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1. 发明公开

KR20120021131A Single-to-balanced band pass filter 有权
标题翻译：单平衡带通滤芯
公开(公告)号：KR20120021131A
公开(公告)日：2012-03-08
申请号：KR20100098967
申请日：2010-10-11
申请人： CYNTEC CO LTD
发明人： CHUANG CHIA CHENG
IPC分类号： H03H7/12 , H03H7/38
CPC分类号： H03H7/42 , H03H7/09 , H03H7/1775 , H03H7/1791
摘要： PURPOSE: A single to balanced band pass filter is provided to prevent disturbance due to noises introduced to an earth by providing a single balanced band pass filter which does not give an influence on common mode signals. CONSTITUTION: A single to balanced bandpass filter(100) comprises a first stage(102), a second stage(104), and a third stage(106) The first stage includes inductors(L11,L12) and capacitors(C11,C12). The second stage has a third inductor(L2) and a third capacitor(C2). The third stage has a fourth inductor(L3) and a fourth capacitor(C3). The second stage and the third stage are not connected to an earth. The second stage and the third stage are not influenced by noises.
摘要翻译：目的：提供单个平衡带通滤波器，以通过提供不对共模信号产生影响的单个平衡带通滤波器来防止由于噪声引入到地球的干扰。构成：单个平衡带通滤波器（100）包括第一级（102），第二级（104）和第三级（106）。第一级包括电感器（L11，L12）和电容器（C11，C12）。第二级具有第三电感（L2）和第三电容（C2）。第三级具有第四电感（L3）和第四电容（C3）。第二阶段和第三阶段没有连接到地球。第二阶段和第三阶段不受噪声的影响。

2. 发明专利

DE102016101757A1 SCHALTUNGSMODUL MIT OBERFLÄCHENMONTIERBAREN UNTERLAGSBLÖCKEN ZUM ANSCHLIESSEN EINER LEITERPLATTE 未知
公开(公告)号：DE102016101757A1
公开(公告)日：2016-08-04
申请号：DE102016101757
申请日：2016-02-02
申请人： CYNTEC CO LTD
发明人： LU BAU-RU
IPC分类号： H05K1/11 , H01L25/16 , H05K1/14 , H05K7/20
摘要： Die vorliegende Erfindung betrifft ein Schaltungsmodul zum Anschließen einer Leiterplatte, wobei das Schaltungsmodul zum Anschließen einer Leiterplatte aus einem Substrat (10) mit einer oberen Fläche (12), einer unteren Fläche (13) und einer Seitenfläche (11) besteht und die Seitenfläche (11) an die obere Fläche (12) und an die untere Fläche (13) anstößt. Mindestens eine elektrische Komponente ist auf der oberen oder unteren Fläche (12 bzw. 13) vorgesehen, während mehrere oberflächenmontierbare Unterlagsblöcke (40) auf der Seitenfläche (11) des Substrats (10) angeordnet sind, um diese mit den entsprechenden Unterlagsblöcken auf der Leiterplatte (50) elektrisch zu verbinden.

3. 发明专利

JP2015053271A 保護装置有权
标题翻译：保护装置
公开(公告)号：JP2015053271A
公开(公告)日：2015-03-19
申请号：JP2014210266
申请日：2014-09-25
申请人：乾坤科技股▲ふん▼有限公司 , Cyntec Co Ltd
发明人： O SHOYU , LIN HUNG MING , CHIANG LANG-YI , LUO WEN SHIANG , CHEN KUO-SHU
IPC分类号： H01H37/76 , H01M2/34
CPC分类号： H02H5/00 , H01H69/022 , H01H85/0047 , H01H85/0065 , H01H85/0411 , H01H85/046 , H01H85/048 , H01H85/11 , H01H2085/466
摘要：【課題】過電流および過電圧を効果的に防止する。【解決手段】基板、導電部分および第1補助媒体を含む保護装置を提供する。導電部分は基板によって支持され、この導電部分は第1電極と第2電極との間に電気的に接続された金属素子を備える。金属素子は、第1および第2電極の融点よりも低い融点を有する犠牲構造として機能する。補助媒体は金属素子と基板との間に配置され、該補助媒体は金属素子の融点よりも低い融点を有する。補助媒体は、金属素子の融解時の破断を促進する。【選択図】図1A
摘要翻译：要解决的问题：有效地防止过电流和过电压。解决方案：提供了一种保护装置，包括基板，导电部分和第一辅助介质。导电部分由衬底支撑，并且包括电连接在第一和第二电极之间的金属元件。金属元件用作熔点低于第一和第二电极的熔点的牺牲结构。辅助介质设置在金属元件和基板之间，其熔点低于金属元件的熔点。辅助介质有助于熔化时金属元件的断裂。

4. 发明专利

JP2002280246A METHOD OF MANUFACTURING VIA PLUG 失效
公开(公告)号：JP2002280246A
公开(公告)日：2002-09-27
申请号：JP2001118359
申请日：2001-04-17
申请人： CYNTEC CO LTD
发明人： RYU SHUNJO , O SHOYU , LEE SEIJIN
IPC分类号： H01F41/04 , H01F17/00 , H01L21/768
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method for a via plug, which is also applicable to the manufacturing method for a general size of via plug, in addition to being used for the induction coil contact within a radio communication apparatus by manufacturing a metallic plug which is simple of structure and is free of impurities, thereby getting a high-quality via plug. SOLUTION: A via hole is made in a ceramic substrate, and then a metal thin film is formed on the hole wall of the via hole by physical vapor deposition method or chemical vapor deposition method. Next, the metal thin film made beforehand is plated with metal, making use of electrical plating method or electroless plating method, thereby manufacturing a metallic plug within the via hole, which satisfies the needs of electrical conductivity.

