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1. 发明专利

JP2003321798A Method and apparatus for electrical treatment such as electroplating 有权
标题翻译：电解处理方法和装置
公开(公告)号：JP2003321798A
公开(公告)日：2003-11-14
申请号：JP2000401301
申请日：2000-12-28
申请人： Yoshihiro Asai , Seizo Miyata , Hideo Yoshida , 英夫吉田 , 清蔵宮田 , 美博浅井
发明人： YOSHIDA HIDEO , MIYATA SEIZO , SONE MASATO , IWAO FUMIKO , ASAI YOSHIHIRO , ASAI HIROSHIGE
IPC分类号： B01J3/00 , C25D17/00
摘要： PROBLEM TO BE SOLVED: To provide a method and apparatus for electrical treatment such as electroplating which is suitably used for example, for the electrical treatment such as electroplating and in which each process is safely and reasonably performed using super critical or subcritical carbon dioxide, and carbon dioxide, a treating liquid and the like after being used are safely, reasonably and rapidly treated, the quantity of a pickling solution, a plating solution or the like to be used is reduced, the waste water produced by the plating is decreased and recycled to prevent the environmental pollution to improve the working environment and the productivity, the throwing power of the plating is remarkably improved and fine finish is attained. SOLUTION: A super critical or subcritical state is formed in a reaction vessel 1 housing electrolytic materials and an electrolyte solution. An electrode material 3 is electrolyzed under the critical state or subcritical state or the electrolyzed electrode material and/or the electrolytic materials contained in the electrolyte solution are deposited and stuck on the other electrode material 4. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种适用于例如电镀等电处理的电镀等电气处理方法和装置，其中每个工艺使用超临界或亚临界碳安全合理地进行二氧化碳，二氧化碳，使用后的处理液等被安全，合理，快速地处理，所使用的酸洗液，电镀液等的用量减少，镀敷产生的废水为减少再循环，防止环境污染，改善工作环境和生产率，镀层的抛光力明显提高，精加工达到。解决方案：在容纳电解材料和电解质溶液的反应容器1中形成超临界或亚临界状态。电极材料3在临界状态或亚临界状态下被电解，或电解液中的电解质和/或电解质材料沉积在另一电极材料4上。（C）2004， JPO

2. 发明专利

JP2003321791A Electrochemical reaction method 有权
标题翻译：电化学反应方法
公开(公告)号：JP2003321791A
公开(公告)日：2003-11-14
申请号：JP2000253572
申请日：2000-08-24
申请人： Yoshihiro Asai , Seizo Miyata , Hideo Yoshida , 英夫吉田 , 清蔵宮田 , 美博浅井
发明人： YOSHIDA HIDEO , MIYATA SEIZO , SONE MASATO , IWAO FUMIKO , ASAI YOSHIHIRO , ASAI HIROSHIGE
IPC分类号： B23H3/00 , B23H5/08 , C23C18/16 , C23C22/05 , C25D1/00 , C25D3/02 , C25D11/04 , C25D13/10 , C25F3/16
摘要： PROBLEM TO BE SOLVED: To provide a novel electrochemical reaction method which provides high reactivity, can efficiency cause reaction, and is environmentally favorable as the method reduces production amount of waste solutions of an electrolytic solution, cleaning solution, etc., or does not produce the waste solutions at all, and which does not require cleaning of electrodes, etc., with a cleaning solution after the reaction.
SOLUTION: The method comprises conducting reaction in a bath containing a substance made into a supercritical state and the electrolytic solution and if necessary, a surfactant and shifting the substance made into the supercritical state to the pre-supercritical state.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种提供高反应性，效率可以引起反应的新型电化学反应方法，并且在环境方面有利于该方法降低电解液，清洁溶液等的废溶液的生产量，或不会产生废溶液，并且不需要在反应后用清洁溶液清洗电极等。解决方案：该方法包括在含有制成超临界状态的物质的浴中进行反应，并且将电解液和必要时的表面活性剂进行反应，并将制成超临界状态的物质转移到超临界状态。版权所有（C）2004，JPO

