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1. 发明申请

US20110281520A1 WIRELESS HEAT SINK, WIRELESS HEAT SINK SYSTEM AND WIRELESS HEAT SINKING METHOD FOR THE SAME 审中-公开
标题翻译：无线散热器，无线散热系统及无线热吸收方法
公开(公告)号：US20110281520A1
公开(公告)日：2011-11-17
申请号：US12779085
申请日：2010-05-13
申请人： Kuo-Len Lin , Mong-Hua Hung , Tien-Chih Tseng , Chen-Hsiang Lin , Chih-Hung Cheng
发明人： Kuo-Len Lin , Mong-Hua Hung , Tien-Chih Tseng , Chen-Hsiang Lin , Chih-Hung Cheng
IPC分类号： H04B7/00
CPC分类号： G06F1/1632 , G06F1/203 , G06F1/206 , H01L23/34 , H01L23/38 , H01L23/467 , H01L2924/0002 , H04W84/18 , Y02D10/16 , H01L2924/00
摘要： A wireless heat sink, a wireless heat sink system and a wireless heat sinking method are disclosed. The wireless heat sink receives a control command sent by an external device. An internal heat sink device is controlled according to content of the control command to control power ON or power OFF of a thermoelectric cooler of the heat sink device or to control power ON, power OFF, or change rotation speed setting of a heat sink fan in the heat sink device. Thus, the heat sink auto switches operations of the heat sink device correspondingly according to temperature changes of the external device.
摘要翻译：公开了无线散热器，无线散热器系统和无线散热方法。无线散热器接收外部设备发送的控制命令。根据控制命令的内容控制内部散热装置，以控制散热装置的热电冷却器的电源接通或断电，或者控制散热风扇的电源接通，断电或改变转速设定散热器设备。因此，根据外部设备的温度变化，散热器自动切换散热器设备的操作。

2. 发明申请

US20110203295A1 COOLING RACK STRUCTURE OF THERMOELECTRIC COOLING TYPE 失效
标题翻译：热电冷却型冷却架结构
公开(公告)号：US20110203295A1
公开(公告)日：2011-08-25
申请号：US12711341
申请日：2010-02-24
申请人： Ken HSU , Chih-Hung Cheng , Chen-Hiang Lin , Kuo-Len Lin
发明人： Ken HSU , Chih-Hung Cheng , Chen-Hiang Lin , Kuo-Len Lin
IPC分类号： F25B21/02 , F28F1/10 , F28F13/12
CPC分类号： F25B21/02 , F25B25/00 , F25B2321/0251 , G06F1/1632 , G06F1/203
摘要： A cooling rack structure includes a cooling plate (1), a temperature conductor (2), a centrifugal fan (3), a cooling body (4) and a thermoelectric cooling component (5). A temperature-super-conducting component (13) is disposed on an inner surface (11) of the cooling plate (1). The temperature conductor (2) is arranged on the temperature-super-conducting component (13). In addition, a heat-exhausting hole (120) is arranged on an upper side of the cooling plate (1). The centrifugal fan (3) is disposed between the temperature conductor (2) and the heat-exhausting hole (120) while the cooling body (4) is disposed between the fan (3) and the heat-exhausting hole (120). A hot side face (501) of the thermoelectric cooling component (5) closely contacts the cooling body (4) while a cold side face (500) is arranged on the temperature-super-conducting component (13). By quickly conducting the low temperature generated from the thermoelectric cooling component (5) onto the cooling plate (1) through the temperature-super-conducting component (13), a low temperature surface can be uniformly provided to obtain a cooling effect.
摘要翻译：冷却架结构包括冷却板（1），温度导体（2），离心风扇（3），冷却体（4）和热电冷却组件（5）。温度超导部件（13）设置在冷却板（1）的内表面（11）上。温度导体（2）布置在温度超导部件（13）上。另外，在冷却板（1）的上侧配置有排热孔（120）。离心风扇（3）设置在温度导体（2）和排热孔（120）之间，同时冷却体（4）设置在风扇（3）和排热孔（120）之间。热电冷却部件（5）的热侧面（501）与冷却体（4）紧密接触，而冷侧面（500）配置在温度超导部件（13）上。通过将热电冷却部件（5）产生的低温通过温度超导部件（13）快速地导通到冷却板（1）上，可以均匀地设置低温面以获得冷却效果。

