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1. 发明授权

US5101848A Shut off apparatus for a fluid passage, method for controlling the same, and method for confirming closing of the same 失效
标题翻译：关闭流体通道的装置，用于控制流体通道的方法以及确认其关闭的方法
公开(公告)号：US5101848A
公开(公告)日：1992-04-07
申请号：US667664
申请日：1991-03-11
申请人： Yoshio Kojima , Tsutomu Okusawa , Kuniyoshi Tsubouchi , Yoichi Yoshinaga , Yusuke Takagi , Kenji Mitani , Nobuo Hamano
发明人： Yoshio Kojima , Tsutomu Okusawa , Kuniyoshi Tsubouchi , Yoichi Yoshinaga , Yusuke Takagi , Kenji Mitani , Nobuo Hamano
IPC分类号： G01N1/00 , F16K13/10 , F16L55/10 , F16L55/103
CPC分类号： F16L55/103 , F16K13/10 , F16L55/10 , Y10T137/0391 , Y10T137/2196
摘要： Method of opening and closing a fluid passage comprises the steps of freezing fluid in the fluid passage by first cooling the fluid to a temperature below the freezing point of the fluid to close the fluid passage and after the fluid passage is closed, raising the temperature of the fluid close (or just below) to the freezing point of the fluid, whereby the fluid passage is maintained in a closed state with a small power supply and the responsiveness in opening the fluid passage is enhanced.
摘要翻译：打开和关闭流体通道的方法包括以下步骤：首先将流体冷却至低于流体凝固点的温度以关闭流体通道，并且在流体通道关闭之后，将流体冷冻至流体通道的温度流体关闭（或恰好在下面）到流体的凝固点，由此通过小的电源将流体通道保持在关闭状态，并且增加了打开流体通道的响应性。

2. 发明授权

US4989626A Apparatus for and method of controlling the opening and closing of channel for liquid 失效
标题翻译：用于控制液体通道开启和关闭的装置和方法
公开(公告)号：US4989626A
公开(公告)日：1991-02-05
申请号：US433330
申请日：1989-11-08
申请人： Yusuke Takagi , Yoshio Kojima , Kenji Mitani
发明人： Yusuke Takagi , Yoshio Kojima , Kenji Mitani
IPC分类号： G01N1/00 , F16K31/02 , F16K31/12 , F16L55/10 , F16L55/103 , G01N1/10 , G01N1/28 , G01N35/10
CPC分类号： F16L55/103 , Y10T137/0391 , Y10T137/2196 , Y10T137/6606
摘要： An apparatus for controlling the opening and closing of a channel for a liquid is arranged such that a liquid channel is closed by causing a controller to control one heat absorbing and generating part of a cooling/heating element to execute heat absorption and cooling a heat transmitting element to solidify the liquid in the channel. The apparatus is also arrangement such that the channel is opened first by causing the controller to control the same heat absorbing and generating part to execute heat generation and heating the heat transmitting element to melt the liquid solidified in the channel. A method of controlling the opening and closing of a channel according to the invention includes the steps of: solidifying a liquid in a channel by cooling it from the outside to close the channel; and opening the channel thus closed by melting the liquid solidified in the channel by the application of heat.

3. 发明授权

US4721388A Method of measuring shape of object in non-contacting manner 失效
标题翻译：以非接触方式测量物体形状的方法
公开(公告)号：US4721388A
公开(公告)日：1988-01-26
申请号：US784501
申请日：1985-10-04
申请人： Yusuke Takagi , Yoshio Kojima , Kazuo Moriguti , Tsunehiko Takakusagi
发明人： Yusuke Takagi , Yoshio Kojima , Kazuo Moriguti , Tsunehiko Takakusagi
IPC分类号： G01B11/24 , G01B11/00 , G01B11/03
CPC分类号： G01B11/005
摘要： This invention relates to a method of measuring the shape of an object in a non-contacting manner. The method comprises the steps of providing reference points on the object, the coordinates of which are known in an object coordinate system for expressing the shape of the object; applying a light spot on the reference points while moving a light spot detecting sensor to determine the coordinate values in a measuring coordinate system; determining the relative positional relation between the two coordinate systems by using coordinate values thus determined and the coordinate values in the object coordinate system; measuring points on the object to measure the shape of the object; and comparing the coordinate values, relating to shape of the object and determined in the measuring coordinate system, with reference values which are design values modulated with the relative positional value and converted into coordinate values in the measuring coordinate system in an arithmetic control unit, whereby a manufacturing error of said object is measured.
摘要翻译：本发明涉及以非接触方式测量物体的形状的方法。该方法包括以下步骤：在物体上提供参考点，其坐标在对象坐标系中已知，用于表示物体的形状; 在移动光点检测传感器的同时在参考点上施加光斑以确定测量坐标系中的坐标值; 通过使用如此确定的坐标值和对象坐标系中的坐标值来确定两个坐标系之间的相对位置关系; 物体上的测量点来测量物体的形状; 并且将与测量坐标系中确定的物体的形状相关的坐标值与作为在相对位置值调制的设计值的参考值进行比较，并将其转换为算术控制单元中的测量坐标系中的坐标值，由此测量所述物体的制造误差。