3. 发明专利

JP2003321793A Electrochemical treatment method, such as electroplating, and electrochemical reaction apparatus for the same 有权
标题翻译：电化学处理方法，如电镀，电化学反应装置
公开(公告)号：JP2003321793A
公开(公告)日：2003-11-14
申请号：JP2001137191
申请日：2001-05-08
申请人： Yoshihiro Asai , Seizo Miyata , Hideo Yoshida , 英夫吉田 , 清蔵宮田 , 美博浅井
发明人： YOSHIDA HIDEO , MIYATA SEIZO , SONE MASATO , IWAO FUMIKO , ASAI YOSHIHIRO , ASAI HIROSHIGE
IPC分类号： C25D5/00 , C23G5/00 , C25D21/00
摘要： PROBLEM TO BE SOLVED: To provide an electrochemical treatment method, such as electroplating, arranged to be adequate for an electrochemical treatment, such as electroplating, to rationally and efficiently conduct an electrochemical reaction by suppressing the electrolysis of a solvent of an electrolytic solution, to make obtaining of dense and thin metallic films possible, to make productivity better and facilities smaller in size and lighter in weight, to permit safe and rational conduction of respective treatment process steps, to reduce the volume of waste liquids in the respective treatment process steps and to prevent environment pollution and an electrochemical reaction apparatus for the same. SOLUTION: A pressurizing liquid 7 is introduced into a reaction bath vessel 1 capable of housing electrolytic materials 9 and 10 to pressurize the reaction bath vessel and to conduct the electrochemical reaction under the pressurized state. Also, the electrochemical reaction is conducted by adding a surfactant to the reaction bath vessel to emulsify the electrolytic solution and the pressurizing liquid. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了提供电化学等电化学处理方法，例如电镀等电化学处理，可以通过抑制电解溶剂的电解来合理有效地进行电化学反应解决方案，以获得可能的致密和薄金属膜，从而使生产率更好并且设备尺寸更小并且重量更轻，以允许各个处理工艺步骤的安全合理地传导，以减少相应处理中的废液体积工艺步骤和防止环境污染和电化学反应装置。解决方案：将加压液体7引入能够容纳电解质材料9和10的反应槽容器1中，以加压反应槽容器并在加压状态下进行电化学反应。此外，通过向反应槽容器中加入表面活性剂以使电解液和加压液体乳化，进行电化学反应。版权所有（C）2004，JPO

4. 发明专利

JP2006312787A Surface treatment device for work 有权
标题翻译：表面处理设备的工作
公开(公告)号：JP2006312787A
公开(公告)日：2006-11-16
申请号：JP2006223000
申请日：2006-08-18
申请人： Asahi Kasei Engineering Kk , Hideo Yoshida , 英夫吉田 , 旭化成エンジニアリング株式会社
发明人： YOSHIDA HIDEO , MIYATA SEIZO , SONE MASATO , SATO NOBUYOSHI
IPC分类号： C25D17/00
摘要： PROBLEM TO BE SOLVED: To provide a surface treatment device for a work, e.g., suitable for electrochemical treatment to the work, where contact between the work and the air is evaded, the surface of the work is homogeneously activated at high precision, the satisfactory precipitation of metallic ions can be obtained, further, supply and exhaust of a surface treatment liquid and a treatment liquid are rationally performed, and their effective utilization and check of their exhaust to the outside of the system are attained, with which the realization of the rational system, the improvement of the productivity and mass-production can be attained, further, an electrochemical treatment operation can be rationally and safely performed, also, equipment scale of which can be reduced and cost of which can be reduced, and, whose maintenance is highly convenient.
SOLUTION: The surface treatment device is equipped with: a tank main body 25 storing a tool 5 capable of storing a work in a chamber 36 and capable of supplying and discharging a surface treatment liquid to/from the work; and a reactor 4 having a cover body 6 capable of hermetically sealing the opening part of the tank body 25. The cover body 6 is mounted with a single or a plurality of tools 5 attachably and detachably. The tool 5 can be inserted/extracted to the chamber 36 integrally with the cover body 6.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种用于工作的表面处理装置，例如适用于工作的电化学处理，其中工作和空气之间的接触被避开，工件的表面以高精度均匀地激活，可以获得令人满意的金属离子沉淀，进一步合理地进行表面处理液和处理液的供给和排出，有效利用和检查排气到系统外部，实现理性体系，提高生产力和批量生产，进一步可以合理，安全地实现电化学处理操作，同时降低设备规模，降低成本; ，维护方便。解决方案：表面处理装置配备有：储存工具5的罐主体25，其能够将工件存储在室36中，并且能够将工作表面处理液供给和排出; 以及具有能够气密地密封罐体25的开口部的盖体6的反应器4.盖体6以可拆卸的方式安装有一个或多个工具5。工具5可以与盖体6一体地插入/抽出到腔室36中。（C）2007，JPO＆INPIT

