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1. 发明申请

US20080220634A1 APPARATUS FOR RESTRICTING ROTATIONAL MOMENT ABOUT A LONGITUDINAL AXIS OF SMT CONNECTORS 有权
标题翻译：关于SMT连接器长轴的旋转动作的设备
公开(公告)号：US20080220634A1
公开(公告)日：2008-09-11
申请号：US12031156
申请日：2008-02-14
申请人： William L. Brodsky , Mark G. Clark , Amanda E.E. Mikhail , Arvind K. Sinha , Scott A. Shurson , Jason T. Stoll
发明人： William L. Brodsky , Mark G. Clark , Amanda E.E. Mikhail , Arvind K. Sinha , Scott A. Shurson , Jason T. Stoll
IPC分类号： H01R12/00
CPC分类号： H01R12/7011 , H01R12/716 , H01R12/721 , H01R13/514 , H05K1/181 , H05K2201/10189 , H05K2201/10537 , H05K2201/209 , Y02P70/611
摘要： An electrical connector includes a first connector body having an interlocking feature extending therefrom. The interlocking feature interlocks the first connector body with a complimentary interlocking feature extending from an adjacent second connector body to distribute a lateral force on either the first or second connector bodies across the adjacent connector body thereby reducing a rotational moment at a base of each electrical connector connected to a printed circuit board (PCB).
摘要翻译：电连接器包括具有从其延伸的互锁特征的第一连接器主体。互锁特征将第一连接器主体与相邻的第二连接器主体相互延伸的互补互锁特征互锁，以将第二或第二连接器主体上的横向力分布在相邻的连接器本体上，从而减小每个电连接器的基座处的旋转力矩连接到印刷电路板（PCB）。

2. 发明申请

US20080220624A1 METHOD AND APPARATUS FOR RESTRICTING ROTATIONAL MOMENT ABOUT A LONGITUDINAL AXIS OF SMT CONNECTORS 审中-公开
标题翻译：限制SMT连接器纵向轴旋转运动的方法和装置
公开(公告)号：US20080220624A1
公开(公告)日：2008-09-11
申请号：US11683501
申请日：2007-03-08
申请人： William L. Brodsky , Mark G. Clark , Amanda E.E. Mikhail , Arvind K. Sinha , Scott A. Shurson , Jason T. Stoll
发明人： William L. Brodsky , Mark G. Clark , Amanda E.E. Mikhail , Arvind K. Sinha , Scott A. Shurson , Jason T. Stoll
IPC分类号： H01R12/00
CPC分类号： H01R12/7047 , H01R12/716 , H01R13/518
摘要： Ali apparatus for supporting at least one electrical connector body, the apparatus includes a mechanical frame assembly mountable to a printed circuit board (PCB) and separable from the at least one connector body and the PCB. The frame assembly includes at least one base member for attachment to the PCB; and a plurality of rigid body members each spaced apart from one another and extending from the at least one base member or an adjacent rigid body member. The plurality of rigid body members receive a grouping of one or more connector bodies and a pair of adjacent rigid body members are configured to receive and support at least a portion of an entire length of respective opposing side surfaces defining each connector body. When a lateral force is applied to the connector body, the frame assembly acts as a support and transfers the lateral force to the PCB, thereby reducing a rotational moment at a base of each connector body connected to the PCB.
摘要翻译：用于支撑至少一个电连接器主体的阿里装置，该装置包括可安装到印刷电路板（PCB）并可与至少一个连接器主体和PCB分离的机械框架组件。框架组件包括用于附接到PCB的至少一个基座构件; 以及多个刚体部件，每个彼此间隔开并且从所述至少一个基部部件或相邻的刚体部件延伸。多个刚体部件容纳一个或多个连接器主体的组合，并且一对相邻的刚体部件被配置为容纳和支撑限定每个连接器本体的各个相对侧表面的整个长度的至少一部分。当侧向力施加到连接器主体时，框架组件用作支撑件并将横向力传递到PCB，从而减少连接到PCB的每个连接器本体的基部处的旋转力矩。