5. 发明公开

EP3671225A1 RESISTOR HAVING LOW TEMPERATURE COEFFICIENT OF RESISTANCE 审中-公开
公开(公告)号：EP3671225A1
公开(公告)日：2020-06-24
申请号：EP19218418.2
申请日：2019-12-20
申请人： CYNTEC CO., LTD.
发明人： Hung, Tzu-Hao , Luo, Ying-Da
IPC分类号： G01R1/20 , H01C1/148 , H01C7/06
摘要： A resistor (2) having low temperature coefficient of resistance includes a resistive part (12) and two conductive parts (14,16) connected to opposite sides (12a, 12b) thereof. One conductive part (14) has a through slot (144) and a sensing portion (142) between the through slot (144) and the resistive part (12). The through slot (144) has two inter-connected sections (1442,1444), each of which extends and ends with a closed end (1442a,1444a) and has parallel and perpendicular components (P11,P21,P12,P22) relative to a main current direction (D1) defined on the resistor (2). Another resistor (3) having low temperature coefficient of resistance includes a resistive part (32) and two conductive parts (34,36) connected to two sides (32a,32b) thereof. Each conductive part (34,36) has a protrusion block (342,362), extending outward perpendicular to a main current direction (D2) defined on the resistor (3), and a sensing portion (344,364) at the protrusion block (342,362).

6. 发明授权

EP3819650B1 CURRENT DETECTION DEVICE AND MANUFACTURING METHOD THEREOF 有权
公开(公告)号：EP3819650B1
公开(公告)日：2023-10-11
申请号：EP20203822.0
申请日：2020-10-26
发明人： LIU, Po Wen
IPC分类号： G01R1/20

7. 发明授权

EP3620799B1 CURRENT SENSING MODULE 有权
公开(公告)号：EP3620799B1
公开(公告)日：2021-11-03
申请号：EP19192765.6
申请日：2019-08-21
发明人： Li, Yi-Geng , Wu, Ming-Chia , Syu, Siao-Wei , Chen, Chun-Chuan
IPC分类号： G01R15/20 , G01R1/20

8. 发明公开

EP3620799A1 CURRENT SENSING MODULE 有权
公开(公告)号：EP3620799A1
公开(公告)日：2020-03-11
申请号：EP19192765.6
申请日：2019-08-21
申请人： CYNTEC CO., LTD.
发明人： Li, Yi-Geng , Wu, Ming-Chia , Syu, Siao-Wei , Chen, Chun-Chuan
IPC分类号： G01R15/20 , G01R1/20
摘要： A current sensing module (1, 1') for measuring a current includes a conductive substrate (10), a frame (12), a circuit board (14) and a magnetic sensor (16). The conductive substrate (10) has two terminals (100a, 100b) and at least one slot (102). The frame (12) has two side portions (120) and a bottom portion (122), wherein the bottom portion (122) connects the two side portions (120) to form an opening ring-shape. At least one of the two side portions (120) is disposed in the at least one slot (102), such that the two side portions (120) surround a partial path of the current. A gap exists between two ends of the two side portions (120). The circuit board (14) is disposed with respect to the conductive substrate (10). The magnetic sensor (16) is connected to the circuit board (14) and located in a space between the two side portions (120) rather than in the gap. The magnetic sensor (16) senses the current and generates a first current sensing signal correspondingly.

9. 发明公开

US20240222696A1 METHOD FOR PRODUCING SOLID-STATE BATTERY 审中-公开
公开(公告)号：US20240222696A1
公开(公告)日：2024-07-04
申请号：US18428780
申请日：2024-01-31
申请人： Cyntec Co., Ltd.
发明人： Chihung Su , Wenhsiung Liao
IPC分类号： H01M10/0562 , H01M4/04 , H01M50/46
CPC分类号： H01M10/0562 , H01M4/0419 , H01M50/46
摘要： A solid-state battery includes a first electrode; a second electrode having a first side facing a first side of the first electrode and spaced from the first electrode; and a solid electrolyte at least partially disposed in a space between the first electrode and the second electrode for providing a path for metal ions associated with the first electrode and/or the second electrode to move through. The metal ions are kept differentially distributed along the path.

10. 发明授权

US11915855B2 Method to form multile electrical components and a single electrical component made by the method 有权
公开(公告)号：US11915855B2
公开(公告)日：2024-02-27
申请号：US16820968
申请日：2020-03-17
申请人： CYNTEC CO., LTD.
发明人： Chin Hung Wei , Min Lian Kuo , Chung Kai Liao
IPC分类号： H01F27/29 , H01F27/32 , H01F27/28 , H01F27/24 , H01F27/02 , H01F27/22 , H05K1/18 , H01L25/07
CPC分类号： H01F27/327 , H01F27/022 , H01F27/22 , H01F27/24 , H01F27/2823 , H01F27/2852 , H01F27/29 , H05K1/18 , H01L25/072 , H05K2201/1003 , H05K2201/10166 , H05K2201/10515
摘要： A method to form a plurality of inductors in a single process by placing multiple coils on a first magnetic sheet, and then stacking magnetic layers on the first magnetic sheet to encapsulate the coils so as to from a large magnetic body, and then cutting the large magnetic body into multiple inductors, wherein a terminal part of the coil disposed on the bottom surface of the magnetic body of the inductor is extended away from the axis of the coil and is entirely located at a same side of the axis of the coil.

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