5. 发明专利

JP2005248192A Method for manufacturing thin film for separating hydrogen, and palladium plating bath 有权
标题翻译：用于制造用于分离氢的薄膜的方法和钯镀层
公开(公告)号：JP2005248192A
公开(公告)日：2005-09-15
申请号：JP2004055910
申请日：2004-03-01
申请人： Asahi Kasei Engineering Kk , Nariyuki Uemiya , Hideo Yoshida , 成之上宮 , 英夫吉田 , 旭化成エンジニアリング株式会社
发明人： UEMIYA NARIYUKI , YOSHIDA HIDEO , SONE MASATO , SATO NOBUYOSHI , MIYATA SEIZO
IPC分类号： C23C18/44 , C23C18/31 , H01M8/06
CPC分类号： Y02P70/56
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a thin film for separating hydrogen, and a palladium plating bath in which a hydrogen separating film to be used for, for example, a modified fuel cell is suitably manufactured, the hydrogen separating film is reduced in film thickness, hydrogen can be separated at high purity, a fuel reformer is reduced in size and weight, the modification reaction is performed with high efficiency and high economical efficiency a palladium thin film can be suitably manufactured by the plating method in the plating bath, the use of plating liquid is reduced, a uniform palladium film can be deposited, and the plating productivity can be improved.
SOLUTION: In the method for manufacturing the thin film for separating hydrogen, metal ions in plating liquid 10 stored in a reaction bath 1 are deposited on a work 18 to be plated. Plating liquid 10, supercritical state or substance formed therein, and surfactant 11 are stored in the reaction bath 1. After the super-critical state and the emulsion state are formed in the reaction bath 1, the metal ions are diffused to be deposited on the work 18 to be plated.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种制造用于分离氢的薄膜的方法，并且适当地制造用于例如改性燃料电池的氢分离膜的钯电镀浴，氢气分离膜的膜厚减小，氢能够以高纯度分离，燃料重整器的尺寸和重量减小，改性反应以高效率和高经济效率进行，钯薄膜可以通过电镀法适当地制造在镀浴中，电镀液的使用减少，可以沉积均匀的钯膜，并且可以提高电镀生产率。解决方案：在制造用于分离氢的薄膜的方法中，将储存在反应槽1中的电镀液10中的金属离子沉积在待电镀的工件18上。将电镀液10，超临界状态或其中形成的物质和表面活性剂11储存在反应槽1中。在反应浴1中形成超临界状态和乳液状态之后，金属离子被扩散沉积在工作18被镀。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2005154816A Surface treatment method for object to be treated, and treatment device therefor 有权
标题翻译：用于治疗对象的表面处理方法及其治疗装置
公开(公告)号：JP2005154816A
公开(公告)日：2005-06-16
申请号：JP2003393247
申请日：2003-11-25
申请人： Asahi Kasei Engineering Kk , Hideo Yoshida , 英夫吉田 , 旭化成エンジニアリング株式会社
发明人： SATO NOBUYOSHI , NISHIMURA KEIJI , YOSHIDA HIDEO , ABE KENTARO , SONE MASATO , MIYATA SEIZO
IPC分类号： C25D17/00
摘要： PROBLEM TO BE SOLVED: To provide a surface treatment method for the object to be treated, e.g., suitable for electroplating to the object to be treated, with which treatment fluid used for each treatment in electroplating is circularly fed in succession, and a series of treatments are rationally and speedily performed, thus the improvement of productivity and mass-production are attained, and further, a dense and homogeneous thin plated film having satisfactory follow-up properties can be obtained, and to provide a treatment device therefor.
SOLUTION: The surface treatment device for the object to be treated comprises a circulation path 8 into which a reaction tank 1 capable of storing the object 2 to be treated and prescribed surface treatment fluid is inserted. In the surface treatment method for the object to be treated, at the time when the object 2 to be treated is subjected to surface treatment, prescribed surface treatment fluid is circulated. The reaction tank 1 is equipped so as to be capable of electrochemical reaction. When the object 2 to be treated is subjected to surface treatment, prescribed surface treatment fluid is circulated through the circulation path 8.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种用于待处理物体的表面处理方法，例如适合于电镀到被处理物体，用于电镀中的每次处理所用的处理流体依次循环地供给;以及能够合理，快速地进行一系列处理，从而能够提高生产率和批量生产，并且可以获得具有令人满意的随动特性的致密均匀的薄膜，并提供其处理装置。解决方案：用于待处理物体的表面处理装置包括循环路径8，能够存储待处理物体2的反应罐1和规定的表面处理流体插入其中。在被处理物的表面处理方法中，在待处理对象物2进行表面处理时，规定的表面处理流体循环。反应槽1配置成能够进行电化学反应。当要处理的物体2进行表面处理时，规定的表面处理流体通过循环路径8循环。（C）2005，JPO＆NCIPI