3. 发明授权

US07354281B1 Method and apparatus for restricting rotational moment about a longitudinal axis of SMT connectors 有权
标题翻译：用于限制围绕SMT连接器的纵向轴线的旋转力矩的方法和装置
公开(公告)号：US07354281B1
公开(公告)日：2008-04-08
申请号：US11683512
申请日：2007-03-08
申请人： William L. Brodsky , Mark G. Clark , Amanda E. E. Mikhail , Arvind K. Sinha , Scott A. Shurson , Jason T. Stoll
发明人： William L. Brodsky , Mark G. Clark , Amanda E. E. Mikhail , Arvind K. Sinha , Scott A. Shurson , Jason T. Stoll
IPC分类号： H01R9/22
CPC分类号： H01R12/7011 , H01R12/716 , H01R12/721 , H01R13/514 , H05K1/181 , H05K2201/10189 , H05K2201/10537 , H05K2201/209 , Y02P70/611
摘要： An electrical connector includes a first connector body having an interlocking feature extending therefrom. The interlocking feature interlocks the first connector body with a complimentary interlocking feature extending from an adjacent second connector body to distribute a lateral force on either the first or second connector bodies across the adjacent connector body thereby reducing a rotational moment at a base of each electrical connector connected to a printed circuit board (PCB).
摘要翻译：电连接器包括具有从其延伸的互锁特征的第一连接器主体。互锁特征将第一连接器主体与相邻的第二连接器主体相互延伸的互补互锁特征互锁，以将第二或第二连接器主体上的横向力分布在相邻的连接器本体上，从而减小每个电连接器的基座处的旋转力矩连接到印刷电路板（PCB）。

4. 发明授权

US07442053B2 Apparatus for restricting rotational moment about a longitudinal axis of SMT connectors 有权
标题翻译：用于围绕SMT连接器的纵向轴限制旋转力矩的装置
公开(公告)号：US07442053B2
公开(公告)日：2008-10-28
申请号：US12031156
申请日：2008-02-14
申请人： William L. Brodsky , Mark G. Clark , Amanda E. E. Mikhail , Arvind K. Sinha , Scott A. Shurson , Jason T. Stoll
发明人： William L. Brodsky , Mark G. Clark , Amanda E. E. Mikhail , Arvind K. Sinha , Scott A. Shurson , Jason T. Stoll
IPC分类号： H01R9/22
CPC分类号： H01R12/7011 , H01R12/716 , H01R12/721 , H01R13/514 , H05K1/181 , H05K2201/10189 , H05K2201/10537 , H05K2201/209 , Y02P70/611
摘要： An electrical connector includes a first connector body having an interlocking feature extending therefrom. The interlocking feature interlocks the first connector body with a complimentary interlocking feature extending from an adjacent second connector body to distribute a lateral force on either the first or second connector bodies across the adjacent connector body thereby reducing a rotational moment at a base of each electrical connector connected to a printed circuit board (PCB).
摘要翻译：电连接器包括具有从其延伸的互锁特征的第一连接器主体。互锁特征将第一连接器主体与相邻的第二连接器主体相互延伸的互补互锁特征互锁，以将第二或第二连接器主体上的横向力分布在相邻的连接器本体上，从而减小每个电连接器的基座处的旋转力矩连接到印刷电路板（PCB）。

