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1. 发明申请

US20060191127A1 Method to detect magnetic pole defects in perpendicular recording heads at wafer level 失效
标题翻译：检测晶圆级垂直记录头磁极缺陷的方法
公开(公告)号：US20060191127A1
公开(公告)日：2006-08-31
申请号：US11068334
申请日：2005-02-28
申请人： Wolfgang Goubau , Edward Lee
发明人： Wolfgang Goubau , Edward Lee
IPC分类号： G11B5/127
CPC分类号： G11B5/1278 , Y10T29/49004 , Y10T29/49021 , Y10T29/49036 , Y10T29/49037 , Y10T29/49043 , Y10T29/49044 , Y10T29/49073
摘要： The perpendicular magnetic head fabrication and testing method includes the additional fabrication of magnetic pole testing structures in the kerf area of the wafer substrate. Particularly, magnetic interconnect pieces are fabricated in the kerf area to magnetically connect an extending portion of the first magnetic pole with an extending portion of the second magnetic pole. As a result, when the perpendicular magnetic heads are fabricated at the wafer level, the first and second magnetic poles are interconnected through structures located in the kerf area. Thereafter, an ISAT magnetic pole test can be conducted by passing electrical current through the induction coil of the magnetic head, and magnetic flux will flow through the interconnected magnetic pole structure, thereby enabling the testing of the magnetic poles of the perpendicular magnetic head at the wafer level.
摘要翻译：垂直磁头制造和测试方法包括在晶片衬底的切口区域中额外制造磁极测试结构。特别地，磁性互连件制造在切口区域中，以将第一磁极的延伸部分与第二磁极的延伸部分磁性连接。结果，当在晶片级制造垂直磁头时，第一和第二磁极通过位于切口区域中的结构相互连接。此后，可以通过使电流通过磁头的感应线圈进行ISAT磁极测试，并且磁通将流过互连的磁极结构，从而能够在垂直磁头的磁极的测试晶圆级。

2. 发明授权

US07538035B2 Lapping of gold pads in a liquid medium for work hardening the surface of the pads 有权
标题翻译：在液体介质中研磨金垫，以便对表面进行加工硬化
公开(公告)号：US07538035B2
公开(公告)日：2009-05-26
申请号：US11083808
申请日：2005-03-18
申请人： Ronald Dunham , Wolfgang Goubau , Bhargav Patel , Marvin Wong , John Jaekoyun Yang
发明人： Ronald Dunham , Wolfgang Goubau , Bhargav Patel , Marvin Wong , John Jaekoyun Yang
IPC分类号： H01L21/44
CPC分类号： H01L24/11 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14
摘要： A method for work hardening gold contact pads is disclosed. The method includes providing gold contact pads, providing lapping pads, and placing the lapping pads in contact with the gold contact pads to create a contact interface. A liquid medium is then applied to the contact interface while moving the lapping pads relative to the gold contact pads. The liquid medium is preferably a particulate-free pH neutral liquid, which makes water a good choice. Also disclosed is a gold pad having a work hardened surface.
摘要翻译：公开了一种用于加工硬化接触垫的方法。该方法包括提供金接触垫，提供研磨垫，以及将研磨垫与金接触垫接触以形成接触界面。然后将液体介质施加到接触界面，同时相对于金接触垫移动研磨垫。液体介质优选是无颗粒的pH中性液体，这使得水是不错的选择。还公开了具有加工硬化表面的金垫。

3. 发明申请

US20060097729A1 METHOD FOR DETECTING DEFECTS THAT EXHIBIT REPETITIVE PATTERNS 失效
标题翻译：用于检测展示重复图案的缺陷的方法
公开(公告)号：US20060097729A1
公开(公告)日：2006-05-11
申请号：US10985313
申请日：2004-11-09
申请人： Diane Brown , Wolfgang Goubau
发明人： Diane Brown , Wolfgang Goubau
IPC分类号： G01R31/08
CPC分类号： G01R31/2831
摘要： A method for detecting defects in devices that are fabricated in repetitive patterns upon the surface of a substrate by the, repetitive utilization of masks and similar devices. A mask flaw will become manifest in a series of defective devices as the mask is successively utilized. The detection of repetitive defects is undertaken by determining the electrical resistance of devices in a group, such as a column, fabricated upon the wafer surface, where the repetitive defect will occur multiple times. The mean electrical resistance of the group is determined and a percent deviation of each device from the mean is then determined. The percent deviation of all of the devices in the group are multiplied together to create a multiplied percent deviation number and the multiplied percent deviation number is then compared with a figure of merit value to make a determination of whether defective devices exist within the group.
摘要翻译：一种用于通过重复使用掩模和类似装置来检测在衬底表面上以重复图案制造的器件中的缺陷的方法。当连续使用掩模时，掩模缺陷将在一系列有缺陷的装置中变得显现。通过确定在晶片表面上制造的诸如柱的组中的器件的电阻，其中重复缺陷将发生多次，来进行重复缺陷的检测。确定组的平均电阻，然后确定每个装置与平均值的百分比偏差。将组中所有设备的百分比偏差相乘以产生相乘百分比偏差数，然后将乘法百分比偏差数与品质因数值进行比较，以确定组内是否存在缺陷设备。