7. 发明专利

JP2003313686A Apparatus for activating base material surface 有权
标题翻译：用于激活基材表面的装置
公开(公告)号：JP2003313686A
公开(公告)日：2003-11-06
申请号：JP2002124922
申请日：2002-04-25
申请人： Hideo Yoshida , 英夫吉田
发明人： YOSHIDA HIDEO , SATO NOBUYOSHI , SAKO TAKESHI , SONE MASATO , ABE KENTARO , SAKON KIYOTO
IPC分类号： C23G3/00 , B08B3/02 , B08B3/04 , B08B7/02 , C25D5/34
CPC分类号： B08B3/04 , B08B3/02 , B08B7/02 , C25D5/34 , Y10S134/902
摘要： PROBLEM TO BE SOLVED: To improve the productivity by simultaneously and efficiently performing degreasing, oxide film removal and drying, for the surface of a base material such as a metal, and to efficiently collect a used treatment fluid and recycle it.
SOLUTION: The apparatus for activating the surface of a member 25 to be treated by contacting it with a degreasing fluid 33 or an oxide film-removing fluid 3, comprises respective supplying means 17 and 14 which transport the degreasing fluid and the oxide film-removing fluid to the member to be treated from respective supply sources 11 and 1 of the above fluids, and of which the ends are arranged in the vicinity of the member so as to spray the degreasing fluid and the oxide film-removing fluid to the surface of the member; and a recovery pipe 31 of which one end is arranged so as to face the surface of the above member, and the other end is connected to the supply source of the oxide film-removing fluid, so that the degreasing fluid or the oxide film- removing fluid or both of the fluids can be returned to the supply sources of the oxide film-removing fluid through the above recovery pipe.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了通过同时且有效地进行脱脂，氧化膜去除和干燥来提高生产率，对于诸如金属的基材的表面，并且有效地收集使用的处理流体并将其再循环。解决方案：用于通过使其与脱脂流体33或氧化物膜去除流体3接触来激活要处理的构件25的表面的装置包括相应的供给装置17和14，其输送脱脂流体和氧化物从上述流体的各个供给源11和1向要处理的部件移除薄膜，并且其端部布置在该部件附近，以便将脱脂流体和氧化物膜去除流体喷射到构件的表面; 以及回收管31，其一端与上述构件的表面相对配置，另一端与氧化膜除去液的供给源连接，使得脱脂液或氧化物膜 - 去除流体或两者的流体可以通过上述回收管返回到氧化物膜去除流体的供应源。版权所有（C）2004，JPO

8. 发明专利

JP2003073868A Method for activating surface of base material and apparatus therefor 有权
标题翻译：用于激活基材表面的方法及其设备
公开(公告)号：JP2003073868A
公开(公告)日：2003-03-12
申请号：JP2001265032
申请日：2001-08-31
申请人： Hideo Yoshida , 英夫吉田
发明人： YOSHIDA HIDEO , SONE MASATO , ABE KENTARO
IPC分类号： B01D19/00 , C02F1/20 , C02F1/68 , C23G1/08
摘要： PROBLEM TO BE SOLVED: To provide a method for activating the surface of a base material, which is suitable for pretreatment in electrochemical treatment, for instance, electrodeposition, can remove an oxide film on the surface of the base metal while simultaneously degreasing the surface, effectively and rationally, with a safe and inexpensive solution, increases productivity, reduces cost of equipment, and rationalizes waste liquid treatment to recycle it and prevent environmental pollution, and to provide an apparatus therefor.
SOLUTION: The method for activating the surface of the base material comprises degreasing the surface of a material to be treated 3 or removing the oxide film. The method is characterized by dissolving compressed carbon dioxide into a predetermined amount of water 5, and preparing a solution for oxide film removal having a predetermined acidic concentration.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了提供一种适用于电化学处理例如电沉积中的预处理的基材表面的方法，可以同时除去表面上的贱金属表面上的氧化膜，有效合理地提供安全廉价的解决方案，提高生产率，降低设备成本，合理化废液处理循环利用，防止环境污染，并提供设备。解决方案：用于活化基材表面的方法包括对待处理材料3的表面进行脱脂或除去氧化膜。该方法的特征在于将压缩的二氧化碳溶解到预定量的水中5，并制备具有预定酸性浓度的氧化膜去除溶液。