5. 发明授权

US08705050B2 Providing thermal compensation for topographic measurement at an elevated temperature using a non-contact vibration transducer 失效
标题翻译：使用非接触式振动传感器，在高温下提供对地形测量的热补偿
公开(公告)号：US08705050B2
公开(公告)日：2014-04-22
申请号：US12898783
申请日：2010-10-06
申请人： Arvind K. Sinha
发明人： Arvind K. Sinha
IPC分类号： G01B11/30
CPC分类号： G01B11/24
摘要： A mechanism for providing thermal compensation when measuring surface topography at an elevated temperature using a non-contact vibration transducer, such as a laser Doppler vibrometer (LDV). Thermal compensation is provided to a detector output signal to correct for thermal diffraction of a reflected portion of a beam of radiant energy directed at a surface of a test object. The thermal compensation is based on a calculated deviation between the detector output signal r2 at an elevated temperature and the detector output signal r1 at approximately room temperature. In one embodiment, the thermal compensation mechanism calculates a stationary signal r3(t) which represents the detector output signal without noise and corrected for thermal diffraction at the elevated temperature according to the following equation: r 3 ⁡ ( t ) = lim T → ∞ ⁢ 1 / T ⁢ ∫ - t / 2 + t / 2 ⁢ r 2 * ⁡ ( t ) * r 2 * ⁡ ( t + Δ ⁢ ⁢ t ) ⁢ ⁢ ⅆ t , wherein T represents the total number of spectrums measured at the elevated temperature at multiple times upon which the compensation is based, and wherein r2*=r2−r2(baseline).
摘要翻译：使用诸如激光多普勒振动计（LDV）的非接触式振动传感器在高温测量表面形貌时提供热补偿的机构。将热补偿提供给检测器输出信号，以校正指向测试对象表面的辐射能束的反射部分的热衍射。热补偿基于在升高的温度下的检测器输出信号r2与大约室温下的检测器输出信号r1之间的计算偏差。在一个实施例中，热补偿机构根据以下等式计算表示无噪声的检测器输出信号的稳定信号r3（t），并根据以下等式对升高的温度下的热衍射进行校正：r 3⁡（t）= lim T→∞ 1 /T∫-t / 2 + t / 2r 2 *⁡（t）* r 2 *⁡（t +＆Dgr;⁢t）⁢ⅆt，其中T表示测量的光谱总数在补偿所基于的多次的高温下，其中r2 * = r2-r2（基线）。

6. 发明授权

US08611090B2 Electronic module with laterally-conducting heat distributor layer 有权
标题翻译：具有横向导热分布层的电子模块
公开(公告)号：US08611090B2
公开(公告)日：2013-12-17
申请号：US12878710
申请日：2010-09-09
申请人： Arvind K. Sinha , Kory W. Weckman
发明人： Arvind K. Sinha , Kory W. Weckman
IPC分类号： H05K7/20
CPC分类号： H05K7/20509 , H01L21/563 , H01L23/36 , H01L23/433 , H01L24/32 , H01L25/0657 , H01L2224/16225 , H01L2224/16245 , H01L2224/32225 , H01L2224/73204 , H01L2225/06513 , H01L2225/06517 , H01L2225/06589 , H01L2924/01029 , H01L2924/14 , H05K3/32 , H05K7/205 , H05K13/00 , Y10T29/49117 , H01L2924/00
摘要： An electronic module is provided in which a chip is disposed over a substrate and electrically connected to the substrate by a plurality of electrical connect structures disposed between the chip and the substrate. A heat distributor, fabricated of a thermally conductive material, is disposed between the chip and the substrate and sized to extend beyond an edge of the chip to facilitate conduction of heat laterally out from between the chip and substrate. The heat distributor includes openings sized and positioned to allow the electrical connect structures to pass through the heat distributor without electrically contacting the heat distributor. The heat distributor is electrically isolated from the electrical connect structures, the chip and the substrate. In one implementation, the heat distributor physically contacts a thermally conductive enclosure of the electronic module to facilitate conduction of heat from between the chip and substrate to the enclosure.
摘要翻译：提供了一种电子模块，其中芯片设置在衬底上并且通过设置在芯片和衬底之间的多个电连接结构电连接到衬底。由导热材料制成的热分布器设置在芯片和基板之间，其尺寸设计成延伸超过芯片的边缘，以便于从芯片和基板之间横向导出热量。热分配器包括尺寸和定位的开口，以允许电连接结构通过热分布器而不与热分布器电接触。热分配器与电连接结构，芯片和基板电隔离。在一个实施方式中，热分配器物理地接触电子模块的导热外壳，以便将热量从芯片和衬底之间传导到外壳。

