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    • 1. 发明申请
    • FIRST AND SECOND ORDERS TEMPERATURE-COMPENSATED RESONATOR
    • 第一和第二订单温度补偿谐振器
    • US20110305120A1
    • 2011-12-15
    • US13156648
    • 2011-06-09
    • Thierry HesslerSilvio Dalla Piazza
    • Thierry HesslerSilvio Dalla Piazza
    • G04F5/06H01L41/04
    • H03H9/02448G04F5/063H03H9/02023H03H9/02102H03H9/215H03H2003/027H03H2003/0407H03H2009/241
    • The invention relates to a temperature-compensated resonator including a body used in deformation, wherein the core (58, 58′, 18) of the body (3, 5, 7, 15, 23, 25, 27, 33, 35, 37, 43, 45, 47) is formed from a plate formed at a cut angle (θ′) in a quartz crystal determining the first and second orders temperature coefficients (α, β, α′, β′). According to the invention, the body (3, 5, 7, 15, 23, 25, 27, 33, 35, 37, 43, 45, 47) includes a coating (52, 54, 56, 52′, 54′, 56′, 16) deposited at least partially on the core (58, 58′, 18) and having first and second orders Young's modulus variations (CTE1, CTE2, CTE1′, CTE2′) according to temperature of opposite signs respectively to said first and second orders temperature coefficients (α, β, α′, β′) of said resonator so as to render the latter substantially zero. The invention concerns the field of time and frequency bases.
    • 本发明涉及一种包括用于变形的主体的温度补偿谐振器,其中主体(3,5,7,15,23,25,27,33,35,37)的芯体(58,58',18) ,43,45,47)由确定第一和第二阶温度系数(α,&bgr;α',&bgr'')的石英晶体以切割角度形成的板形(& 根据本发明,身体(3,5,7,15,23,25,27,33,35,37,43,45,47)包括涂层(52,54,56,52',54', 56',16)至少部分地沉积在所述芯(58,58',18)上,并且具有根据相反符号的温度的第一和第二阶次杨氏模量变化(CTE1,CTE2,CTE1',CTE2')分别与所述第一 和所述谐振器的二阶温度系数(α,&bgr;α',&bgr“),以使后者基本为零。 本发明涉及时间和频率的领域。
    • 2. 发明授权
    • First and second orders temperature-compensated resonator
    • 第一和第二阶温度补偿谐振器
    • US08724431B2
    • 2014-05-13
    • US13156648
    • 2011-06-09
    • Thierry HesslerSilvio Dalla Piazza
    • Thierry HesslerSilvio Dalla Piazza
    • G04F1/04
    • H03H9/02448G04F5/063H03H9/02023H03H9/02102H03H9/215H03H2003/027H03H2003/0407H03H2009/241
    • A temperature-compensated resonator includes a body used in deformation, wherein the core (58, 58′, 18) of the body (3, 5, 7, 15, 23, 25, 27, 33, 35, 37, 43, 45, 47) is formed from a plate formed at a cut angle (θ′) in a quartz crystal determining the first and second orders temperature coefficients (α, β, α′, β′). According to the invention, the body (3, 5, 7, 15, 23, 25, 27, 33, 35, 37, 43, 45, 47) includes a coating (52, 54, 56, 52′, 54′, 56′, 16) deposited at least partially on the core (58, 58′, 18) and having first and second orders Young's modulus variations (CTE1, CTE2, CTE1′, CTE2′) according to temperature of opposite signs respectively to the first and second orders temperature coefficients (α, β, α′, β′) of the resonator so as to render compensated first and second orders temperature coefficients substantially zero.
