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    • 5. 发明授权
    • Optical module package unit
    • 光模块封装单元
    • US08362496B1
    • 2013-01-29
    • US13288648
    • 2011-11-03
    • Ming-Te TuChao-Wei Yu
    • Ming-Te TuChao-Wei Yu
    • H01L21/00
    • H01L23/3107H01L25/167H01L2224/32225H01L2224/48091H01L2224/48227H01L2224/73265H01L2924/00014H01L2924/00
    • An optical module package unit includes a light-emitting chip and a light sensor chip respectively installed in a light-emitting zone and a light-sensing zone on a substrate, a lid of plastic shell integrally formed on the substrate and defining therein a first cavity and a second cavity around the light-emitting chip and the light sensor chip respectively, and two packaging adhesive structures respectively molded in the first cavity and the second cavity to encapsulate the light-emitting chip and the light sensor chip respectively. As the light-emitting chip and the light sensor chip are integrally packaged on the substrate, the packaging cost of the optical module is significantly lowered.
    • 光学模块封装单元包括分别安装在基板上的发光区域和感光区域中的发光芯片和光传感器芯片,塑料壳体的盖子,其一体地形成在基板上并在其中限定第一腔体 以及分别围绕发光芯片和光传感器芯片的第二腔,以及分别模制在第一腔和第二腔中的两个包装粘合剂结构,以分别封装发光芯片和光传感器芯片。 由于发光芯片和光传感器芯片整体地封装在基板上,所以光模块的封装成本显着降低。