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1. 发明授权

US09082610B2 Method for cleaning semiconductor wafer 有权
标题翻译：半导体晶片清洗方法
公开(公告)号：US09082610B2
公开(公告)日：2015-07-14
申请号：US14113329
申请日：2012-05-11
申请人： Tatsuo Abe , Hitoshi Kabasawa
发明人： Tatsuo Abe , Hitoshi Kabasawa
IPC分类号： C23G1/02 , H01L21/02
CPC分类号： H01L21/02052
摘要： The present invention provides a method for cleaning a semiconductor wafer, in which the method includes cleaning steps of HF cleaning, ozonated water cleaning and HF cleaning in this order at least one time, wherein in the HF cleaning carried out last in the method for cleaning the semiconductor wafer, cleaning is so carried out that an oxide film formed on a surface of the semiconductor wafer by the ozonated water is not entirely removed and to remain a part of a thickness thereof on the surface of the semiconductor wafer. As a result, a method for cleaning a semiconductor wafer in which a metal impurity level and a particle level can be reduced simultaneously in the cleaning of the semiconductor wafer is provided.
摘要翻译：本发明提供了一种清洗半导体晶片的方法，其中该方法包括以下顺序的HF清洗，臭氧水清洗和HF清洗的清洗步骤至少一次，其中在清洗方法中最后进行的HF清洗半导体晶片进行清洁，使得通过臭氧水形成在半导体晶片的表面上的氧化膜未被完全去除并且在半导体晶片的表面上保持其厚度的一部分。结果，提供了一种用于清洁半导体晶片的方法，其中可以在半导体晶片的清洁中同时减少金属杂质水平和颗粒水平。

2. 发明申请

US20130233344A1 METHOD FOR CLEANING SEMICONDUCTOR WAFER 审中-公开
标题翻译：清洗半导体波形的方法
公开(公告)号：US20130233344A1
公开(公告)日：2013-09-12
申请号：US13989605
申请日：2011-11-01
申请人： Hitoshi Kabasawa , Tatsuo Abe
发明人： Hitoshi Kabasawa , Tatsuo Abe
IPC分类号： H01L21/02
CPC分类号： H01L21/02041 , H01L21/02052
摘要： The present invention is a method for cleaning a semiconductor wafer comprising the steps of cleaning the semiconductor wafer with an SC1 cleaning solution, cleaning the semiconductor wafer cleaned by the SC1 cleaning solution with hydrofluoric acid, and cleaning the semiconductor wafer cleaned by the hydrofluoric acid with ozonated water having an ozone concentration of 3 ppm or more, wherein an etching removal of the semiconductor wafer with the SC1 cleaning solution is made 0.1 to 2.0 nm, whereby a method for cleaning a semiconductor wafer in which worsening of the surface roughness of the wafer due to cleaning can be reduced and cleaning of the wafer can be carried out effectively can be provided.
摘要翻译：本发明是一种清洗半导体晶片的方法，包括以下步骤：用SC1清洗液清洗半导体晶片，用氢氟酸清洗由SC1清洗液清洗的半导体晶片，并清洗由氢氟酸清洗的半导体晶片，臭氧浓度为3ppm以上的臭氧化水，其中用SC1清洗液对半导体晶片进行的蚀刻去除为0.1〜2.0nm，由此提供一种清洗半导体晶片的方法，其中晶片的表面粗糙度变差由于清洗可以减少，可以有效地进行晶片的清洗。