9. 发明专利

JP2009275253A Electroless plating method 有权
标题翻译：电镀法
公开(公告)号：JP2009275253A
公开(公告)日：2009-11-26
申请号：JP2008126517
申请日：2008-05-13
申请人： Seizo Miyata , Ses Co Ltd , エス・イー・エス株式会社 , 宮田清蔵
发明人： SHIMIZU TETSUYA , TAJIMA NAGAYOSHI , MIYATA SEIZO , SONE MASATO
IPC分类号： C23C18/31 , H01L21/288 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide an electroless plating method capable of obtaining a thick plating layer on a surface of an insulating body or a semi-conductor by the electroless plating in a short time by using a supercritical fluid or a subcritical fluid and using the induction eutectoid phenomenon.
SOLUTION: The electroless plating is executed on a surface of a glass substrate sample 22 as an insulating body by using a supercritical fluid or a subcritical fluid while metal powder is dispersed in an electroless plating liquid 19. A homogeneous and thick plating layer can be obtained in a short time by using the induction eutectoid phenomenon. In the electroless plating method, the metal powder having the average particle size of ≥1 nm and ≤100 μm can be used, and this electroless plating method is applicable to a damascene process or a dual damascene process which is a method for forming a fine metal wiring within a semiconductor element.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够通过使用超临界流体或亚临界流体在短时间内通过化学镀获得绝缘体或半导体的表面上的厚镀层的化学镀方法并使用感应共析现象。解决方案：通过使用超临界流体或亚临界流体，在玻璃基板样品22的表面上进行化学镀，作为绝缘体，同时金属粉末分散在化学镀液体19中。均匀且厚的镀层可以通过使用感应共析现象在短时间内获得。在化学镀方法中，可以使用平均粒径为≥1nm且≤100μm的金属粉末，并且该化学镀方法适用于作为形成细粉的方法的镶嵌法或双镶嵌法半导体元件内的金属布线。版权所有（C）2010，JPO＆INPIT

10. 发明专利

JP2008121111A Electroless plating method 有权
标题翻译：电镀法
公开(公告)号：JP2008121111A
公开(公告)日：2008-05-29
申请号：JP2007262671
申请日：2007-10-05
申请人： Seizo Miyata , Ses Co Ltd , エス・イー・エス株式会社 , 宮田清蔵
发明人： SHIMIZU TETSUYA , TAJIMA NAGAYOSHI , MIYATA SEIZO , SONE MASATO
IPC分类号： C23C18/31 , H01L21/288
摘要： PROBLEM TO BE SOLVED: To provide an electroless plating method which can realize the formation of an even metal film on an insulated film formed on the surface of a semiconductor layer by electroless plating in a short time using a subcritical fluid or a supercritical fluid by taking advantage of an induction eutectoid phenomenon. SOLUTION: This invention provides an electroless plating method comprising electrolessly plating the surface of a metal base sample 22 using a supercritical fluid or a subcritical fluid in such a state that a metal powder is dispersed in an electroless plating liquid 19. According to this method, a homogeneous and thick plating layer is formed in a short time by taking advantage of an induction eutectoid phenomenon. In the electroless plating method, the metal powder may have an average particle diameter of not less than 1 nm and not more than 100 μm, and the electroless plating method may also be applied to a damascene process or a dual damascene process which is a method for forming a fine metal wiring within a semiconductor element. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：提供一种化学镀方法，其可以通过使用亚临界流体或超临界流体在短时间内通过无电解电镀在半导体层的表面上形成的绝缘膜上形成均匀的金属膜通过利用感应共析现象的流体。解决方案：本发明提供了一种化学镀方法，其包括以金属粉末分散在无电镀液体19中的状态，使用超临界流体或亚临界流体对金属基体样品22的表面进行无电镀处理。根据该方法通过利用感应共析现象在短时间内形成均匀且厚的镀层。在化学镀方法中，金属粉末的平均粒径可以为1nm以上且100μm以下，无电镀方法也可以应用于镶嵌法或双镶嵌法，该法是作为方法用于在半导体元件内形成精细的金属布线。版权所有（C）2008，JPO＆INPIT

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