4. 发明授权

US09270195B2 Power converter including a power module allowing main current supply and cutoff 有权
标题翻译：电源转换器包括一个允许主电流供应和切断的电源模块
公开(公告)号：US09270195B2
公开(公告)日：2016-02-23
申请号：US13580272
申请日：2010-08-19
申请人： Shinichi Fujino , Yusuke Takagi , Takuma Hakuto
发明人： Shinichi Fujino , Yusuke Takagi , Takuma Hakuto
IPC分类号： H02M7/00 , H02M3/00 , H03K17/691
CPC分类号： H02M7/003 , H01L2224/0603 , H01L2224/4903 , H01L2224/49111 , H01L2924/1305 , H01L2924/13055 , H01L2924/19107 , H02M3/00 , H03K17/691 , H01L2924/00
摘要： A power converter includes a power module allowing supply and cutoff of main current, a driver module controlling supply and cutoff of the main current, a high potential side semiconductor device, and a low potential side semiconductor device. Plural power module side wirings are connected with respective electrodes contained in the high and low potential side semiconductor devices. Plural driver module side wirings are provided on the driver module as wirings connected with the plural corresponding power module side wirings. Conductors are disposed in the vicinity of a plane on which the plural power module side wirings are provided and a plane on which the plural driver module side wirings are provided, and electrically connected to surround magnetic flux generated by current looping at least through a power source transformer, the driver module side wirings, and the power module side wirings.
摘要翻译：功率转换器包括允许主电源供应和截止的电源模块，控制主电流的供应和截止的驱动器模块，高电位侧半导体器件和低电位侧半导体器件。多个功率模块侧布线与包含在高电位侧和低电位侧半导体器件中的各个电极连接。多个驱动器模块侧配线设置在驱动器模块上，作为与多个对应的功率模块侧配线连接的配线。导体配置在设置有多个功率模块侧配线的平面附近以及设置有多个驱动器模块侧配线的平面，并且电连接以将至少通过电源回路产生的磁通量包围变压器，驱动器模块侧布线和电源模块侧布线。

5. 发明申请

US20110310585A1 Power Semiconductor Device and Power Conversion Device 有权
标题翻译：功率半导体器件和电源转换器件
公开(公告)号：US20110310585A1
公开(公告)日：2011-12-22
申请号：US13163950
申请日：2011-06-20
申请人： Tokihito SUWA , Yujiro Kaneko , Yusuke Takagi , Shinichi Fujino , Takahiro Shimura
发明人： Tokihito SUWA , Yujiro Kaneko , Yusuke Takagi , Shinichi Fujino , Takahiro Shimura
IPC分类号： H05K7/20 , H01L23/48
CPC分类号： H05K5/0247 , H01L21/565 , H01L23/3107 , H01L23/473 , H01L23/49562 , H01L23/49575 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/34 , H01L24/36 , H01L24/40 , H01L24/48 , H01L24/73 , H01L2224/291 , H01L2224/29139 , H01L2224/32245 , H01L2224/33181 , H01L2224/40137 , H01L2224/48247 , H01L2224/73215 , H01L2224/73221 , H01L2224/73265 , H01L2224/83801 , H01L2224/8384 , H01L2924/00014 , H01L2924/1203 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H01L2924/351 , H02M7/537 , H05K7/1432 , H05K7/20845 , H05K7/2089 , H05K7/20927 , H01L2924/014 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/37099 , H01L2224/37599 , H01L2224/84
摘要： A power semiconductor device includes a plurality of power semiconductor elements constituting upper and lower arms of an inverter circuit, a first sealing member sealing the plurality of power semiconductor elements, a positive electrode-side terminal and a negative electrode-side terminal each connected with any of the plurality of power semiconductor elements and protruding from the first sealing member, a second sealing member sealing at least a part of the positive electrode-side terminal and at least a part of the negative electrode-side terminal, and a case in which the power semiconductor elements sealed with the first sealing member are housed.
摘要翻译：功率半导体装置包括构成逆变器电路的上臂和下臂的多个功率半导体元件，密封多个功率半导体元件的第一密封构件，正极侧端子和负极侧端子并且从所述第一密封部件突出的第二密封部件，密封所述正极侧端子和所述负极侧端子的至少一部分的至少一部分的第二密封部件，其中，容纳用第一密封构件密封的功率半导体元件。