3. 发明申请

US20110197598A1 Heat-Dissipating Device For Supplying Cold Airflow 失效
标题翻译：用于供应冷气流的散热装置
公开(公告)号：US20110197598A1
公开(公告)日：2011-08-18
申请号：US12707805
申请日：2010-02-18
申请人： Chih-Hung CHENG , Ken Hsu , Chen-Hsiang Lin , Kuo-Len Lin
发明人： Chih-Hung CHENG , Ken Hsu , Chen-Hsiang Lin , Kuo-Len Lin
IPC分类号： F25B21/02 , F28D15/00 , F28F1/20
CPC分类号： H01L23/427 , F25B21/02 , F25B2321/0251 , H01L23/3675 , H01L23/38 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat-dissipating device (1) includes a casing (10) and a thermal insulation plate (20) provided within the casing (10). The thermal insulating plate (20) divides the interior of the casing (10) into a first accommodating space (101) and a second accommodating space (102). A hot air outlet (121) and a first air inlet (122) of the casing (10) are in communication with the first accommodating space (101). A cold air outlet (110) and a second air inlet (123) of the casing (10) are in communication with the second accommodating space (102). A thermoelectric cooling chip (30) is disposed in a through-hole (200) of the thermal insulation plate (20) and has a hot-end surface (31) facing the first accommodating space (101) and a cold-end surface (32) facing the second accommodating space (102). A heat-dissipating module (40) is received in the first accommodating space (101). A cold-airflow supplying module (50) is received in the second accommodating space (102). The heat generated by the hot-end surface (31) is dissipated to the hot air outlet (121) by the thermal conduction of the heat-dissipating module (40). The cold generated by the cold-end surface (32) is conducted and distributed uniformly by the cold-airflow supplying module (50) to the cold air outlet (110).
摘要翻译：散热装置（1）包括壳体（10）和设置在壳体（10）内的绝热板（20）。绝热板（20）将壳体（10）的内部分成第一容纳空间（101）和第二容纳空间（102）。所述壳体（10）的热风出口（121）和第一空气入口（122）与所述第一容纳空间（101）连通。壳体（10）的冷气出口（110）和第二空气入口（123）与第二容纳空间（102）连通。一个热电冷却芯片（30）设置在绝热板（20）的通孔（200）中并且具有面向第一容纳空间（101）的热端表面（31）和冷端表面 32）面向第二容纳空间（102）。散热模块（40）被容纳在第一容纳空间（101）中。冷气流供给模块（50）被容纳在第二容纳空间（102）中。热端面（31）产生的热量通过散热模块（40）的热传导而散热到热风出口（121）。由冷端表面32产生的冷由冷气流供给模块50均匀地传导并均匀地分配到冷气出口110。

4. 发明申请

US20110309734A1 LED LAMP AND A HEAT SINK THEREOF HAVING A WOUND HEAT PIPE 有权
标题翻译： LED灯和一个带有热管的散热片
公开(公告)号：US20110309734A1
公开(公告)日：2011-12-22
申请号：US12820453
申请日：2010-06-22
申请人： Kuo-Len LIN , Chen-Hsiang LIN , Chih-Hung CHENG
发明人： Kuo-Len LIN , Chen-Hsiang LIN , Chih-Hung CHENG
IPC分类号： H01J61/52 , F28D15/04
CPC分类号： F21V29/51 , F21K9/23 , F21K9/233 , F21V29/004 , F21V29/773 , F21V29/78 , F21Y2115/10 , F28D15/0275
摘要： The present invention relates to a LED lamp and a heat sink thereof having a wound heat pipe. The LED lamp includes the heat sink, a LED module and a lamp base electrically connected to the LED module. The heat sink includes a heat-conducting base, a heat-dissipating fin set and a wound heat pipe. The heat-dissipating fin set includes a plurality of heat-dissipating fins arranged at the outer periphery of the heat-conducting base. The heat-dissipating fins form an accommodating space. The wound heat pipe includes an evaporating section brought into thermal contact with the heat-conducting base and a condensing section brought into thermal contact with the heat-dissipating fins. The LED module abuts against the heat-conducting base and the evaporating section. By this structure, the heat-conducting path is shortened, the heat-conducting speed is accelerated, and the heat is rapidly and uniformly distributed to the heat-dissipating fins to improve the heat-dissipating efficiency.
摘要翻译：本发明涉及具有卷绕热管的LED灯及其散热器。 LED灯包括散热器，LED模块和与LED模块电连接的灯座。散热器包括导热基座，散热翅片组和绕线热管。散热片组包括布置在导热基底的外周的多个散热片。散热片形成容纳空间。卷绕的热管包括与导热基体热接触的蒸发部和与散热翅片热接触的冷凝部。 LED模块抵靠导热基座和蒸发部分。通过这种结构，导热路径缩短，导热速度加快，热量迅速均匀地分布到散热翅片，提高了散热效率。

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