3. 发明申请

US20140048100A1 METHOD FOR CLEANING SEMICONDUCTOR WAFER 有权
标题翻译：清洗半导体波形的方法
公开(公告)号：US20140048100A1
公开(公告)日：2014-02-20
申请号：US14113329
申请日：2012-05-11
申请人： Tatsuo Abe , Hitoshi Kabasawa
发明人： Tatsuo Abe , Hitoshi Kabasawa
IPC分类号： H01L21/02
CPC分类号： H01L21/02052
摘要： The present invention provides a method for cleaning a semiconductor wafer, in which the method includes cleaning steps of HF cleaning, ozonated water cleaning and HF cleaning in this order at least one time, wherein in the HF cleaning carried out last in the method for cleaning the semiconductor wafer, cleaning is so carried out that an oxide film formed on a surface of the semiconductor wafer by the ozonated water is not entirely removed and to remain a part of a thickness thereof on the surface of the semiconductor wafer. As a result, a method for cleaning a semiconductor wafer in which a metal impurity level and a particle level can be reduced simultaneously in the cleaning of the semiconductor wafer is provided.
摘要翻译：本发明提供了一种清洗半导体晶片的方法，其中该方法包括以下顺序的HF清洗，臭氧水清洗和HF清洗的清洗步骤至少一次，其中在清洗方法中最后进行的HF清洗半导体晶片进行清洁，使得通过臭氧水形成在半导体晶片的表面上的氧化膜未被完全去除并且在半导体晶片的表面上保持其厚度的一部分。结果，提供了一种用于清洁半导体晶片的方法，其中可以在半导体晶片的清洁中同时减少金属杂质水平和颗粒水平。

4. 发明授权

US08083856B2 Ultrasonic cleaning apparatus and ultrasonic cleaning method 有权
标题翻译：超声波清洗设备和超声波清洗方法
公开(公告)号：US08083856B2
公开(公告)日：2011-12-27
申请号：US12864255
申请日：2009-01-23
申请人： Tatsuo Abe , Hitoshi Kabasawa , Izumi Arai
发明人： Tatsuo Abe , Hitoshi Kabasawa , Izumi Arai
IPC分类号： B08B3/12
CPC分类号： B08B3/12 , H01L21/67057
摘要： An ultrasonic cleaning apparatus having at least a cleaning tank; an ultrasonic wave transmitting tank; a vibrating plate placed at a bottom portion of the ultrasonic wave transmitting tank, the vibrating plate superposing the ultrasonic waves on the transmitting water with a transducer; and a holding jig for holding the object to be cleaned in the cleaning tank, the apparatus in which the object to be cleaned is ultrasonically cleaned by immersing the object to be cleaned held with the holding jig in the cleaning liquid accommodated in the cleaning tank, putting the cleaning tank into the transmitting water accommodated in the ultrasonic wave transmitting tank, and transmitting the ultrasonic waves superposed with the vibrating plate to the cleaning tank through the transmitting water, the apparatus comprising a transmitting tank oscillating mechanism for oscillating the ultrasonic wave transmitting tank in a horizontal plane.
摘要翻译：一种至少具有清洗槽的超声波清洗装置; 超声波发射罐; 设置在所述超声波发送槽的底部的振动板，所述振动板用传感器将所述超声波叠加在所述透射水上; 以及用于将待清洁物体保持在清洗槽中的保持夹具，其中通过将保持夹具夹持的待清洁物体浸入容纳在清洗槽中的清洗液体中来对被清洁物体进行超声波清洗的装置，将清洗槽放入容纳在超声波传送箱内的传送水中，并通过传送水将与振动板叠加的超声波传送到清洗槽，该设备包括一个用于使超声波传输槽振荡的传送槽振荡机构在水平面。

5. 发明申请

US20100294305A1 ULTRASONIC CLEANING APPARATUS AND ULTRASONIC CLEANING METHOD 有权
标题翻译：超声波清洗装置和超声波清洗方法
公开(公告)号：US20100294305A1
公开(公告)日：2010-11-25
申请号：US12864255
申请日：2009-01-23
申请人： Tatsuo Abe , Hitoshi Kabasawa , Izumi Arai
发明人： Tatsuo Abe , Hitoshi Kabasawa , Izumi Arai
IPC分类号： B08B3/12
CPC分类号： B08B3/12 , H01L21/67057
摘要： An ultrasonic cleaning apparatus having at least a cleaning an ultrasonic wave transmitting tank a vibrating plate placed at a bottom portion of the ultrasonic wave transmitting tank, the vibrating plate superposing the ultrasonic waves on the transmitting water with a transducer; and a holding jig for holding the object to be cleaned in the cleaning tank, the apparatus in which the object to be cleaned is ultrasonically cleaned by immersing the object to be cleaned held with the holding jig in the cleaning liquid accommodated in the cleaning tank, putting the cleaning tank into the transmitting water accommodated in the ultrasonic wave transmitting tank, and transmitting the ultrasonic waves superposed with the vibrating plate to the cleaning tank through the transmitting water, the apparatus comprising a transmitting tank oscillating mechanism for oscillating the ultrasonic wave transmitting tank in a horizontal plane.
摘要翻译：一种超声波清洗装置，其特征在于，具有至少清洗超声波透过箱，设置在所述超声波透过箱的底部的振动板，所述振动板用传感器将所述超声波重叠在所述透水上; 以及用于将待清洁物体保持在清洗槽中的保持夹具，其中通过将保持夹具夹持的待清洁物体浸入容纳在清洗槽中的清洗液体中来对被清洁物体进行超声波清洗的装置，将清洗槽放入容纳在超声波传送箱内的传送水中，并通过传送水将与振动板叠加的超声波传送到清洗槽，该设备包括一个用于使超声波传输槽振荡的传送槽振荡机构在水平面。

