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1. 发明授权

US06893171B2 Substrate treating apparatus 有权
标题翻译：底物处理装置
公开(公告)号：US06893171B2
公开(公告)日：2005-05-17
申请号：US10417460
申请日：2003-04-16
申请人： Yoshiteru Fukutomi , Kenji Sugimoto , Takashi Ito , Takeo Okamoto , Yukihiko Inagaki , Katsushi Yoshioka , Tsuyoshi Mitsuhashi
发明人： Yoshiteru Fukutomi , Kenji Sugimoto , Takashi Ito , Takeo Okamoto , Yukihiko Inagaki , Katsushi Yoshioka , Tsuyoshi Mitsuhashi
IPC分类号： G03F7/30 , B05C9/14 , B05C13/00 , B65G1/00 , H01L21/00 , H01L21/027 , H01L21/67 , H01L21/677 , G03D5/00 , B65G49/07 , B65H1/00 , G03B27/32
CPC分类号： H01L21/67173 , H01L21/67178 , H01L21/67225 , H01L21/67276 , H01L21/67778 , Y10S414/135
摘要： A substrate treating apparatus disclosed herein realizes improved throughput. The substrate treating apparatus according to this invention includes an antireflection film forming block, a resist film forming block and a developing block arranged in juxtaposition. Each block includes chemical treating modules, heat-treating modules and a single main transport mechanism. The main transport mechanism transports substrates within each block. Transfer of the substrates between adjacent blocks is carried out through substrate rests. The main transport mechanism of each block is not affected by movement of the main transport mechanisms of the adjoining blocks. Consequently, the substrates may be transported efficiently to improve the throughput of the substrate treating apparatus.
摘要翻译：本文公开的基板处理装置实现了改善的生产量。根据本发明的基板处理装置包括并列布置的防反射膜形成块，抗蚀剂膜形成块和显影块。每个块包括化学处理模块，热处理模块和单个主要输送机构。主要运输机构在每个区块内运输基材。通过基板支架进行相邻块之间的基板的转移。每个块的主要运输机构不受邻接块主运输机构的运动的影响。因此，可以有效地输送基板，以提高基板处理装置的通过量。

2. 发明授权

US5677000A Substrate spin treating method and apparatus 失效
标题翻译：底物旋转处理方法和装置
公开(公告)号：US5677000A
公开(公告)日：1997-10-14
申请号：US699728
申请日：1996-08-19
申请人： Katsushi Yoshioka , Yoshiteru Fukutomi , Tsuyoshi Mitsuhashi , Kenji Sugimoto
发明人： Katsushi Yoshioka , Yoshiteru Fukutomi , Tsuyoshi Mitsuhashi , Kenji Sugimoto
IPC分类号： B05C11/08 , G03F7/16 , H01L21/00 , H01L21/027 , H01L21/304 , B05D3/12 , B05C11/00
CPC分类号： H01L21/6715 , G03F7/162
摘要： A substrate spin treating method and apparatus having a cup cleaner device for cleaning a scatter preventive cup, which cleaner device does not require attaching and/or detaching of a cleaning jig. The cleaner device is driven through engagement with a spin chuck which operates at a low torque that is provided for normal substrate spin treating operation. During the normal spin treating operation, only the spin chuck is driven by a rotary shaft, with the cup cleaner device being disengaged from the spin chuck and its driving rotary shaft. For a cup cleaning operation, the spin chuck and scatter preventive cup are vertically moved relative to each other to place the cup cleaner device at a cup cleaning height and to drivingly connect the cup cleaner device to the rotary shaft through a torque transmitter. In this state, the cup cleaner device is rotated to establish a centrifugal force that scatters a cleaning solution supplied to a cleaning solution guide of the cup cleaner device from cleaning solution supply nozzles, thereby cleaning inner surfaces of the scatter preventive cup.
摘要翻译：一种具有用于清洁散射防止杯的杯子清洁器装置的衬底旋转处理方法和装置，该清洁装置不需要附着和/或拆卸清洁夹具。清洁器装置通过与旋转卡盘啮合而被驱动，旋转卡盘以为正常的基底旋转处理操作提供的低扭矩操作。在正常的旋转处理操作期间，只有旋转卡盘由旋转轴驱动，杯子清洁器装置与旋转卡盘及其驱动旋转轴脱离。对于杯子清洁操作，旋转卡盘和防散射杯相对于彼此垂直移动，以将杯清洁器设备放置在杯清洁高度处，并且通过扭矩传递器驱动地将杯清洁器装置连接到旋转轴。在这种状态下，杯子清洁器装置被旋转以建立离心力，该离心力将供应到杯清洁器装置的清洁溶液引导件的清洁溶液从清洁溶液供应喷嘴分散，从而清洁防散射杯的内表面。

