02B6/12033 , G02B6/12004 , G02B6/12011 , G02B6/12019 , G02B6/2938 , G02B6/4286 , H04J14/02
摘要： The invention provides an integrated photonic component (1) with improved centering of an optical field image of a wavelength division multiplexing, WDM, optical output signal and a common output waveguide(8). In this way an efficient power coupling of the laser diodes of the integrated photonic component to the common output waveguide is achievable. The invention further provides a photonic integrated circuit, PIC, for use in a WDM optical communication system, the PIC comprising the component according to the invention. The invention further provides a method of improving centering of an optical field image of a WDM signal and a common output waveguide of at least one of the integrated photonic component and the PIC according to the invention.
摘要翻译：本发明提供了一种具有波分复用，WDM，光输出信号和公共输出波导（8）的光场图像的改进对中的集成光子分量（1）。以这种方式，可以实现集成光子分量的激光二极管与公共输出波导的有效功率耦合。本发明还提供了一种用于WDM光通信系统的光子集成电路PIC，PIC包括根据本发明的部件。本发明还提供了一种改进根据本发明的集成光子分量和PIC中的至少一个的WDM信号和公共输出波导的光场图像的定心的方法。

6. 发明申请

WO2015012694A1 OPTICAL SUBASSEMBLY, OPTICAL SYSTEM AND METHOD 审中-公开
标题翻译：光学分组，光学系统和方法
公开(公告)号：WO2015012694A1
公开(公告)日：2015-01-29
申请号：PCT/NL2014/050510
申请日：2014-07-24
申请人： EFFECT PHOTONICS B.V.
发明人： MUSK, Robert William
IPC分类号： G02B6/30 , G02B6/42 , G02B6/36
CPC分类号： G02B6/30 , G02B6/12002 , G02B6/13 , G02B6/3652 , G02B6/423 , G02B6/4239
摘要： The invention relates to an optical subassembly (1) comprising a carrier substrate(2), a photonic integrated circuit (3) (PIC) comprising a first optical waveguide (4) having a first longitudinal central axis, the PIC being arranged on the carrier substrate, an external optical system (5) comprising a second optical waveguide (6) having a second longitudinal central axis, a component (7) for supporting the external optical system on the carrier substrate and maintaining alignment of the first and second longitudinal central axes with respect to each other, and an adhesive material (8, 9) being arranged between the component and the carrier substrate and between the component and the external optical system, the adhesive material having a total thickness of less than10µm. The invention also relates to an optical system(12) comprising an optical subassembly according to the invention and to a method of fabricating an optical subassembly according to the invention.
摘要翻译：本发明涉及一种包括载体衬底（2）的光学子组件（1），包括具有第一纵向中心轴的第一光波导（4）的光子集成电路（3）（PIC），所述PIC布置在载体上基板，包括具有第二纵向中心轴线的第二光波导（6）的外部光学系统（5），用于将外部光学系统支撑在载体基板上并保持第一和第二纵向中心轴线并且粘合材料（8,9）布置在部件和载体基板之间以及部件和外部光学系统之间，粘合材料具有小于10μm的总厚度。本发明还涉及一种包括根据本发明的光学子组件和根据本发明的制造光学子组件的方法的光学系统（12）。

7. 发明公开

US20230198227A1 OPTO-ELECTRONIC SYSTEM AND METHOD 审中-公开
公开(公告)号：US20230198227A1
公开(公告)日：2023-06-22
申请号：US18083892
申请日：2022-12-19
申请人： EFFECT Photonics B.V.
发明人： Sian Chong Jeffrey LEE , Aaron ALBORES-MEJIA , Emil KLEIJN , Erwin Mathijn VAN VLIET
IPC分类号： H01S5/11 , H01S5/026 , H01S5/00
CPC分类号： H01S5/11 , H01S5/0264 , H01S5/0071
摘要： An opto-electronic system including a PIC that includes a semiconductor-based tunable laser source that can achieve single-mode lasing thereby emitting optical radiation having a predefined linewidth at a predefined operating wavelength. The PIC also includes an optical measurement unit that can receive the optical radiation emitted by said laser source, and provide a signal representative for the received optical radiation to a control unit of the opto-electronic system that is operatively connected with said laser source and the optical measurement unit. The opto-electronic system enables omitting external optical measurement equipment thereby enabling a faster and cheaper way of locking of the predefined operating wavelength of said laser and achieving the predefined linewidth. A method of improved tuning of a semiconductor-based tunable laser source of an opto-electronic system.