6. 发明授权

US09725587B2 Injection molded article 有权
公开(公告)号：US09725587B2
公开(公告)日：2017-08-08
申请号：US13876867
申请日：2011-09-30
申请人： Tomoyuki Fujisawa , Tatsuo Abe
发明人： Tomoyuki Fujisawa , Tatsuo Abe
IPC分类号： C08L25/06 , B29C45/26 , B29C45/00 , B29C45/17 , B29C45/73
CPC分类号： C08L25/06 , B29C45/0005 , B29C45/0013 , B29C45/0025 , B29C45/0046 , B29C45/1703 , B29C45/174 , B29C45/2669 , B29C2045/0044 , B29C2045/1722 , B29C2045/7356 , B29C2045/7393
摘要： An injection molded article obtained by injection molding a thermoplastic resin composition comprising 100 parts by mass of a thermoplastic resin and 50 parts by mass or less of at least one of a filler and a colored metallic pigment, wherein at least one weld exists, and a long diameter of 95% by mass or more of the filler existing within a cross-sectional depth of 50 μm or less from a surface of the weld is parallel to the surface of the weld.

7. 发明申请

US20070252444A1 Canned Linear Motor Armature and Canned Linear Motor 失效
标题翻译：罐装线性电机电枢和直线电机
公开(公告)号：US20070252444A1
公开(公告)日：2007-11-01
申请号：US11597249
申请日：2005-04-01
申请人： Kenichi Sadakane , Toru Shikayama , Tatsuo Abe , Akio Sakai , Shusaku Yoshida
发明人： Kenichi Sadakane , Toru Shikayama , Tatsuo Abe , Akio Sakai , Shusaku Yoshida
IPC分类号： H02K41/02
CPC分类号： H02K41/031 , H02K3/24 , H02K3/44 , H02K3/47 , H02K5/128 , H02K5/225 , H02K9/19
摘要： In the canned linear motor armature, both the side surfaces of the armature winding (18) are fixed by two winding fixing frames (4) so as to sandwich the armature winding in between them in the longitudinal direction. A refrigerant passage (5) is provided in a space between the can (3) and the winding fixing frame (4). A seal material (24) is provided in a gap between a case (2) and the winding fixing frame (4) to prevent a refrigerant supplied to the refrigerant passage (5) from leaking to the armature winding (18) sandwiched in between the two winding fixing frames (4) to impregnate the armature winding (18) with the refrigerant. A waterproof film is adhered onto a surface of the winding fixing frame (4) where the refrigerant comes into contact.
摘要翻译：在固定线性电动机电枢中，电枢绕组（18）的两个侧面由两个绕组固定框架（4）固定，以将电枢绕组沿长度方向夹在它们之间。在罐（3）和卷绕固定框架（4）之间的空间中设置制冷剂通道（5）。密封材料（24）设置在壳体（2）和绕组固定框架（4）之间的间隙中，以防止供给制冷剂通道（5）的制冷剂泄漏到夹在其间的电枢绕组（18）两个卷绕的固定框架（4），用制冷剂浸渍电枢绕组（18）。防水膜粘附到制冷剂接触的卷绕固定框架（4）的表面上。