3. 发明授权

US06558053B2 Substrate processing apparatus 有权
公开(公告)号：US06558053B2
公开(公告)日：2003-05-06
申请号：US10125229
申请日：2002-04-18
申请人： Kazuhito Shigemori , Masakazu Sanada , Minobu Matsunaga , Katsushi Yoshioka , Kenji Sugimoto , Kaoru Aoki , Moritaka Yano , Satoshi Yamamoto , Tsuyoshi Mitsuhashi , Takashi Nagao , Mitsumasa Kodama , Yukihiko Inagaki , Yoshihisa Yamada
发明人： Kazuhito Shigemori , Masakazu Sanada , Minobu Matsunaga , Katsushi Yoshioka , Kenji Sugimoto , Kaoru Aoki , Moritaka Yano , Satoshi Yamamoto , Tsuyoshi Mitsuhashi , Takashi Nagao , Mitsumasa Kodama , Yukihiko Inagaki , Yoshihisa Yamada
IPC分类号： G03D500
CPC分类号： H01L21/67161 , H01L21/6715 , H01L21/67167 , H01L21/67178
摘要： A substrate processing apparatus includes a coating section, a developing section, a heat-treating section and a transport mechanism. The coating section has first processing units each for performing a coverage process to supply a photoresist solution to a substrate and cover a surface of the substrate with the photoresist solution, a second processing unit for spinning the substrate, after the coverage process, at high speed to make the photoresist solution into a film, dry the photoresist film, and clean the substrate. All substrates are processed with the same coating conditions to suppress differences in quality among the substrates. The first and second processing units perform the respective processes concurrently to improve the throughput of substrate processing.

4. 发明授权

US06752543B2 Substrate processing apparatus 有权
标题翻译：基板加工装置
公开(公告)号：US06752543B2
公开(公告)日：2004-06-22
申请号：US10427049
申请日：2003-04-30
申请人： Yoshiteru Fukutomi , Katsushi Yoshioka , Yukihiko Inagaki
发明人： Yoshiteru Fukutomi , Katsushi Yoshioka , Yukihiko Inagaki
IPC分类号： G03D500
CPC分类号： H01L21/67017
摘要： A manifold communicatively connects a plurality of coating processing units with an air conditioning unit. The manifold is formed by branching a common pipe into a plurality of distributing pipes. The air conditioning unit performs temperature control to set air passing through a branch point of the manifold to a temperature slightly lower than a target temperature in processing units. Secondary heaters secondarily heat air passing through joints between the distributing pipes and the processing units to the target temperature thereby supplying accurately temperature-controlled air to processing parts. Air from the air conditioning unit is diverted thereby suppressing the height of the overall apparatus. Thus, a substrate processing apparatus capable of inhibiting the height of the overall apparatus from remarkable increase also when vertically stacking processing parts in multiple stages and supplying temperature-controlled air to the processing parts with sufficient accuracy.
摘要翻译：歧管将多个涂覆处理单元与空调单元连通地连接。歧管通过将公共管分支成多个分配管而形成。空气调节单元进行温度控制，将通过歧管的分支点的空气设定为比处理单位略低于目标温度的温度。二次加热器二次将通过分配管和处理单元之间的接合处的空气加热到目标温度，从而将精确地温度控制的空气供给到处理部件。来自空调单元的空气被转向，从而抑制整个装置的高度。因此，当以多级垂直堆叠处理部分并且以足够的精度向处理部分供应温度控制的空气时，能够抑制整个装置的高度的基板处理装置也显着增加。

