专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2014160835A Electronic device with yielding substrate 有权
标题翻译：带触点基板的电子设备
公开(公告)号：JP2014160835A
公开(公告)日：2014-09-04
申请号：JP2014063919
申请日：2014-03-26
申请人： Cooledge Lighting Inc , クーレッジライティングインコーポレイテッド
发明人： MICHAEL TISCHLER , PHILIPPE SCHICK , IAN ASHDOWN , CALVIN WADE SHEEN , PAUL JUNGWIRTH
IPC分类号： H01L33/62 , F21S2/00 , F21Y101/02 , H01L21/60 , H01L23/29 , H01L23/31
CPC分类号： F21K9/66 , F21K9/20 , F21K9/275 , F21K9/278 , F21K9/64 , F21K9/65 , F21V3/02 , F21V9/16 , F21V23/003 , F21V23/02 , F21V29/74 , F21Y2115/10 , G02F1/133603 , H01L23/367 , H01L23/4985 , H01L23/5387 , H01L24/32 , H01L24/83 , H01L25/0753 , H01L27/156 , H01L31/0468 , H01L33/0025 , H01L33/06 , H01L33/08 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/36 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/505 , H01L33/58 , H01L33/60 , H01L33/62 , H01L51/0097 , H01L2224/06102 , H01L2224/16225 , H01L2224/2929 , H01L2224/32225 , H01L2224/73204 , H01L2224/83385 , H01L2224/83851 , H01L2225/107 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/01063 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/10253 , H01L2924/10321 , H01L2924/10322 , H01L2924/10323 , H01L2924/10324 , H01L2924/10328 , H01L2924/10329 , H01L2924/1033 , H01L2924/10331 , H01L2924/10332 , H01L2924/10333 , H01L2924/10334 , H01L2924/10335 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/381 , H02S30/00 , H05B33/0854 , H05B37/0218 , H05B37/0227 , H05B37/0245 , H05K1/189 , H05K3/323 , H05K2201/09036 , H05K2201/10106 , H05K2203/302 , H01L2924/01015 , H01L2924/01031 , H01L2924/01051 , H01L2924/3512 , H01L2924/00 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide an electronic device with a preferred yielding substrate.SOLUTION: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any non-planarity of a surface of the semiconductor die or non-coplanarity of semiconductor die contacts. In accordance with certain embodiments, one or more semiconductor dies are attached to a flexible and/or deformable substrate with a pressure-sensitive adhesive (e.g., an ACA) without the use of intervening stud bumps or similar structures. The substrate is able to locally yield to compression force and form a mechanically strong and electrically conductive connection to the semiconductor die contacts, notwithstanding any non-coplanarity of the contacts.
摘要翻译：要解决的问题：提供具有优选屈服基底的电子器件。解决方案：根据某些实施例，半导体管芯具有压力激活的粘合剂直接粘附到屈服衬底，尽管具有任何非平面性的半导体管芯或半导体管芯接触的非共面性。根据某些实施例，一个或多个半导体管芯使用压敏粘合剂（例如，ACA）附接到柔性和/或可变形的衬底，而不使用插入的突起或相似的结构。即使接触的任何非共面性，基板能够局部屈服于压缩力并形成与半导体管芯接触件的机械强度和导电性连接。

2. 发明申请

WO2018075620A1 SEALED AND SEALABLE SCALABLE LIGHTING SYSTEMS INCORPORATING FLEXIBLE LIGHT SHEETS AND RELATED METHODS 审中-公开
标题翻译：包含柔性灯片的密封和可密封的可伸缩照明系统及相关方法
公开(公告)号：WO2018075620A1
公开(公告)日：2018-04-26
申请号：PCT/US2017/057146
申请日：2017-10-18
申请人： COOLEDGE LIGHTING INC. , TISCHLER, Michael A.
发明人： TISCHLER, Michael A. , PALFREYMAN, Paul , TIKHOMOLOV, Vitali
IPC分类号： F21K9/90 , F21V23/00 , F21S2/00 , F21V15/01 , F21V31/00 , H05B37/02 , F21Y115/10 , F21Y105/10
CPC分类号： F21V31/04 , F21K9/00 , F21K9/90 , F21S2/005 , F21V23/06 , F21Y2105/10 , F21Y2113/00 , F21Y2115/10 , G02F1/133603 , H01L25/0753 , H01L33/50 , H01L33/58 , H01L33/62 , H05B33/0857
摘要： In accordance with certain embodiments, illumination elements having different shapes defined by contiguous arrangements of illumination unit cells may be assembled to illuminate an arbitrary two-dimensional area. In various embodiments, the illumination elements include flexible light sheets and one or more sealed regions containing light-emitting elements, the sealed regions defined by seals between a top housing and a bottom housing and/or the light sheet.
摘要翻译：根据某些实施例，具有由照明单元单元的连续布置限定的不同形状的照明元件可被组装以照亮任意的二维区域。在各种实施例中，照明元件包括柔性光片和包含发光元件的一个或多个密封区域，密封区域由上壳体和下壳体和/或光片之间的密封件限定。