4. 发明授权

US07249406B2 Method to detect magnetic pole defects in perpendicular recording heads at wafer level 失效
标题翻译：检测晶圆级垂直记录头磁极缺陷的方法
公开(公告)号：US07249406B2
公开(公告)日：2007-07-31
申请号：US11068334
申请日：2005-02-28
申请人： Wolfgang Goubau , Edward Hin Pong Lee
发明人： Wolfgang Goubau , Edward Hin Pong Lee
IPC分类号： G11B5/127 , H04R31/00
CPC分类号： G11B5/1278 , Y10T29/49004 , Y10T29/49021 , Y10T29/49036 , Y10T29/49037 , Y10T29/49043 , Y10T29/49044 , Y10T29/49073
摘要： The perpendicular magnetic head fabrication and testing method includes the additional fabrication of magnetic pole testing structures in the kerf area of the wafer substrate. Particularly, magnetic interconnect pieces are fabricated in the kerf area to magnetically connect an extending portion of the first magnetic pole with an extending portion of the second magnetic pole. As a result, when the perpendicular magnetic heads are fabricated at the wafer level, the first and second magnetic poles are interconnected through structures located in the kerf area. Thereafter, an ISAT magnetic pole test can be conducted by passing electrical current through the induction coil of the magnetic head, and magnetic flux will flow through the interconnected magnetic pole structure, thereby enabling the testing of the magnetic poles of the perpendicular magnetic head at the wafer level.
摘要翻译：垂直磁头制造和测试方法包括在晶片衬底的切口区域中额外制造磁极测试结构。特别地，磁性互连件制造在切口区域中，以将第一磁极的延伸部分与第二磁极的延伸部分磁性连接。结果，当在晶片级制造垂直磁头时，第一和第二磁极通过位于切口区域中的结构相互连接。此后，可以通过使电流通过磁头的感应线圈进行ISAT磁极测试，并且磁通将流过互连的磁极结构，从而能够在垂直磁头的磁极的测试晶圆级。

5. 发明申请

US20060211247A1 Lapping of gold pads in a liquid medium for work hardening the surface of the pads 有权
公开(公告)号：US20060211247A1
公开(公告)日：2006-09-21
申请号：US11083808
申请日：2005-03-18
申请人： Ronald Dunham , Wolfgang Goubau , Bhargav Patel , Marvin Wong , John Yang
发明人： Ronald Dunham , Wolfgang Goubau , Bhargav Patel , Marvin Wong , John Yang
IPC分类号： H01L23/02
CPC分类号： H01L24/11 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14
摘要： A method for work hardening gold contact pads is disclosed. The method includes providing gold contact pads, providing lapping pads, and placing the lapping pads in contact with the gold contact pads to create a contact interface. A liquid medium is then applied to the contact interface while moving the lapping pads relative to the gold contact pads. The liquid medium is preferably a particulate-free pH neutral liquid, which makes water a good choice. Also disclosed is a gold pad having a work hardened surface.

6. 发明授权

US07095239B2 Method for detecting defects that exhibit repetitive patterns 失效
标题翻译：检测显示重复图案的缺陷的方法
公开(公告)号：US07095239B2
公开(公告)日：2006-08-22
申请号：US10985313
申请日：2004-11-09
申请人： Diane L. Brown , Wolfgang Goubau
发明人： Diane L. Brown , Wolfgang Goubau
IPC分类号： G01R31/08 , G01R31/26
CPC分类号： G01R31/2831
摘要： A method for detecting defects in devices that are fabricated in repetitive patterns upon the surface of a substrate by the, repetitive utilization of masks and similar devices. A mask flaw will become manifest in a series of defective devices as the mask is successively utilized. The detection of repetitive defects is undertaken by determining the electrical resistance of devices in a group, such as a column, fabricated upon the wafer surface, where the repetitive defect will occur multiple times. The mean electrical resistance of the group is determined and a percent deviation of each device from the mean is then determined. The percent deviation of all of the devices in the group are multiplied together to create a multiplied percent deviation number and the multiplied percent deviation number is then compared with a figure of merit value to make a determination of whether defective devices exist within the group.
摘要翻译：一种用于通过重复使用掩模和类似装置来检测在衬底表面上以重复图案制造的器件中的缺陷的方法。当连续使用掩模时，掩模缺陷将在一系列有缺陷的装置中变得显现。通过确定在晶片表面上制造的诸如柱的组中的器件的电阻，其中重复缺陷将发生多次，来进行重复缺陷的检测。确定组的平均电阻，然后确定每个装置与平均值的百分比偏差。将组中所有设备的百分比偏差相乘以产生相乘百分比偏差数，然后将乘法百分比偏差数与品质因数值进行比较，以确定组内是否存在缺陷设备。

7. 发明授权

US06515475B2 Determination of track width of magnetoresistive sensors during magnetic head fabrication using magnetic fields 失效
公开(公告)号：US06515475B2
公开(公告)日：2003-02-04
申请号：US09785839
申请日：2001-02-16
申请人： Wolfgang Goubau , Arley Cleveland Marley
发明人： Wolfgang Goubau , Arley Cleveland Marley
IPC分类号： G01R3312
CPC分类号： B24B37/048 , B24B49/04 , B24B49/10 , G11B5/3116 , G11B5/3163 , G11B5/3166 , G11B5/3903 , G11B5/455 , Y10T29/49036
摘要： In fabricating magnetic heads on a wafer surface, magnetoresistive sensors having two different stripe heights and the same stripe width are formed. Additionally, two different electronic lapping guides (ELGs) having different stripe heights and the same stripe width are also formed. While the design widths and heights of the sensors and ELGs are known, the actually fabricated widths and heights of the sensors and ELGs is unknown, due to the windage in the fabrication process. In the present invention, to determine the actual track width of the sensors, the change in electrical resistance of the sensors and ELGs is experimentally determined during the application of a magnetic field to the sensors and ELGs. Through a mathematical analysis, the actual track width of the fabricated sensors is determined utilizing the design widths and heights of the sensors and ELGs, together with the experimentally determined changes in electrical resistance of the sensors and ELGs.

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