5. 发明授权

US5792259A Substrate processing apparatus and air supply method in substrate processing apparatus 失效
标题翻译：基板处理装置和基板处理装置中的供气方法
公开(公告)号：US5792259A
公开(公告)日：1998-08-11
申请号：US749348
申请日：1996-11-21
申请人： Katsushi Yoshioka , Yoshiteru Fukutomi , Kenji Sugimoto
发明人： Katsushi Yoshioka , Yoshiteru Fukutomi , Kenji Sugimoto
IPC分类号： G03F7/16 , B05C11/08 , B05C15/00 , H01L21/027 , B05C5/00
CPC分类号： B05C15/00 , B05C11/08
摘要： A velocity adjusting plate is provided above a substrate processing part in the interior of a substrate processing apparatus which is isolated from the external air. Thus, a downflow which is formed by conditioned air in the interior of the apparatus is separated into downflows having high and low velocities to be supplied to the substrate processing part and the periphery of the substrate processing part respectively. Consequently, the former downflow has a velocity which is suitable for controlling the temperature-humidity on the substrate surface and preventing the substrate from adhesion of particles and fine grains of a processing solution scattered from the substrate, while the latter downflow is suppressed to the minimum velocity which is necessary for preventing dusts and particles from creeping up by dispersion. Thus, it is possible to reduce consumption of air which is adjusted in temperature-humidity while isolating the interior of the apparatus from the external air.
摘要翻译：速度调节板设置在与外部空气隔离的基板处理装置的内部的基板处理部的上方。因此，在设备内部由调节空气形成的下降流被分离成具有高和低速度的下流，以分别供应到基板处理部分和基板处理部分的周边。因此，前一下降流具有适合于控制基板表面的温度湿度的速度，并且防止基板粘附从基板散射的处理溶液的颗粒和细晶粒，同时将下降流抑制到最小防止灰尘和颗粒通过分散而爬行所需的速度。因此，可以在将设备的内部与外部空气隔离的同时降低在温度湿度下调节的空气的消耗。

6. 发明授权

US06832863B2 Substrate treating apparatus and method 有权
标题翻译：底物处理装置及方法
公开(公告)号：US06832863B2
公开(公告)日：2004-12-21
申请号：US10458719
申请日：2003-06-09
申请人： Kenji Sugimoto , Minobu Matsunaga , Masakazu Sanada , Katsushi Yoshioka , Kaoru Aoki , Moritaka Yano , Satoshi Yamamoto , Tsuyoshi Mitsuhashi , Takashi Nagao , Mitsumasa Kodama
发明人： Kenji Sugimoto , Minobu Matsunaga , Masakazu Sanada , Katsushi Yoshioka , Kaoru Aoki , Moritaka Yano , Satoshi Yamamoto , Tsuyoshi Mitsuhashi , Takashi Nagao , Mitsumasa Kodama
IPC分类号： G03D500
CPC分类号： H01L21/67173 , G03F7/70691 , H01L21/67178 , H01L21/67184 , H01L21/67276 , Y10S414/135 , Y10S414/14
摘要： A series of substrate transport paths for transporting substrates is arranged on upper and lower stories. Substrates are transferable between the substrate transport path on the first story and the substrate transport path on the second story. The paths include a going-only path for transporting the substrates forward, and a return-only path for transporting the substrates in the opposite direction, these paths being arranged on the upper and lower stories. An indexer connects one end of the substrate transport path on one story to one end of the substrate transport path on the other story. An interface connects the other end of the substrate transport path on one story to the other end of the substrate transport path on the other story. This construction efficiently reduces a waiting time due to interference between the substrates transported along the going-only path and the substrates transported along the return-only path.
摘要翻译：用于传送基板的一系列基板传送路径被布置在上层和下层。基底可以在第一层的基底输送路径和第二层的基底输送路径之间转移。这些路径包括用于向前传送基板的唯一路径，以及用于沿相反方向传送基板的返回路径，这些路径布置在上部和下部故事物上。分度器将另一个故事的基底传送路径的一端连接到基底传送路径的一端。一个界面将一个故事的基板传送路径的另一端连接到另一个故事的基板传送路径的另一端。这种构造有效地减少了由沿着仅路径传送的基板与沿着返回路径传送的基板之间的干涉导致的等待时间。