6. 发明授权

US07685979B2 Variable valve timing mechanism for internal combustion engine 有权
标题翻译：内燃机可变气门正时机构
公开(公告)号：US07685979B2
公开(公告)日：2010-03-30
申请号：US11861580
申请日：2007-09-26
申请人： Yuuzou Akasaka , Yusuke Takagi
发明人： Yuuzou Akasaka , Yusuke Takagi
IPC分类号： F01L1/34
CPC分类号： F01L13/0026 , F01L13/0021 , F01L2001/0476 , F01L2013/0073 , F01L2820/032
摘要： A variable valve timing mechanism comprises a drive shaft including a rocker arm, a control shaft, a stopper, a first spring member and a second spring member. The rocker arm opens and closes at least one of an intake/exhaust valve in response to rotation of the drive shaft. The control shaft changes a position of the rocker arm to continuously change valve lift characteristics of the intake/exhaust valve in response to rotation of the control shaft by driving a control shaft actuator. The stopper regulates an operating range of rotation of the control shaft between upper and lower limits. The first and second spring members urge the control shaft towards the upper and lower limits, respectively. The first and second spring members return the control shaft to a balance position between the upper limit position and the lower limit position when the internal combustion engine stops.
摘要翻译：可变气门正时机构包括：驱动轴，包括摇臂，控制轴，止动件，第一弹簧构件和第二弹簧构件。响应于驱动轴的旋转，摇臂打开和关闭进/排气门中的至少一个。控制轴通过驱动控制轴致动器来改变摇臂的位置，以响应于控制轴的旋转而连续地改变进/排气门的气门升程特性。止动器调节控制轴在上限和下限之间的旋转操作范围。第一和第二弹簧构件分别促使控制轴朝向上限和下限。当内燃机停止时，第一和第二弹簧构件将控制轴返回到上限位置和下限位置之间的平衡位置。

7. 发明授权

US09693466B2 Wiring board and manufacturing method thereof 有权
公开(公告)号：US09693466B2
公开(公告)日：2017-06-27
申请号：US13397867
申请日：2012-02-16
申请人： Akira Harao , Mototatsu Matsunaga , Yusuke Takagi , Akinori Saneto
发明人： Akira Harao , Mototatsu Matsunaga , Yusuke Takagi , Akinori Saneto
IPC分类号： H05K3/44 , H05K3/32 , H05K1/03 , H05K1/05
CPC分类号： H05K3/445 , H05K1/0366 , H05K1/056 , H05K3/325 , H05K2201/1059 , H05K2201/1081
摘要： The present invention is to provide a wiring board which can prevent whitening. The wiring board is made of a fiber reinforced resin plate, and has a through hole and a whitening prevention portion. The whitening prevention portion is made only with matrix resin forming the fiber reinforced resin plate, and is integrally formed in the fiber reinforced resin plate. Furthermore, the whitening prevention portion is arranged around the through hole.

8. 发明授权

US08521202B2 Mobile station device, wireless communication system, mobile station device control method, and mobile station device control program 有权
标题翻译：移动台装置，无线通信系统，移动台装置控制方式以及移动台装置控制方案
公开(公告)号：US08521202B2
公开(公告)日：2013-08-27
申请号：US12744442
申请日：2008-11-26
申请人： Shusaku Fukumoto , Keiji Hikoso , Yusuke Takagi
发明人： Shusaku Fukumoto , Keiji Hikoso , Yusuke Takagi
IPC分类号： H04Q7/32
CPC分类号： H04W48/16 , H04W36/0083 , H04W36/32
摘要： A mobile station device, which communicates with a base station device, includes a control signal generator that initiates or terminates a cell search based on a reception quality value of a radio wave transmitted from the base station device, and a moving speed of the mobile station device.
摘要翻译：与基站装置进行通信的移动站装置包括基于从基站装置发送的无线电波的接收质量值，启动或终止小区搜索的控制信号发生器，以及移动站的移动速度设备。

