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    • 3. 发明授权
    • Control circuit for forming process on nonvolatile variable resistive element and control method for forming process
    • 用于在非易失性可变电阻元件上形成工艺的控制电路和用于形成工艺的控制方法
    • US08120944B2
    • 2012-02-21
    • US12722851
    • 2010-03-12
    • Suguru KawabataKazuya IshiharaYoshiji Ohta
    • Suguru KawabataKazuya IshiharaYoshiji Ohta
    • G11C11/00
    • G11C13/0007G11C13/0011G11C13/0064G11C13/0069G11C2013/0083G11C2213/34G11C2213/72G11C2213/79H01L27/24
    • A nonvolatile semiconductor memory device can carry out a forming process simultaneously on the nonvolatile variable resistive elements of memory cells and make the forming time shorter. The nonvolatile semiconductor memory device has a forming detection circuit provided between the memory cell array and the second selection line (bit line) decoder. The forming detection circuit detects the completion of the forming process for memory cells by measuring the fluctuation in the potential of second selection lines or the current flowing through the second selection lines when applying a voltage pulse for a forming process through the second selection lines simultaneously to the memory cells on which a forming process is to be carried out connected to the same first selection line (word line), and prevents a voltage from being applied to the second selection lines connected to the memory cells where the completion of the forming process is detected.
    • 非易失性半导体存储器件可以在存储单元的非易失性可变电阻元件上同时进行形成处理,并且使形成时间更短。 非易失性半导体存储器件具有设置在存储单元阵列和第二选择线(位线))解码器之间的形成检测电路。 形成检测电路通过测量当通过第二选择线同时施加用于形成处理的电压脉冲时第二选择线的电位的波动或流过第二选择线的电流来检测存储单元的形成处理的完成, 要在其上执行形成处理的存储单元连接到相同的第一选择线(字线),并且防止电压施加到连接到形成处理完成的存储单元的第二选择线 检测到。
    • 8. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE
    • 半导体存储器件
    • US20120075909A1
    • 2012-03-29
    • US13212457
    • 2011-08-18
    • Mitsuru NAKURAKazuya IshiharaShinobu YamazakiSuguru Kawabata
    • Mitsuru NAKURAKazuya IshiharaShinobu YamazakiSuguru Kawabata
    • G11C11/21
    • G11C13/0007G11C13/0064G11C13/0069G11C2213/32G11C2213/79
    • Provided is a semiconductor memory device that is capable of stably programming with desirable controllability to a desired electric resistance state in a random access programming action and is provided with a variable resistance element. Regardless of a resistance state of a variable resistance element of a memory cell that is a target of a writing action (erasing and programming actions), an erasing voltage pulse for bringing the resistance state of the variable resistance element to an erased state having a lowest resistance value is applied. Thereafter, a programming voltage pulse for bringing the resistance state of the variable resistance element to a desired programmed state is applied to the variable resistance element of the programming action target memory cell. By always applying the programming voltage pulse after having applied the erasing voltage pulse, a plurality of programming voltage pulses being sequentially applied can be avoided.
    • 提供一种半导体存储器件,其能够在随机存取编程动作中以期望的可控制性稳定地编程到期望的电阻状态,并且具有可变电阻元件。 无论作为写入动作(擦除和编程动作)的目标的存储单元的可变电阻元件的电阻状态,将可变电阻元件的电阻状态变为最低的擦除状态的擦除电压脉冲 电阻值被应用。 此后,将用于使可变电阻元件的电阻状态变为期望编程状态的编程电压脉冲被施加到编程动作目标存储单元的可变电阻元件。 通过在施加擦除电压脉冲之后始终应用编程电压脉冲,可以避免顺序施加的多个编程电压脉冲。
    • 9. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE
    • 半导体存储器件
    • US20110292715A1
    • 2011-12-01
    • US13114507
    • 2011-05-24
    • Kazuya IshiharaMitsuru NakuraYoshiji Ohta
    • Kazuya IshiharaMitsuru NakuraYoshiji Ohta
    • G11C11/00G11C7/12
    • G11C7/12G11C8/08G11C13/0004G11C13/0007G11C13/0026G11C13/0069G11C2013/0071G11C2213/79G11C2213/82
    • A semiconductor memory device includes a memory cell array in which a plurality of memory cells is aligned in a matrix shape, each memory cell including a two-terminal memory element and a transistor for selection connected in series; a first voltage applying circuit that applies a writing voltage pulse to first bit lines; and a second voltage applying circuit that applies a pre-charge voltage to the first bit lines and second bit lines, wherein in a writing of a memory cell, after the second voltage applying circuit has pre-charged both ends of the memory cell to a same voltage, the first voltage applying circuit applies the writing voltage pulse via the first bit line that is directly connected to the transistor for selection, and the second voltage applying circuit applies the pre-charge voltage to the second bit line directly connected to the memory element.
    • 半导体存储器件包括其中多个存储器单元以矩阵形状排列的存储单元阵列,每个存储单元包括串联连接的两端存储元件和选择晶体管; 对第一位线施加写入电压脉冲的第一电压施加电路; 以及施加预充电电压到第一位线和第二位线的第二电压施加电路,其中在存储单元的写入中,在所述第二电压施加电路将所述存储器单元的两端预充电到 第一电压施加电路经由直接连接到晶体管的第一位线施加写入电压脉冲用于选择,并且第二电压施加电路将预充电电压施加到直接连接到存储器的第二位线 元件。