7. 发明授权

US07105074B2 Substrate treating method and apparatus 有权
公开(公告)号：US07105074B2
公开(公告)日：2006-09-12
申请号：US10202279
申请日：2002-07-22
申请人： Osamu Tamada , Tsuyoshi Mitsuhashi , Minobu Matsunaga , Katsushi Yoshioka , Kenji Sugimoto , Kaoru Aoki , Moritaka Yano , Satoshi Yamamoto , Masakazu Sanada , Takashi Nagao , Mitsumasa Kodama
发明人： Osamu Tamada , Tsuyoshi Mitsuhashi , Minobu Matsunaga , Katsushi Yoshioka , Kenji Sugimoto , Kaoru Aoki , Moritaka Yano , Satoshi Yamamoto , Masakazu Sanada , Takashi Nagao , Mitsumasa Kodama
IPC分类号： B05B3/00 , B08B3/00
CPC分类号： H01L21/6715 , H01L21/31133
摘要： A substrate treating apparatus is provided for eliminating wasteful consumption of a treating solution in a treating mode in which the treating solution is delivered in a strip form to a substrate from a treating solution delivery nozzle sweeping over the substrate. In a first aspect of the invention, collecting vessels are arranged around a developing cup surrounding a wafer supported by a wafer holder. The collecting vessels collect part of a developer delivered from a discharge opening of a developer delivery nozzle outwardly of a surface of the wafer. In a second aspect of the invention, collecting vessels are arranged below a developer delivery nozzle, with collecting openings of the collecting vessels opposed to a discharge opening or openings of the delivery nozzle. The collecting vessels are moved longitudinally of the discharge openings according to a position of the developer delivery nozzle relative to the wafer.

8. 发明授权

US5762709A Substrate spin coating apparatus 失效
标题翻译：基材旋涂装置
公开(公告)号：US5762709A
公开(公告)日：1998-06-09
申请号：US680983
申请日：1996-07-16
申请人： Kenji Sugimoto , Katsushi Yoshioka , Seiichiro Okuda , Tsuyoshi Mitsuhashi
发明人： Kenji Sugimoto , Katsushi Yoshioka , Seiichiro Okuda , Tsuyoshi Mitsuhashi
IPC分类号： G03F7/16 , B05C11/08 , B05D1/40 , H01L21/00 , H01L21/027 , B05C11/02
CPC分类号： H01L21/6715 , B05C11/08
摘要： A substrate spin coating apparatus for forming a coating film on the upper surface of a spinning substrate includes a spin chuck for supporting and spinning the substrate while holding same substantially in horizontal posture. A scatter preventive cup surrounds lateral and lower regions of the spin chuck, and defines an opening in an upper central region thereof for allowing entry of air flows. An exhaust vent is provided for downwardly exhausting the air flows, and a nozzle is provided for supplying a coating solution through the opening of the scatter preventive cup to the upper surface of the substrate. The scatter preventive cup includes an air passage formed in a bottom region thereof and opening toward a lower surface of the substrate. An air flow adjusting unit is connected to the air passage for adjusting an air flow to a predetermined temperature and supplying the adjusted air flow to the air passage.
摘要翻译：用于在纺丝基材的上表面上形成涂膜的基材旋涂装置包括：旋转卡盘，用于支撑和旋转基材，同时基本保持水平姿势。散射防止杯围绕旋转卡盘的横向和下部区域，并且在其上部中心区域中限定开口以允许空气流进入。设置有用于向下排出空气流的排气口，并且设置有用于通过散射防止杯的开口将涂布溶液供给到基板的上表面的喷嘴。散射防止杯包括形成在其底部区域中并且朝向基板的下表面开口的空气通道。气流调节单元连接到空气通道，用于将空气流调节到预定温度，并将经调节的空气流供应到空气通道。