8. 发明授权

US09488785B2 Optical subassembly, optical system and method 有权
标题翻译：光学组件，光学系统和方法
公开(公告)号：US09488785B2
公开(公告)日：2016-11-08
申请号：US14907074
申请日：2014-07-24
申请人： EFFECT PHOTONICS B.V.
发明人： Robert William Musk
IPC分类号： G02B6/30 , G02B6/36 , G02B6/42 , G02B6/12 , G02B6/13
CPC分类号： G02B6/30 , G02B6/12002 , G02B6/13 , G02B6/3652 , G02B6/423 , G02B6/4239
摘要： Disclosed is an optical subassembly (1) including a carrier substrate (2), a photonic integrated circuit (3) (PIC) including a first optical waveguide (4) having a first longitudinal central axis, the PIC being arranged on the carrier substrate, an external optical system (5) including a second optical waveguide (6) having a second longitudinal central axis, a component (7) for supporting the external optical system on the carrier substrate and maintaining alignment of the first and second longitudinal central axes with respect to each other, and an adhesive material (8, 9) being arranged between the component and the carrier substrate and between the component and the external optical system, the adhesive material having a total thickness of less than 10 μm. Also disclosed is an optical system (12) including such optical subassembly and a method of fabricating such optical subassembly.
摘要翻译：公开了一种包括载体衬底（2）的光学子组件（1），包括具有第一纵向中心轴的第一光波导（4）的光子集成电路（3）（PIC），PIC被布置在载体衬底上，包括具有第二纵向中心轴的第二光波导（6）的外部光学系统（5），用于将外部光学系统支撑在载体基板上的部件（7），并且保持第一和第二纵向中心轴线对准并且粘合材料（8,9）布置在所述部件和所述载体基板之间以及所述部件和所述外部光学系统之间，所述粘合材料具有小于10μm的总厚度。还公开了包括这种光学子组件的光学系统（12）和制造这种光学子组件的方法。

9. 发明授权

US12125805B2 Environmentally protected photonic integrated circuit 有权
公开(公告)号：US12125805B2
公开(公告)日：2024-10-22
申请号：US17541374
申请日：2021-12-03
申请人： EFFECT PHOTONICS B.V.
发明人： Tsjerk Hans Hoekstra
IPC分类号： H01L23/00 , H01L23/29 , H01L23/31
CPC分类号： H01L23/564 , H01L23/293 , H01L23/3192
摘要： An environmentally protected photonic integrated circuit, PIC, including an indium phosphide-based substrate that is at least partially covered with an epitaxial semiconductor layer. The InP-based substrate and/or the epitaxial layer are covered with a layer stack comprising different non-semiconductor layers. At least a first layer of the layer stack is provided with a through-hole that is arranged at a predetermined location. The InP-based substrate or epitaxial layer being accessible via the through-hole. The PIC including a dielectric protective layer covering the layer stack thereby provides a mechanical coupling structure. The protective layer is configured to protect the PIC from environmental contaminants. An opto-electronic system including the PIC.

10. 发明授权

US11899254B2 Photonic integrated circuit and opto-electronic system comprising the same 有权
公开(公告)号：US11899254B2
公开(公告)日：2024-02-13
申请号：US17695935
申请日：2022-03-16
申请人： EFFECT PHOTONICS B.V.
发明人： Tsjerk Hans Hoekstra
IPC分类号： G02B6/42
CPC分类号： G02B6/4253 , G02B6/4239 , G02B6/4243
摘要： A photonic integrated circuit including an InP-based substrate that is provided with a first InP-based optical waveguide and a neighboring second InP-based optical waveguide, a dielectric planarization layer that is arranged at least between the first optical waveguide and the second optical waveguide. At least between the first optical waveguide and the neighboring second optical waveguide, the dielectric planarization layer is provided with a recess that is arranged to reduce or prevent optical interaction between the first optical waveguide and the second optical waveguide via the dielectric planarization layer. At the location of the recess, the dielectric planarization layer has a first sidewall that is arranged sloped towards the first optical waveguide, and a second sidewall that is arranged sloped towards the second optical waveguide. An opto-electronic system including said PIC.

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