    • 温度补偿谐振器包括用于变形的主体,其中主体(3,5,7,15,23,25,27,33,35,37,43,45)的芯体(58,58',18) ,47)由在确定第一和第二阶温度系数(α,&bgr;α',&bgr'')的石英晶体中以切割角度形成的板(“the”s“)形成。 根据本发明,身体(3,5,7,15,23,25,27,33,35,37,43,45,47)包括涂层(52,54,56,52',54', 56',16)至少部分地沉积在所述芯部(58,58',18)上,并且具有根据相反符号的温度的第一和第二阶次杨氏模量变化(CTE1,CTE2,CTE1',CTE2')到第一 和谐振器的第二阶温度系数(α,&bgr;α',&bgr“),以使补偿的第一和第二阶温度系数基本上为零。
    • 3. 发明授权
    • Packaging for piezoelectric resonator
    • 压电谐振器封装
    • US07791255B2
    • 2010-09-07
    • US12270337
    • 2008-11-13
    • Silvio Dalla PiazzaThierry Hessler
    • Silvio Dalla PiazzaThierry Hessler
    • H01L41/08
    • H03H9/1021B81B2201/0271B81B2207/096B81C1/00301H03H9/02818H03H9/02952H03H9/0557
    • The invention concerns an assembly comprising a piezoelectric resonator (14) and a case (10), the case including a base part (11), on which the resonator is mounted, a wall (12) extending from said base part so as to surround at least partially said resonator, and a cover fixed to said wall in such a way as to close said case. The base part includes a main portion (17) and at least two conductive vias (16a, 16b). The conductive vias electrically connect The piezoelectric resonator to an outside circuit through the base part, and each of the conductive vias is surrounded by a insulating lining (18) so as to insulate the vias from the main portion (17). The main portion (17) of the base part (11) is divided into two parts by an insulating partition (21) in such a way that the two conductive vias are on different sides of the partition.
    • 本发明涉及一种包括压电谐振器(14)和壳体(10)的组件,所述壳体包括其上安装有所述谐振器的基座部分(11),从所述基座部分延伸以围绕 至少部分地表示所述谐振器,以及以这样的方式固定到所述壁上的盖,以关闭所述壳体。 基部包括主要部分(17)和至少两个导电通孔(16a,16b)。 导电通孔将压电谐振器通过基部电连接到外部电路,并且每个导电通孔被绝缘衬里(18)包围,以使通孔与主体部分(17)绝缘。 基部(11)的主要部分(17)通过绝缘隔板(21)被分成两部分,使得两个导电通孔位于隔板的不同侧面上。
    • 4. 发明申请
    • PACKAGING FOR PIEZOELECTRIC RESONATOR
    • 压电谐振器包装
    • US20100117491A1
    • 2010-05-13
    • US12270337
    • 2008-11-13
    • Silvio Dalla PiazzaThierry Hessler
    • Silvio Dalla PiazzaThierry Hessler
    • H01L41/00
    • H03H9/1021B81B2201/0271B81B2207/096B81C1/00301H03H9/02818H03H9/02952H03H9/0557
    • The invention concerns an assembly comprising a piezoelectric resonator (14) and a case (10), the case including a base part (11), on which the resonator is mounted, a wall (12) extending from said base part so as to surround at least partially said resonator, and a cover fixed to said wall in such a way as to close said case. The base part includes a main portion (17) and at least two conductive vias (16a, 16b). The conductive vias electrically connect The piezoelectric resonator to an outside circuit through the base part, and each of the conductive vias is surrounded by a insulating lining (18) so as to insulate the vias from the main portion (17). The main portion (17) of the base part (11) is divided into two parts by an insulating partition (21) in such a way that the two conductive vias are on different sides of the partition.
    • 本发明涉及一种包括压电谐振器(14)和壳体(10)的组件,所述壳体包括其上安装有所述谐振器的基座部分(11),从所述基座部分延伸以围绕 至少部分地表示所述谐振器,以及以这样的方式固定到所述壁上的盖,以关闭所述壳体。 基部包括主要部分(17)和至少两个导电通孔(16a,16b)。 导电通孔将压电谐振器通过基部电连接到外部电路,并且每个导电通孔被绝缘衬里(18)包围,以使通孔与主体部分(17)绝缘。 基部(11)的主要部分(17)通过绝缘隔板(21)被分成两部分,使得两个导电通孔位于隔板的不同侧面上。