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1. 发明授权

US07942195B2 Heat dissipation device having a bracket 有权
标题翻译：具有支架的散热装置
公开(公告)号：US07942195B2
公开(公告)日：2011-05-17
申请号：US11308250
申请日：2006-03-14
申请人： Yong-Dong Chen , Bo-Yong Yang , Guang Yu , Shih-Hsun Wung , Chun-Chi Chen
发明人： Yong-Dong Chen , Bo-Yong Yang , Guang Yu , Shih-Hsun Wung , Chun-Chi Chen
IPC分类号： F28F7/00 , F28D15/00
CPC分类号： H01L23/427 , H01L2924/0002 , Y10T29/49353 , H01L2924/00
摘要： A heat dissipation device (10) includes a first heat sink (20), a second heat sink (30) and a heat pipe (40) transferring heat from the first heat sink to the second heat sink. A bracket (50) includes a first end (51) attached to the first heat sink and a second end (52) attached to the second heat sink.
摘要翻译：散热装置（10）包括第一散热器（20），第二散热器（30）和将热量从第一散热器传递到第二散热器的热管（40）。支架（50）包括附接到第一散热器的第一端（51）和附接到第二散热器的第二端（52）。

2. 发明申请

US20080068805A1 HEAT SINK ASSEMBLY FOR MULTIPLE ELECTRONIC COMPONENTS 审中-公开
标题翻译：多个电子元件的散热器组件
公开(公告)号：US20080068805A1
公开(公告)日：2008-03-20
申请号：US11309699
申请日：2006-09-15
申请人： Xiao Xu , Yong-Dong Chen , Guang Yu , Shih-Hsun Wung , Chun-Chi Chen
发明人： Xiao Xu , Yong-Dong Chen , Guang Yu , Shih-Hsun Wung , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： H05K7/20509 , H01L23/4093 , H01L2023/4056 , H01L2924/0002 , H01L2924/00
摘要： A heat sink assembly includes a primary heat sink and a subordinate heat sink. The primary heat sink comprises a base with a main surface; the subordinate heat sink is attached to the primary heat sink and movable relative to the primary heat sink in a direction perpendicular to the main surface of the primary heat sink; the subordinate heat sink comprises a base with a main surface parallel to the main surface of the primary heat sink. The main surfaces of the primary heat sink and the subordinate heat sink face in a similar direction.
摘要翻译：散热器组件包括主散热器和从属散热器。主散热器包括具有主表面的基座; 从属散热器附接到主散热器并且可以在垂直于主散热器的主表面的方向上相对于主散热器移动; 从属散热器包括具有与主散热器的主表面平行的主表面的基座。主散热器和从属散热器的主表面处于相似的方向。

3. 发明授权

US07802616B2 Heat dissipation apparatus with heat pipes 有权
标题翻译：带热管的散热装置
公开(公告)号：US07802616B2
公开(公告)日：2010-09-28
申请号：US11757196
申请日：2007-06-01
申请人： Yong-Dong Chen , Guang Yu , Shih-Hsun Wung , Chun-Chi Chen
发明人： Yong-Dong Chen , Guang Yu , Shih-Hsun Wung , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/0275 , F28F1/12 , F28F3/02 , F28F2215/10 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation apparatus adapted for removing heat from a heat-generating electronic component, includes a conducting core, a plurality of conducting arms, a plurality of fins and a heat pipe assembly. The conducting core comprises a heat-absorbing portion contacting with the heat-generating electronic component. The conducting arms extend radially and outwardly from the conducting core. The fins extend outwardly from the respective conducting arms. Each of the heat pipes comprises an evaporating section thermally attached to the heat-absorbing portion of the conducting core and at least one condensing section thermally coupled to the respective conducting arm.
摘要翻译：一种用于从发热电子部件除去热量的散热装置，包括导电芯，多个导电臂，多个翅片和热管组件。导电芯包括与发热电子部件接触的吸热部。导电臂从导电芯径向和向外延伸。翅片从相应的导电臂向外延伸。每个热管包括热连接到导电芯的吸热部分的蒸发部分和至少一个热连接到相应导电臂的冷凝部分。

4. 发明授权

US07495920B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US07495920B2
公开(公告)日：2009-02-24
申请号：US11614766
申请日：2006-12-21
申请人： Yong-Dong Chen , Guang Yu , Shih-Hsun Wung , Chun-Chi Chen
发明人： Yong-Dong Chen , Guang Yu , Shih-Hsun Wung , Chun-Chi Chen
IPC分类号： H05K7/20 , H01L23/36
CPC分类号： H01L23/467 , F28F2215/00 , H01L23/4006 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device is used for dissipating heat from a CPU and electronic components. The heat dissipation device includes a heat absorbing portion for absorbing heat from the CPU, and a heat sink located on the heat absorbing portion. The heat sink includes a plurality of curved fins defining a plurality of curved passages therebetween. An airflow source is located adjacent to the heat sink for providing forced airflow to the heat sink. A direction of the airflow from the airflow source is changed when it passes through the passages. A direction of the airflow out of the passages is perpendicular to a direction of the airflow into the passages. The airflow out of the heat sink further flows to the electronic components located adjacent to the CPU.
摘要翻译：散热装置用于散发来自CPU和电子元件的热量。散热装置包括用于从CPU吸收热量的吸热部分和位于吸热部分上的散热器。散热器包括多个在其间限定多个弯曲通道的弯曲翅片。气流源位于散热器附近，以向散热器提供强制气流。来自气流源的气流的方向在通过通路时发生变化。从通道出来的气流的方向垂直于进入通道的气流的方向。从散热器出来的气流进一步流向位于CPU附近的电子部件。

