专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2007247052A Method of manufacturing microcomponent 审中-公开
标题翻译：制造微波的方法
公开(公告)号：JP2007247052A
公开(公告)日：2007-09-27
申请号：JP2006110234
申请日：2006-03-16
申请人： Toshiyuki Horiuchi , 敏行堀内
发明人： HORIUCHI TOSHIYUKI , KATAYAMA MASAHIRO , WATABE YUSUKE , NAKAMURA RYOTA , KOUCHI YUUKAI
IPC分类号： C25D1/00 , C25D1/20
摘要： PROBLEM TO BE SOLVED: To provide a method for easily separating a micro component from a substrate without damaging the same, wherein the microcomponent is manufactured by plating a metal on a plating die formed on the substrate.
SOLUTION: A metal 4 having a small ionization tendency is sputtered onto a surface of the substrate 1 onto which a metal film or foil is deposited. The plating die 5 is formed on the sputtered metal 4 using a material soluble in a solvent or a peeling liquid. A plating metal 7 is plated on the plating die 5, and while dissolving and removing the plating die 5 in the solvent or the peeling liquid, the microcomponent manufactured from the plating metal 7 is separated and made independent from the substrate 1 by taking advantage of a weak adhesion between the sputtered metal film 4 and the substrate 1.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于容易地从基板分离微成分而不损坏微组件的方法，其中通过在形成在基板上的电镀模上镀金属来制造微组件。解决方案：将具有小电离倾向的金属4溅射到沉积有金属膜或箔的基板1的表面上。使用可溶于溶剂或剥离液的材料，在溅射金属4上形成电镀模5。电镀金属7镀在电镀模5上，同时在溶剂或剥离液中溶解和除去电镀模5，由电镀金属7制成的微组件通过利用电镀金属7独立于衬底1 溅射金属膜4与基板1之间的弱粘合力。版权所有（C）2007，JPO＆INPIT

IPRDB

热门服务

关于我们

友情链接

联系方式