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    • 1. 发明授权
    • Method and structure for manufacturing bonded substrates using multiple photolithography tools
    • 使用多个光刻工具制造粘结衬底的方法和结构
    • US07678288B2
    • 2010-03-16
    • US11004588
    • 2004-12-03
    • Xiao YangKegang HuangYuxiang WangHoward Woo
    • Xiao YangKegang HuangYuxiang WangHoward Woo
    • H01L21/302
    • G03F7/70525G03F9/7046H01L21/2007
    • A method of manufacturing bonded substrate structures. The method includes providing a first substrate comprising a first surface region and processing the first surface region to form a first pattern region using a first photolithographic stepper characterized by a first tolerance criteria for alignment. The method also includes providing a second substrate comprising a second surface region and processing the second surface region through at least one masking process to form a second pattern region using a second photolithographic stepper characterized by a second tolerance criteria for alignment. Further, the method includes determining a masking process having a third tolerance criteria for alignment, the third tolerance criteria allowing for a change from the second to the first photographic stepper, processing the second substrate for at least the determined masking process using the first photolithographic stepper, and joining the first substrate to the second substrate to form a composite substrate structure.
    • 制造键合衬底结构的方法。 该方法包括提供包括第一表面区域的第一基底和使用第一光刻步进器处理第一表面区域以形成第一图案区域,其特征在于用于对准的第一公差标准。 该方法还包括提供包括第二表面区域的第二基底并通过至少一个掩模过程处理第二表面区域,以使用第二光刻步进器形成第二图案区域,其特征在于用于对准的第二容限标准。 此外,该方法包括确定具有用于对准的第三公差准则的掩蔽处理,第三公差准则允许从第二照相步骤器改变到第一照相步进器,使用第一光刻步进器处理至少所确定的掩蔽处理的第二衬底 并且将第一基板接合到第二基板以形成复合基板结构。
    • 2. 发明申请
    • Method and structure for manufacturing bonded substrates using multiple photolithography tools
    • 使用多个光刻工具制造粘结衬底的方法和结构
    • US20060121373A1
    • 2006-06-08
    • US11004588
    • 2004-12-03
    • Xiao YangKegang HuangYuxiang WangHoward Woo
    • Xiao YangKegang HuangYuxiang WangHoward Woo
    • G03F9/00G03B27/00G03C5/00G03B27/42
    • G03F7/70525G03F9/7046H01L21/2007
    • A method of manufacturing bonded substrate structures. The method includes providing a first substrate comprising a first surface region and processing the first surface region to form a first pattern region using a first photolithographic stepper characterized by a first tolerance criteria for alignment. The method also includes providing a second substrate comprising a second surface region and processing the second surface region through at least one masking process to form a second pattern region using a second photolithographic stepper characterized by a second tolerance criteria for alignment. Further, the method includes determining a masking process having a third tolerance criteria for alignment, the third tolerance criteria allowing for a change from the second to the first photographic stepper, processing the second substrate for at least the determined masking process using the first photolithographic stepper, and joining the first substrate to the second substrate to form a composite substrate structure.
    • 制造键合衬底结构的方法。 该方法包括提供包括第一表面区域的第一基底和使用第一光刻步进器处理第一表面区域以形成第一图案区域,其特征在于用于对准的第一公差标准。 该方法还包括提供包括第二表面区域的第二基底并通过至少一个掩模过程处理第二表面区域,以使用第二光刻步进器形成第二图案区域,其特征在于用于对准的第二容限标准。 此外,该方法包括确定具有用于对准的第三公差准则的掩蔽处理,第三公差准则允许从第二照相步骤器改变到第一照相步进器,使用第一光刻步进器处理至少所确定的掩蔽处理的第二衬底 并且将第一基板接合到第二基板以形成复合基板结构。