5. 发明授权

US07487825B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US07487825B2
公开(公告)日：2009-02-10
申请号：US11309932
申请日：2006-10-31
申请人： Guang Yu , Yong-Dong Chen , Shih-Hsun Wung , Chun-Chi Chen
发明人： Guang Yu , Yong-Dong Chen , Shih-Hsun Wung , Chun-Chi Chen
IPC分类号： F28D15/00 , H05K7/20
CPC分类号： B23P15/26 , B23P2700/09 , B23P2700/10 , F28D15/0275 , H01L23/367 , H01L23/427 , H01L2924/0002 , Y10T29/49378 , H01L2924/00
摘要： A heat dissipation device includes a heat sink (10) and a first heat pipe (20) enclosing a bottom edge of the heat sink. The heat sink includes a base (12) defining a first passage (120) extending therethrough. The first heat pipe includes a first transferring section (22) extending in the first passage and totally embedded in the base and a pair of first dissipating sections (24) extending from the first transferring section. The first dissipating sections of the first heat pipe are attached on an outer periphery of the base. The first transferring section of the first heat pipe absorbs heat in the middle of the base and transfers it to the first dissipating sections to evenly distribute the heat throughout the whole base.
摘要翻译：散热装置包括散热器（10）和封装散热器底部边缘的第一热管（20）。散热器包括限定从其延伸穿过的第一通道（120）的基座（12）。第一热管包括在第一通道中延伸并完全嵌入基座的第一传递部分（22）和从第一传送部分延伸的一对第一散热部分（24）。第一热管的第一散热部分附接在基部的外周。第一热管的第一传送部分吸收基部中部的热量并将其传递到第一散热部分以在整个基部均匀分布热量。

6. 发明授权

US07478668B2 Heat dissipation device 有权
标题翻译：散热装置
公开(公告)号：US07478668B2
公开(公告)日：2009-01-20
申请号：US11564265
申请日：2006-11-28
申请人： Yong-Dong Chen , Guang Yu , Shih-Hsun Wung , Chun-Chi Chen
发明人： Yong-Dong Chen , Guang Yu , Shih-Hsun Wung , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a base and a fin set arranged on the base. The fin set includes a plurality of fins each having an undulating body and two flanges extending from the body. The body includes a plurality of peak faces, a plurality of trough faces alternating with the peak faces and a plurality of slanted faces each connecting adjacent peak face and trough face. The peak faces of each fin conform to the peak faces of an adjacent fin, while the trough faces of each fin conform to the trough faces of the adjacent fin. Pluralities of undulating passages are defined between two adjacent fins. Each heat pipe has a first section contacting the base and a second section extending through the fin set. A fan is located corresponding to the passages of the fin set for providing forced airflow to the fin set.
摘要翻译：散热装置包括底座和布置在基座上的翅片组。翅片组包括多个翅片，每个翼片具有起伏体和从主体延伸的两个凸缘。主体包括多个峰面，与峰面交替的多个槽面和各自连接相邻的峰面和槽面的多个倾斜面。每个翅片的峰面与相邻翅片的峰面匹配，而每个翅片的槽面符合相邻翅片的槽面。在两个相邻的翅片之间限定多个起伏通道。每个热管具有接触基部的第一部分和延伸穿过翅片组的第二部分。风扇对应于翅片组的通道，用于向翅片组提供强制气流。

7. 发明申请

US20080101027A1 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US20080101027A1
公开(公告)日：2008-05-01
申请号：US11309932
申请日：2006-10-31
申请人： Guang Yu , Yong-Dong Chen , Shih-Hsun Wung , Chun-Chi Chen
发明人： Guang Yu , Yong-Dong Chen , Shih-Hsun Wung , Chun-Chi Chen
IPC分类号： H05K7/20 , B23P15/26
CPC分类号： B23P15/26 , B23P2700/09 , B23P2700/10 , F28D15/0275 , H01L23/367 , H01L23/427 , H01L2924/0002 , Y10T29/49378 , H01L2924/00
摘要： A heat dissipation device includes a heat sink (10) and a first heat pipe (20) enclosing a bottom edge of the heat sink. The heat sink includes a base (12) defining a first passage (120) extending therethrough. The first heat pipe includes a first transferring section (22) extending in the first passage and totally embedded in the base and a pair of first dissipating sections (24) extending from the first transferring section. The first dissipating sections of the first heat pipe are attached on an outer periphery of the base. The first transferring section of the first heat pipe absorbs heat in the middle of the base and transfers it to the first dissipating sections to evenly distribute the heat throughout the whole base.
摘要翻译：散热装置包括散热器（10）和封装散热器底部边缘的第一热管（20）。散热器包括限定从其延伸穿过的第一通道（120）的基座（12）。第一热管包括在第一通道中延伸并完全嵌入基座的第一传递部分（22）和从第一传送部分延伸的一对第一散热部分（24）。第一热管的第一散热部分附接在基部的外周。第一热管的第一传送部分吸收基部中部的热量并将其传递到第一散热部分以在整个基部均匀分布热量。