3. 发明申请

WO2015143321A1 ILLUMINATION DEVICE CONTROL SYSTEMS AND METHODS 审中-公开
标题翻译：照明装置控制系统和方法
公开(公告)号：WO2015143321A1
公开(公告)日：2015-09-24
申请号：PCT/US2015/021751
申请日：2015-03-20
申请人： COOLEDGE LIGHTING INC. , TISCHLER, Michael, A.
发明人： TISCHLER, Michael, A. , COETZEE, William, P. , JUNGWIRTH, Paul
IPC分类号： H05B33/08 , H05B37/02
CPC分类号： H05B33/0827 , H01L2224/73204
摘要： In various embodiments, a converter for a lighting apparatus iteratively applies voltage to and senses current from the lighting apparatus to regulate operation thereof.
摘要翻译：在各种实施例中，用于照明设备的转换器向照明设备反复地施加电压并感测来自照明设备的电流以调节其工作。

4. 发明申请

WO2014140796A1 WAFER-LEVEL FLIP CHIP DEVICE PACKAGES AND RELATED METHODS 审中-公开
标题翻译： WAFER-LEVEL FLIP芯片设备包装及相关方法
公开(公告)号：WO2014140796A1
公开(公告)日：2014-09-18
申请号：PCT/IB2014/000716
申请日：2014-03-13
申请人： COOLEDGE LIGHTING, INC.
发明人： TISCHLER, Michael, A.
IPC分类号： H01L21/50 , H01L23/31 , H01L25/00 , H01L33/06 , H01L33/26 , H01L33/50
CPC分类号： H01L24/96 , H01L21/561 , H01L21/568 , H01L21/6836 , H01L23/3107 , H01L24/13 , H01L24/27 , H01L24/29 , H01L24/73 , H01L24/81 , H01L24/83 , H01L25/0753 , H01L33/50 , H01L2224/0401 , H01L2224/04105 , H01L2224/05553 , H01L2224/1134 , H01L2224/13099 , H01L2224/13562 , H01L2224/1357 , H01L2224/13624 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13666 , H01L2224/13671 , H01L2224/16225 , H01L2224/16227 , H01L2224/27418 , H01L2224/27436 , H01L2224/27848 , H01L2224/2929 , H01L2224/29344 , H01L2224/29355 , H01L2224/2939 , H01L2224/29444 , H01L2224/29455 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81191 , H01L2224/81424 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/81903 , H01L2224/83191 , H01L2224/83203 , H01L2224/83851 , H01L2224/83862 , H01L2224/9211 , H01L2224/96 , H01L2924/07811 , H01L2924/12032 , H01L2924/12041 , H01L2924/12043 , H01L2924/181 , H01L2924/00 , H01L2224/27 , H01L2924/00014 , H01L2924/00012
摘要： In accordance with certain embodiments, semiconductor dies are at least partially coated with a polymer and a conductive adhesive prior being bonded to a substrate having electrical traces thereon.
摘要翻译：根据某些实施例，半导体管芯在被结合到其上具有电迹线的衬底之前至少部分地涂覆有聚合物和导电粘合剂。