7. 发明申请

US20130178092A1 IMPLEMENTING ENHANCED DIMENSIONAL STABILITY WITH GRAPHITE NANOTUBE HYBRID SOCKET 有权
标题翻译：用石墨纳米管混合插座实现增强的尺寸稳定性
公开(公告)号：US20130178092A1
公开(公告)日：2013-07-11
申请号：US13346986
申请日：2012-01-10
申请人： Phillip V. Mann , Kevin M. O'Connell , Mark D. Plucinski , Sandra J. Shirk/Heath , Arvind K. Sinha
发明人： Phillip V. Mann , Kevin M. O'Connell , Mark D. Plucinski , Sandra J. Shirk/Heath , Arvind K. Sinha
IPC分类号： H01R13/40 , B82Y99/00 , B82Y30/00
CPC分类号： H05K7/1069 , B82Y30/00
摘要： A method and structure for implementing enhanced dimensional stability with a graphite nanotube hybrid socket. A socket housing wall includes a plurality of aligned graphite nanofibers. The plurality of aligned graphite nanofibers distributing heat and providing enhanced dimensional stability. For example, the plurality of aligned graphite nanofibers more evenly distributes heat when the socket is undergoing solder reflow processes, thereby reducing strain.
摘要翻译：用石墨纳米管混合插座实现增强的尺寸稳定性的方法和结构。插座壳体壁包括多个对准的石墨纳米纤维。多个对准的石墨纳米纤维分布热量并提供增强的尺寸稳定性。例如，当插座经历焊料回流工艺时，多个对准的石墨纳米纤维更均匀地分布热量，从而减少应变。

8. 发明申请

US20120138269A1 DUPLEX FLEXIBLE HEAT EXCHANGER 有权
标题翻译：双重灵活热交换器
公开(公告)号：US20120138269A1
公开(公告)日：2012-06-07
申请号：US12959477
申请日：2010-12-03
申请人： Maurice F. Holahan , Eric V. Kline , Paul N. Krystek , Michael R. Rasmussen , Arvind K. Sinha , Stephen M. Zins
发明人： Maurice F. Holahan , Eric V. Kline , Paul N. Krystek , Michael R. Rasmussen , Arvind K. Sinha , Stephen M. Zins
IPC分类号： F28D15/00
CPC分类号： F28D15/00 , F04D13/024 , F04D29/586 , F28F2250/08 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A method and system for cooling an electrical heat source is disclosed. A heat exchanger has two principal sub-assemblies. A closed-loop fluid flow is provided through a second sub-assembly, disposed next to a heat source. An open-loop fluid flow is provided though a first sub-assembly in communication with a second sub-assembly. Each of the first and second sub-assemblies has a rotational element. The fluid flow entering the first sub-assembly rotates the first rotational element, and magnetic communication between the rotational elements causes movement of the second rotational element, thereby achieving fluid movement within the second sub-assembly. Operationally, the closed-loop sub-assembly removes heat from the heat source and transfers it to the open-loop sub-assembly for subsequent heat transfer in a downstream fluid flow.
摘要翻译：公开了一种用于冷却电热源的方法和系统。热交换器具有两个主要子组件。通过设置在热源旁边的第二子组件提供闭环流体流。通过与第二子组件连通的第一子组件提供开环流体流。第一和第二子组件中的每一个具有旋转元件。进入第一子组件的流体流使第一旋转元件旋转，并且旋转元件之间的磁连通引起第二旋转元件的移动，从而实现第二子组件内的流体运动。操作上，闭环子组件从热源移除热量并将其传送到开环子组件，以便在下游流体流中进行随后的热传递。