8. 发明申请

US20070215319A1 HEAT DISSIPATION DEVICE HAVING A BRACKET 有权
标题翻译：具有支架的散热装置
公开(公告)号：US20070215319A1
公开(公告)日：2007-09-20
申请号：US11308250
申请日：2006-03-14
申请人： Yong-Dong Chen , Bo-Yong Yang , Guang Yu , Shih-Hsun Wung , Chun-Chi Chen
发明人： Yong-Dong Chen , Bo-Yong Yang , Guang Yu , Shih-Hsun Wung , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L2924/0002 , Y10T29/49353 , H01L2924/00
摘要： A heat dissipation device (10) includes a first heat sink (20), a second heat sink (30) and a heat pipe (40) transferring heat from the first heat sink to the second heat sink. A bracket (50) includes a first end (51) attached to the first heat sink and a second end (52) attached to the second heat sink, thus enhancing the strength and stability of the heat dissipation device.
摘要翻译：散热装置（10）包括第一散热器（20），第二散热器（30）和将热量从第一散热器传递到第二散热器的热管（40）。托架（50）包括附接到第一散热器的第一端（51）和附接到第二散热器的第二端（52），从而增强散热装置的强度和稳定性。

9. 发明申请

US20070195502A1 HEAT SINK FASTENER 失效
标题翻译：散热片紧固件
公开(公告)号：US20070195502A1
公开(公告)日：2007-08-23
申请号：US11309819
申请日：2006-10-03
申请人： Bo-Yong Yang , Yong-Dong Chen , Guang Yu , Shih-Hsun Wung , Chun-Chi Chen
发明人： Bo-Yong Yang , Yong-Dong Chen , Guang Yu , Shih-Hsun Wung , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , Y10T24/44026 , H01L2924/00
摘要： A heat sink fastener includes a main body, a piercing member and a wire clip. The main body includes a pressing part for holding a heat sink in contact with a heat-generating component, an engaging part and a latching leg; the engaging part and the latching leg are disposed at opposing ends of the pressing part. The piercing member includes a piercing body extending through the engaging part of the main body and a tubular part and a hook. The wire clip includes a pivot shaft pivotally connected with the tubular part of the piercing member, a locking leg for fastening to the main body and a lever interconnecting the pivot shaft and the locking leg together, wherein the lever is rotatable to change the positional relationship between the piercing member and the engaging part of the main body.
摘要翻译：散热器紧固件包括主体，穿孔构件和线夹。主体包括用于保持与发热部件，接合部和闩锁腿接触的散热器的按压部分; 接合部和锁定腿设置在按压部的相对端。穿刺构件包括延伸穿过主体的接合部分的穿孔体和管状部分和钩。电线夹包括与穿刺构件的管状部分枢转地连接的枢轴，用于紧固到主体的锁定腿和将枢转轴和锁定腿相互连接在一起的杠杆，其中杠杆可旋转以改变位置关系在穿刺构件和主体的接合部之间。

10. 发明授权

US07495915B2 Heat dissipation system 失效
标题翻译：散热系统
公开(公告)号：US07495915B2
公开(公告)日：2009-02-24
申请号：US11626049
申请日：2007-01-23
申请人： Yong-Dong Chen , Guang Yu , Chun-Chi Chen , Shih-Hsun Wung
发明人： Yong-Dong Chen , Guang Yu , Chun-Chi Chen , Shih-Hsun Wung
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation system is used for dissipating heat generated by an electronic device mounted on a printed circuit board. The heat dissipation system includes an enclosure adapted to receive the electronic device therein, the enclosure having a base plate on which the printed circuit board is mounted. A spreader adapted for contacting the electronic device in the enclosure. A plurality of fins disposed between the printed circuit board and the base plate, the fins thermally engaging with the base plate. A heat pipe is used to thermally connect the spreader and the fins together, which are positioned at opposite sides of the printed circuit board, respectively. Accordingly, the enclosure can help to dissipate the heat generated by the electronic device.
摘要翻译：散热系统用于散发由安装在印刷电路板上的电子装置产生的热量。散热系统包括适于在其中接收电子设备的外壳，外壳具有安装有印刷电路板的基板。适于接触外壳中的电子设备的吊具。设置在印刷电路板和基板之间的多个翅片，散热片与基板热接合。热管用于将扩散器和翅片热连接在一起，这些分别位于印刷电路板的相对侧。因此，外壳可以帮助消散电子设备产生的热量。

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