5. 发明申请

WO2011072373A1 METHOD AND MAGNETIC TRANSFER STAMP FOR TRANSFERRING SEMICONDUCTOR DICE USING MAGNETIC TRANSFER PRINTING TECHNIQUES 审中-公开
标题翻译：使用磁性传输印刷技术传输半导体数字的方法和磁转印
公开(公告)号：WO2011072373A1
公开(公告)日：2011-06-23
申请号：PCT/CA2010/001950
申请日：2010-12-14
申请人： COOLEDGE LIGHTING INC. , ASHDOWN, Ian , SPEIER, Ingo , SCHICK, Philippe , SHEEN, Calvin Wade
发明人： ASHDOWN, Ian , SPEIER, Ingo , SCHICK, Philippe , SHEEN, Calvin Wade
IPC分类号： H01L21/67 , H01L21/58 , H01L33/00
CPC分类号： H01L24/95 , H01L21/6835 , H01L24/75 , H01L24/83 , H01L2221/6835 , H01L2221/68368 , H01L2221/68381 , H01L2224/2919 , H01L2224/83192 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/01058 , H01L2924/0106 , H01L2924/01064 , H01L2924/01066 , H01L2924/01073 , H01L2924/01075 , H01L2924/01078 , H01L2924/01088 , H01L2924/01094 , H01L2924/01105 , H01L2924/0132 , H01L2924/0133 , H01L2924/0665 , H01L2924/14 , H01L2924/1461 , H01L2924/19041 , H01L2924/00 , H01L2924/01027 , H01L2924/01028 , H01L2924/01026
摘要： Releasable semiconductor dice are deposited with a magnetic layer a nd held by magnetic forces to a magnetic or electromagnetic transfer stamp for the transfer of the dice from a host substrate directly or indirectly to a target substrate.
摘要翻译：可释放的半导体管芯被磁性层沉积，并且通过磁力保持在磁性或电磁传递印模上，以将芯片从主体衬底直接或间接地转移到目标衬底。

6. 发明申请

WO2016123065A1 SYSTEMS AND METHODS FOR ADHESIVE BONDING OF ELECTRONIC DEVICES 审中-公开
标题翻译：用于电子设备粘合的系统和方法
公开(公告)号：WO2016123065A1
公开(公告)日：2016-08-04
申请号：PCT/US2016/014852
申请日：2016-01-26
申请人： COOLEDGE LIGHTING, INC. , TISCHLER, Michael A.
发明人： TISCHLER, Michael A. , AMINI, Alborz
IPC分类号： H01L23/48 , H01L25/065
CPC分类号： H01L33/62 , H01L24/75 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/7598 , H01L2224/83851 , H01L2924/07811 , H01L2924/07812 , H01L2924/181 , H01L2933/0066 , H01L2924/00012
摘要： In accordance with certain embodiments, electronic components such as light-emitting elements are bonded to connection points on a substrate via pressure applied via a membrane and curing of a pressure-activated adhesive.
摘要翻译：根据某些实施例，诸如发光元件的电子部件通过经由膜施加的压力和压力激活的粘合剂的固化而结合到基板上的连接点。

7. 发明申请

WO2016018843A1 LED LIGHTING SYSTEM INCORPORATING FOLDED LIGHT SHEETS 审中-公开
标题翻译： LED照明系统折叠折叠灯
公开(公告)号：WO2016018843A1
公开(公告)日：2016-02-04
申请号：PCT/US2015/042344
申请日：2015-07-28
申请人： COOLEDGE LIGHTING, INC. , TISCHLER, Michael, A.
发明人： TISCHLER, Michael, A.
IPC分类号： F21S2/00 , F21V21/14 , F21V19/00
CPC分类号： F21S4/20 , F21K9/90 , F21Y2103/10 , F21Y2105/10 , F21Y2115/10 , H05K1/0286 , H05K1/189 , H05K2201/055 , H05K2201/09127 , H05K2201/10106
摘要： Embodiments of the present invention relate to illumination systems based on flexible light sheets that have additional functionality enabled by the incorporation of at least one folded portion of the flexible light sheet. The flexible sheets are folded to define first and second portions of the light sheet divided by the fold, and the first and second portions of the light sheet may both feature light-emitting elements thereon.
摘要翻译：本发明的实施例涉及基于柔性光片的照明系统，其具有通过结合柔性光片的至少一个折叠部分而实现的附加功能。柔性片被折叠以限定由折叠物分割的光片的第一和第二部分，并且光片的第一和第二部分都可以在其上具有发光元件。