9. 发明申请

US20120086952A1 Providing Thermal Compensation for Topographic Measurement at an Elevated Temperature Using a Non-Contact Vibration Transducer 失效
标题翻译：使用非接触式振动传感器在高温下提供用于地形测量的热补偿
公开(公告)号：US20120086952A1
公开(公告)日：2012-04-12
申请号：US12898783
申请日：2010-10-06
申请人： Arvind K. Sinha
发明人： Arvind K. Sinha
IPC分类号： G01B11/24
CPC分类号： G01B11/24
摘要： A mechanism for providing thermal compensation when measuring surface topography at an elevated temperature using a non-contact vibration transducer, such as a laser Doppler vibrometer (LDV). Thermal compensation is provided to a detector output signal to correct for thermal diffraction of a reflected portion of a beam of radiant energy directed at a surface of a test object. The thermal compensation is based on a calculated deviation between the detector output signal r2 at an elevated temperature and the detector output signal r1 at approximately room temperature. In one embodiment, the thermal compensation mechanism calculates a stationary signal r3 (t) which represents the detector output signal without noise and corrected for thermal diffraction at the elevated temperature according to the following equation: r 3  ( t ) = lim T → ∞  1 / T  ∫ - t / 2 + t / 2  r 2 *  ( t ) * r 2 *  ( t + Δ   t )    t , wherein T represents the total number of spectrums measured at the elevated temperature at multiple times upon which the compensation is based, and wherein r2*=r2−r2 (baseline).
摘要翻译：使用诸如激光多普勒振动计（LDV）的非接触式振动传感器在高温测量表面形貌时提供热补偿的机构。将热补偿提供给检测器输出信号，以校正指向测试对象表面的辐射能束的反射部分的热衍射。热补偿基于在升高的温度下的检测器输出信号r2与大约室温下的检测器输出信号r1之间的计算偏差。在一个实施例中，热补偿机构根据以下等式计算表示无噪声的检测器输出信号的稳定信号r3（t），并根据以下等式对高温下的热衍射进行校正：r 3（t）= lim T→∞ 其中T表示测量的光谱总数，其中T表示测量的光谱总数，其中T表示测量的光谱总数在补偿所基于的多次的高温下，其中r2 * = r2-r2（基线）。

10. 发明申请

US20110085313A1 Motherboard Assembly for Interconnecting and Distributing Signals and Power 失效
标题翻译：用于互连和分配信号和电源的主板组件
公开(公告)号：US20110085313A1
公开(公告)日：2011-04-14
申请号：US12579051
申请日：2009-10-14
申请人： John L. Colbert , Arvind K. Sinha , Roger D. Weekly
发明人： John L. Colbert , Arvind K. Sinha , Roger D. Weekly
IPC分类号： H05K1/11 , G06F17/50
CPC分类号： H05K1/144 , G11C5/025 , H05K1/113 , H05K1/114 , H05K1/141 , H05K3/0058 , H05K3/325 , H05K2201/044 , H05K2201/10378 , H05K2201/10545 , H05K2201/10719 , H05K2201/2009
摘要： A system, method, and motherboard assembly are described for interconnecting and distributing signals and power between co-planar boards that function as a single motherboard. The motherboard assembly includes a multilayered first printed circuit board having opposed parallel first and second surfaces, each having at least one land grid array (LGA) disposed thereon. The assembly further includes at least one wiring layer (Y) designed to only electrically interconnect components on or within the first PCB, and at least one wiring layer (X) designed to only electrically connect the components on the first PCB to a multilayered second PCB. The multilayered second PCB has opposed parallel first and second surfaces, the first surface having at least one LGA disposed thereon. It further includes at least one wiring layer (V) designed to only electrically interconnect components on or within the second PCB, and at least one layer (X) designed to only electrically interconnect the components on the second PCB with the components on the first PCB. A first LGA interposer couples to the LGA disposed on the first surface of the first PCB, and electrically connects at least one component to the first PCB. A second LGA interposer is sandwiched between and couples to the LGA disposed on the second surface of the first PCB and to the LGA disposed on the first surface of the second PCB. It electrically connects the first PCB to components on the second PCB.
摘要翻译：描述了用于在用作单个主板的共面板之间互连和分配信号和功率的系统，方法和主板组件。主板组件包括具有相对的平行的第一和第二表面的多层第一印刷电路板，每个具有设置在其上的至少一个焊盘格栅阵列（LGA）。组件还包括至少一个布线层（Y），其被设计成仅电连接第一PCB上或其内部的部件，以及至少一个布线层（X），其设计成仅将第一PCB上的部件电连接到多层第二PCB 。所述多层第二PCB具有相对的平行的第一和第二表面，所述第一表面具有设置在其上的至少一个LGA。它还包括至少一个被设计成仅电连接第二PCB上或第二PCB内的组件的布线层（V），以及设计成仅将第二PCB上的部件与第一PCB上的部件电互连的至少一个层（X）。第一LGA插入器耦合到布置在第一PCB的第一表面上的LGA，并且将至少一个部件电连接到第一PCB。第二LGA插入件夹在布置在第一PCB的第二表面上的LGA之间并耦合到布置在第二PCB的第一表面上的LGA。它将第一个PCB电连接到第二个PCB上的组件。

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