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JP2014145482A Structure mounting insert with non-conductive isolator 审中-公开
标题翻译：结构安装插件与非导电隔离器
公开(公告)号：JP2014145482A
公开(公告)日：2014-08-14
申请号：JP2014049686
申请日：2014-03-13
申请人： Zephyros Inc , ゼフィロスインコーポレイテッド
发明人： OLAF NITSCHE , DAVID SHEASLEY , JOHN GILLESPIE , JEANNE BEDNARSKI
IPC分类号： F16B11/00 , B62D25/08 , F16B5/06 , F16J15/04 , F16J15/14
CPC分类号： B29C65/486 , B62D25/088 , B62D27/026 , B62D29/001 , F16B5/04 , F16B19/086 , Y10T428/1476 , Y10T428/24322 , Y10T428/24331 , Y10T428/2826
摘要： PROBLEM TO BE SOLVED: To provide an insert which works as a seal or a structure adhesive material.SOLUTION: The insert comprises a non-conductive isolator and a matrix material which is being brought into contact with the isolator and presents viscosity in a non-hardened state. The matrix member is hardened by receiving heat after mounting the insert, and the viscosity becomes higher as the matrix member resists more displacement after mounting to a surface. In the case of mounting to a junction part between two kinds of materials being different from each other, the isolator resists displacement of coupling and mutually contacting the two heterogeneous materials. The insert comprises a hole including an edge which is coupled in the case of mounting to a non-planar surface of any one of the heterogeneous materials. The insert is formed to be matched with the non-planar surface, gaps to be formed between the non-planar surface and the insert are decreased and without mounting the hole to the non-planar surface, insert or bunching is performed on a similar insert.
摘要翻译：要解决的问题：提供用作密封件或结构粘合剂材料的插入件。解决方案：插入件包括非导电隔离器和与隔离器接触的基质材料，硬化状态。在安装插入件之后，通过接收热而使基体部件硬化，并且随着基体部件在安装到表面之后抵抗更大的位移，粘度变高。在安装到彼此不同的两种材料之间的接合部分的情况下，隔离件抵抗耦合的位移并且相互接触两种异质材料。插入件包括孔，该孔包括边缘，该边缘在安装到任何一种异质材料的非平面表面的情况下被联接。插入件形成为与非平面表面匹配，在非平面表面和插入件之间形成的间隙减小，并且不将孔安装到非平面表面上，在类似的插入件上进行插入或聚束。

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