8. 发明申请

WO2015168212A1 MODULAR LED LIGHTING SYSTEMS 审中-公开
标题翻译：模块化LED照明系统
公开(公告)号：WO2015168212A1
公开(公告)日：2015-11-05
申请号：PCT/US2015/028152
申请日：2015-04-29
申请人： COOLEDGE LIGHTING INC. , TISCHLER, Michael, A.
发明人： TISCHLER, Michael, A. , JUNGWIRTH, Paul
IPC分类号： F21S2/00 , H05B33/08
CPC分类号： F21S2/005 , F21S2/00 , F21V17/10 , F21V17/16 , F21V19/003 , F21V19/004 , F21V21/005 , F21V21/14 , F21V21/35 , F21V23/02 , F21V23/06 , F21Y2101/00 , F21Y2105/00 , F21Y2105/10 , F21Y2115/10 , G09F13/00 , H01S5/042 , H05B33/08 , H05B33/0803 , H05B33/0827 , H05B37/02
摘要： In accordance with various embodiments, a modular lighting system features multiple light panels each having multiple light-emitting elements thereon, as well as connectors for electrically and mechanically interconnecting the light panels. A lighting system comprises a first light panel comprising a first substrate, first and second spaced-apart power conductors disposed on the first substrate, a plurality of first light-emitting elements disposed on the first substrate and electrically connected to the first and second power conductors, a first snap connector electrically connected to the first power conductor, and a second snap connector electrically connected to the second power conductor, and a second light panel comprising a second substrate, third and fourth spaced-apart power conductors disposed on the second substrate, a plurality of second light-emitting elements disposed on the second substrate and electrically connected to the third and fourth power conductors, a third snap connector electrically connected to the third power conductor, and a fourth snap connector electrically connected to the fourth power conductor, wherein (i) the first snap connector is configured for connection to the third snap connector, thereby electrically coupling the first power conductor to the third power conductor, and (ii) the second snap connector is configured for connection to the fourth snap connector, thereby electrically coupling the second power conductor to the fourth power conductor.
摘要翻译：根据各种实施例，模块化照明系统具有各自在其上具有多个发光元件的多个光板以及用于电气和机械地互连光板的连接器。一种照明系统包括：第一光板，包括第一基板，设置在第一基板上的第一和第二间隔开的电力导体，多个第一发光元件，设置在第一基板上，并电连接到第一和第二电力导体电连接到第一电力导体的第一卡扣连接器和电连接到第二电源导体的第二卡扣连接器，以及包括第二基板，设置在第二基板上的第三和第四隔开的电力导体的第二光板，多个第二发光元件，设置在所述第二基板上并电连接到所述第三和第四电力导体，电连接到所述第三电力导体的第三卡扣连接器和电连接到所述第四电力导体的第四卡扣连接器，其中（i）第一卡扣连接器被配置为连接到第三卡扣连接器，从而将第一电力导体电耦合到第三电力导体，以及（ii）第二卡扣连接器构造成用于连接到第四卡扣连接器，从而将第二电力导体电耦合到第四电力导体。

9. 发明申请

WO2014140811A2 THERMAL MANAGEMENT IN ELECTRONIC DEVICES WITH YIELDING SUBSTRATES 审中-公开
标题翻译：具有触点基板的电子设备中的热管理
公开(公告)号：WO2014140811A2
公开(公告)日：2014-09-18
申请号：PCT/IB2014/000828
申请日：2014-03-14
申请人： COOLEDGE LIGHTING INC.
发明人： TISCHLER, Michael, A.
IPC分类号： H01L33/64
CPC分类号： H01L33/642 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/29 , H01L24/32 , H01L33/62 , H01L33/641 , H01L2224/13 , H01L2224/13013 , H01L2224/13082 , H01L2224/131 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13186 , H01L2224/1329 , H01L2224/133 , H01L2224/1403 , H01L2224/1415 , H01L2224/14505 , H01L2224/16225 , H01L2224/17519 , H01L2224/29036 , H01L2224/2929 , H01L2224/293 , H01L2224/2939 , H01L2224/294 , H01L2224/29499 , H01L2224/3003 , H01L2224/32225 , H01L2224/32227 , H01L2224/73203 , H01L2224/73204 , H01L2924/07802 , H01L2924/07811 , H01L2924/12041 , H01L2924/12042 , H01L2924/00 , H01L2924/00014 , H01L2224/13647 , H01L2224/13624 , H01L2924/04642 , H01L2924/05032 , H01L2924/00012 , H01L2924/014
摘要： In accordance with certain embodiments, heat-dissipating elements are integrated with semiconductor dies and substrates in order to facilitate heat dissipation therefrom during operation.
摘要翻译：根据某些实施例，散热元件与半导体管芯和衬底集成，以便于在操作期间散热。

10. 发明申请

WO2014140805A3 ENGINEERED-PHOSPHOR LED PACKAGES AND RELATED METHODS 审中-公开
公开(公告)号：WO2014140805A3
公开(公告)日：2014-09-18
申请号：PCT/IB2014/000809
申请日：2014-03-12
申请人： COOLEDGE LIGHTING INC.
发明人： ASHDOWN, Ian , TISCHLER, Michael, A. , SCHICK, Philippe, M. , PINNINGTON, Tom , IP, Henry
IPC分类号： H01L33/50 , F21V9/00 , H01S5/00
摘要： In accordance with, certain embodiments, a phosphor element at least partially surrounding a light-emitting die is shaped to influence color-temperature divergence.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式