9. 发明授权

US06827782B2 Chemical treating apparatus 有权
标题翻译：化学处理设备
公开(公告)号：US06827782B2
公开(公告)日：2004-12-07
申请号：US10353151
申请日：2003-01-28
申请人： Shigehiro Goto , Katsushi Yoshioka , Minobu Matsunaga
发明人： Shigehiro Goto , Katsushi Yoshioka , Minobu Matsunaga
IPC分类号： B05B716
CPC分类号： H01L21/6715 , B05B7/1666 , B05B12/1472 , B05C5/001 , H01L21/67051
摘要： A chemical treating apparatus for performing a predetermined treatment of a principal surface of a substrate by delivering a treating solution thereto. The apparatus includes a treating solution delivery nozzle for delivering the treating solution to the principal surface of a substrate. The nozzle has a treating solution reservoir adjacent a tip end thereof for storing the treating solution. A temperature control device holds the treating solution reservoir to control the temperature of the treating solution in the treating solution reservoir through heat exchange with the treating solution.
摘要翻译：一种化学处理装置，用于通过将处理溶液输送到基板的主表面进行预定处理。该设备包括用于将处理溶液输送到基底的主表面的处理溶液输送喷嘴。喷嘴具有邻近其顶端的处理溶液储存器，用于存储处理溶液。温度控制装置保持处理液储存器，以通过与处理溶液的热交换来控制处理溶液储存器中处理溶液的温度。

10. 发明授权

US5376216A Device for holding and rotating a substrate 失效
标题翻译：用于保持和旋转衬底的装置
公开(公告)号：US5376216A
公开(公告)日：1994-12-27
申请号：US220207
申请日：1994-03-30
申请人： Katsushi Yoshioka , Koji Nakagawa , Masayuki Itaba , Nobuyasu Hiraoka , Masafumi Takeoka
发明人： Katsushi Yoshioka , Koji Nakagawa , Masayuki Itaba , Nobuyasu Hiraoka , Masafumi Takeoka
IPC分类号： B05B13/02 , B05C11/08 , G11B7/26 , H01L21/027 , H01L21/30 , H01L21/304 , H01L21/306 , H01L21/683 , H01L21/687 , C23F1/02
CPC分类号： H01L21/68728 , B05C11/08
摘要： A plurality of substrate holding members and a substrate pressing member are disposed on a rotation stage at a peripheral portion. The substrate pressing member includes a magnet and is pivotally supported by the rotation stage. A ring-shaped permanent magnet is located below the rotation stage and forms a ring around the rotation axis of the rotation stage. When a substrate mounted on the rotation stage is rotated and processed, the ring-shaped permanent magnet is positioned in the vicinity of the magnet of the substrate pressing member. This creates a magnetic force between the magnets, causing the substrate pressing member to pivot so that the substrate pressing member contacts the edge of the substrate with a predetermined amount of pressure.
摘要翻译：多个基板保持构件和基板按压构件设置在周边部分的旋转台上。基板按压部件包括磁体并且由旋转台可枢转地支撑。环形永磁体位于旋转台的下方，并且围绕旋转台的旋转轴线形成环。当安装在旋转台上的基板旋转和加工时，环形永磁体位于基板按压部件的磁体附近。这在磁体之间产生磁力，导致基板按压部件枢转，使得基板按压部件以预定量的压力接触基板的边缘。

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