8. 发明申请

US20130203932A1 INJECTION MOLDED ARTICLE 有权
标题翻译：注射成型品
公开(公告)号：US20130203932A1
公开(公告)日：2013-08-08
申请号：US13876867
申请日：2011-09-30
申请人： Tomoyuki Fujisawa , Tatsuo Abe
发明人： Tomoyuki Fujisawa , Tatsuo Abe
IPC分类号： C08L25/06
CPC分类号： C08L25/06 , B29C45/0005 , B29C45/0013 , B29C45/0025 , B29C45/0046 , B29C45/1703 , B29C45/174 , B29C45/2669 , B29C2045/0044 , B29C2045/1722 , B29C2045/7356 , B29C2045/7393
摘要： An injection molded article obtained by injection molding a thermoplastic resin composition comprising 100 parts by mass of a thermoplastic resin and 50 parts by mass or less of at least one of a filler and a colored metallic pigment, wherein at least one weld exists, and a long diameter of 95% by mass or more of the filler existing within a cross-sectional depth of 50 μm or less from a surface of the weld is parallel to the surface of the weld.
摘要翻译：一种注射成型热塑性树脂组合物的注射成型体，该热塑性树脂组合物包含100质量份热塑性树脂和50质量份以下的填料和着色金属颜料中的至少一种，其中至少存在一个焊缝，以及存在于焊接表面的50μm以下的截面深度内的填料的95质量％以上的长直径平行于焊接面。

9. 发明授权

US07663270B2 Canned linear motor armature and canned linear motor 失效
标题翻译：罐装线性电机电枢和罐装线性电机
公开(公告)号：US07663270B2
公开(公告)日：2010-02-16
申请号：US11597249
申请日：2005-04-01
申请人： Kenichi Sadakane , Toru Shikayama , Tatsuo Abe , Akio Sakai , Shusaku Yoshida
发明人： Kenichi Sadakane , Toru Shikayama , Tatsuo Abe , Akio Sakai , Shusaku Yoshida
IPC分类号： H02K41/02
CPC分类号： H02K41/031 , H02K3/24 , H02K3/44 , H02K3/47 , H02K5/128 , H02K5/225 , H02K9/19
摘要： In the canned linear motor armature, both the side surfaces of the armature winding (18) are fixed by two winding fixing frames (4) so as to sandwich the armature winding in between them in the longitudinal direction. A refrigerant passage (5) is provided in a space between the can (3) and the winding fixing frame (4). A seal material (24) is provided in a gap between a case (2) and the winding fixing frame (4) to prevent a refrigerant supplied to the refrigerant passage (5) from leaking to the armature winding (18) sandwiched in between the two winding fixing frames (4) to impregnate the armature winding (18) with the refrigerant. A waterproof film is adhered onto a surface of the winding fixing frame (4) where the refrigerant comes into contact.
摘要翻译：在固定线性电动机电枢中，电枢绕组（18）的两个侧面由两个绕组固定框架（4）固定，以将电枢绕组沿长度方向夹在它们之间。在罐（3）和卷绕固定框架（4）之间的空间中设置制冷剂通道（5）。密封材料（24）设置在壳体（2）和绕组固定框架（4）之间的间隙中，以防止供给制冷剂通道（5）的制冷剂泄漏到夹在其间的电枢绕组（18）两个卷绕的固定框架（4），用制冷剂浸渍电枢绕组（18）。防水膜粘附到制冷剂接触的卷绕固定框架（4）的表面上。

10. 发明授权

US06374834B1 Substrate processing method and processing apparatus 失效
标题翻译：基板处理方法和处理装置
公开(公告)号：US06374834B1
公开(公告)日：2002-04-23
申请号：US09629301
申请日：2000-07-31
申请人： Tatsuo Abe , Tsutomu Doi
发明人： Tatsuo Abe , Tsutomu Doi
IPC分类号： B08B312
CPC分类号： H01L21/02052 , H01L21/67051 , Y10S134/902
摘要： This invention provides a cleaning method of cleaning a laser mark formed on a semiconductor wafer. A semiconductor wafer is rotated in a circumferential direction, and a laser mark is detected indirectly or directly in a non-contact manner. Rotation of the semiconductor wafer is controlled on the basis of detection of the laser mark, and an ultrasonic vibration-applied processing solution is sprayed to the laser mark.
摘要翻译：本发明提供一种清洁形成在半导体晶片上的激光标记的清洗方法。半导体晶片在圆周方向上旋转，并且以非接触的方式间接地或直接地检测激光标记。基于激光标记的检测来控制半导体晶片的旋转，并将超声波振动施加处理液喷射到激光标记。

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