9. 发明授权

US09179581B2 Power semiconductor device and power conversion device 有权
标题翻译：功率半导体器件和电源转换器件
公开(公告)号：US09179581B2
公开(公告)日：2015-11-03
申请号：US13163950
申请日：2011-06-20
申请人： Tokihito Suwa , Yujiro Kaneko , Yusuke Takagi , Shinichi Fujino , Takahiro Shimura
发明人： Tokihito Suwa , Yujiro Kaneko , Yusuke Takagi , Shinichi Fujino , Takahiro Shimura
IPC分类号： H05K7/00 , H05K7/20 , H01L23/473 , H01L23/495 , H01L23/31 , H01L21/56 , H01L23/00
CPC分类号： H05K5/0247 , H01L21/565 , H01L23/3107 , H01L23/473 , H01L23/49562 , H01L23/49575 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/34 , H01L24/36 , H01L24/40 , H01L24/48 , H01L24/73 , H01L2224/291 , H01L2224/29139 , H01L2224/32245 , H01L2224/33181 , H01L2224/40137 , H01L2224/48247 , H01L2224/73215 , H01L2224/73221 , H01L2224/73265 , H01L2224/83801 , H01L2224/8384 , H01L2924/00014 , H01L2924/1203 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H01L2924/351 , H02M7/537 , H05K7/1432 , H05K7/20845 , H05K7/2089 , H05K7/20927 , H01L2924/014 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/37099 , H01L2224/37599 , H01L2224/84
摘要： A power semiconductor device includes a plurality of power semiconductor elements constituting upper and lower arms of an inverter circuit, a first sealing member sealing the plurality of power semiconductor elements, a positive electrode-side terminal and a negative electrode-side terminal each connected with any of the plurality of power semiconductor elements and protruding from the first sealing member, a second sealing member sealing at least a part of the positive electrode-side terminal and at least a part of the negative electrode-side terminal, and a case in which the power semiconductor elements sealed with the first sealing member are housed.
摘要翻译：功率半导体装置包括构成逆变器电路的上臂和下臂的多个功率半导体元件，密封多个功率半导体元件的第一密封构件，正极侧端子和负极侧端子并且从所述第一密封部件突出的第二密封部件，密封所述正极侧端子和所述负极侧端子的至少一部分的至少一部分的第二密封部件，其中，容纳用第一密封构件密封的功率半导体元件。

10. 发明申请

US20130175678A1 Power Semiconductor Module and Manufacturing Method Thereof 有权
标题翻译：功率半导体模块及其制造方法
公开(公告)号：US20130175678A1
公开(公告)日：2013-07-11
申请号：US13818490
申请日：2011-09-05
申请人： Eiichi Ide , Shinji Hiramitsu , Hiroshi Hozoji , Nobutake Tsuyuno , Kinya Nakatsu , Takeshi Tokuyama , Akira Matsushita , Yusuke Takagi
发明人： Eiichi Ide , Shinji Hiramitsu , Hiroshi Hozoji , Nobutake Tsuyuno , Kinya Nakatsu , Takeshi Tokuyama , Akira Matsushita , Yusuke Takagi
IPC分类号： H01L23/34 , H01L21/48
CPC分类号： H01L23/34 , H01L21/4825 , H01L23/36 , H01L23/4334 , H01L23/473 , H01L23/492 , H01L23/49524 , H01L23/49575 , H01L24/29 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/83 , H01L24/84 , H01L25/072 , H01L25/18 , H01L2224/29111 , H01L2224/32245 , H01L2224/32503 , H01L2224/33 , H01L2224/33181 , H01L2224/3521 , H01L2224/37013 , H01L2224/37124 , H01L2224/37147 , H01L2224/37639 , H01L2224/37644 , H01L2224/37655 , H01L2224/40137 , H01L2224/48091 , H01L2224/4847 , H01L2224/48472 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/1203 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/351 , H01L2924/00 , H01L2924/1306 , H01L2924/1305 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599 , H01L2924/01047 , H01L2924/01029
摘要： A power semiconductor module includes a power semiconductor element formed with a plurality of control electrodes on one main surface, a first conductor plate bonded by way of a first solder material to one of the main surfaces of the power semiconductor element, and a second conductor plate bonded by way of a second solder material on the other main surface of the power semiconductor element. A first protrusion section protruding from the base section of the applicable first conductor plate and including a first protrusion surface formed over the upper side, is formed over the first conductor plate. A second protrusion section including a second protrusion surface formed facing opposite one of the main surfaces of the power semiconductor element. The first solder material is interposed between the power semiconductor element and the first conductor plate while avoiding the plural control electrodes. If there is an projection from a perpendicular direction by one of the main surfaces of the power semiconductor element, the second protrusion section is formed so that the projecting section on a specified side of the second protrusion surface overlaps the projecting section of the step section formed between the base section of the first conductor plate and the first protrusion section. The plural control electrodes on the power semiconductor element are formed along the specified side of the second protrusion surface.
摘要翻译：功率半导体模块包括在一个主表面上形成有多个控制电极的功率半导体元件，通过第一焊料材料连接到功率半导体元件的主表面之一的第一导体板和第二导体板通过第二焊料材料在功率半导体元件的另一个主表面上接合。在第一导体板上形成有从可应用的第一导体板的基部突出并且包括形成在上侧的第一突起表面的第一突出部。第二突起部分，包括形成在与功率半导体元件的主表面相对的一个表面上的第二突起表面。第一焊料材料插入在功率半导体元件和第一导体板之间，同时避免多个控制电极。如果通过功率半导体元件的一个主面从垂直方向突出，则第二突起部形成为使得第二突起表面的特定侧的突出部与形成的台阶部的突出部重叠在第一导体板的基部与第一突起部之间。功率半导体元件上的多个控制电极沿第二突出面的规定侧形成。

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