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    • 7. 发明授权
    • Method for laser processing of wafer
    • 晶圆激光加工方法
    • US07396780B2
    • 2008-07-08
    • US11261600
    • 2005-10-31
    • Hitoshi HoshinoRyugo ObaKenji FurutaNoburu TakedaNobuyasu Kitahara
    • Hitoshi HoshinoRyugo ObaKenji FurutaNoburu TakedaNobuyasu Kitahara
    • H01L21/324
    • H01L21/67092B23K26/0853B23K26/702
    • A method of carrying out the laser processing of a wafer with a laser beam processing machine comprising a chuck table for holding a wafer, a laser beam application means for applying a laser beam to the wafer held on the chuck table and a processing-feed means for processing-feeding the chuck table and the laser beam application means relative to each other, comprising the steps of a wafer affixing step for putting the wafer on the surface of a protective tape mounted on an annular frame, a wafer holding step for holding the wafer put on the protective tape on the chuck table, and a laser beam application step for applying a laser beam having a predetermined wavelength from the laser beam application means to the wafer held on the chuck table and processing-feeding the wafer with the processing-feed means, wherein the protective tape is made of a material which transmits the laser beam having a predetermined wavelength applied from the laser beam application means.
    • 一种利用激光束处理机进行激光加工的方法,所述激光束处理机包括用于保持晶片的卡盘台,激光束施加装置,用于将激光束施加到保持在卡盘台上的晶片上,以及加工进给装置 用于将夹盘和激光束施加装置相对于彼此进行加工,包括以下步骤:将晶片放置在安装在环形框架上的保护带的表面上的晶片固定步骤,用于保持 晶片放在卡盘台上的保护带上,以及激光束施加步骤,用于将来自激光束施加装置的具有预定波长的激光束施加到保持在卡盘台上的晶片上, 馈送装置,其中保护带由透射从激光束施加装置施加的具有预定波长的激光束的材料制成。
    • 8. 发明授权
    • Wafer processing method
    • 晶圆加工方法
    • US07134942B2
    • 2006-11-14
    • US10936678
    • 2004-09-09
    • Yusuke NagaiMasashi AokiHitoshi Hoshino
    • Yusuke NagaiMasashi AokiHitoshi Hoshino
    • B24B1/00H01L21/463
    • B24B37/042B23K26/364B23K26/40B23K2101/40B23K2103/50H01L21/78
    • A wafer processing method for dividing a wafer having optical devices that are formed in a plurality of areas sectioned by dividing lines formed in a lattice pattern on the front surface, along the dividing lines, which comprises a laser beam application step of applying a laser beam to the wafer along the dividing lines from the side of the back surface thereof to form grooves having a predetermined depth in the back surface; a protective sheet affixing step of affixing a protective sheet to the front surface of the wafer having the grooves in the back surface; a dividing step of dividing the wafer having the protective sheet affixed to the front surface along the grooves; and a grinding step of grinding the back surface of the wafer divided along the grooves in a state of the protective sheet being affixed to the wafer, to remove the grooves.
    • 一种晶片处理方法,用于沿着分割线分割形成在由表面上形成为格子图案的分割线划分的多个区域中的光学器件的晶片,该分割线包括施加激光束的激光束施加步骤 沿着分割线从其背面的一侧到晶片,以形成在后表面中具有预定深度的凹槽; 保护片固定步骤,将保护片固定在具有后表面的凹槽的晶片的前表面; 分割步骤,沿着所述凹槽分割具有固定在所述前表面上的所述保护片的所述晶片; 以及磨削步骤,在保护片固定在晶片上的状态下研磨沿着槽划分的晶片的背面,以去除凹槽。
    • 9. 发明申请
    • Method for laser processing of wafer
    • 晶圆激光加工方法
    • US20060094260A1
    • 2006-05-04
    • US11261600
    • 2005-10-31
    • Hitoshi HoshinoRyugo ObaKenji FurutaNoburu TakedaNobuyasu Kitahara
    • Hitoshi HoshinoRyugo ObaKenji FurutaNoburu TakedaNobuyasu Kitahara
    • H01L21/324
    • H01L21/67092B23K26/0853B23K26/702
    • A method of carrying out the laser processing of a wafer with a laser beam processing machine comprising a chuck table for holding a wafer, a laser beam application means for applying a laser beam to the wafer held on the chuck table and a processing-feed means for processing-feeding the chuck table and the laser beam application means relative to each other, comprising the steps of a wafer affixing step for putting the wafer on the surface of a protective tape mounted on an annular frame, a wafer holding step for holding the wafer put on the protective tape on the chuck table, and a laser beam application step for applying a laser beam having a predetermined wavelength from the laser beam application means to the wafer held on the chuck table and processing-feeding the wafer with the processing-feed means, wherein the protective tape is made of a material which transmits the laser beam having a predetermined wavelength applied from the laser beam application means.
    • 一种利用激光束处理机进行激光加工的方法,所述激光束处理机包括用于保持晶片的卡盘台,激光束施加装置,用于将激光束施加到保持在卡盘台上的晶片上,以及加工进给装置 用于将夹盘和激光束施加装置相对于彼此进行加工,包括以下步骤:将晶片放置在安装在环形框架上的保护带的表面上的晶片固定步骤,用于保持 晶片放在卡盘台上的保护带上,以及激光束施加步骤,用于将来自激光束施加装置的具有预定波长的激光束施加到保持在卡盘台上的晶片上, 馈送装置,其中保护带由透射从激光束施加装置施加的具有预定波长的激光束的材料制成。