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    • 5. 发明授权
    • Nonvolatile semiconductor memory device
    • 非易失性半导体存储器件
    • US08411488B2
    • 2013-04-02
    • US13233301
    • 2011-09-15
    • Suguru KawabataShinobu YamazakiKazuya IshiharaJunya OnishiNobuyoshi AwayaYukio Tamai
    • Suguru KawabataShinobu YamazakiKazuya IshiharaJunya OnishiNobuyoshi AwayaYukio Tamai
    • G11C11/00
    • G11C11/5685G11C13/0007G11C2013/0071G11C2013/0073G11C2013/0083G11C2213/79
    • A nonvolatile semiconductor memory device includes a memory cell array for storing user data provided by arranging memory cells each having a variable resistive element having a first electrode, a second electrode, and a variable resistor made of a metal oxide sandwiched between the first and second electrodes. The first and second electrodes are formed of a conductive material forming ohmic junction with the variable resistor and a conductive material forming non-ohmic junction with the variable resistor, respectively. The variable resistor changes between two or more different resistance states by applying a voltage between the electrodes. The resistance state after being changed is maintained in a nonvolatile manner. The variable resistive elements of all memory cells in the memory cell array are set to the highest of the two or more different resistance states in an unused state before the memory cell array is used to store the user data.
    • 非易失性半导体存储器件包括存储单元阵列,用于存储通过布置存储单元而提供的用户数据,每个存储单元具有可变电阻元件,该可变电阻元件具有第一电极,第二电极和夹在第一和第二电极之间的金属氧化物制成的可变电阻器 。 第一和第二电极由与可变电阻器形成欧姆结的导电材料和分别与可变电阻器形成非欧姆结的导电材料形成。 可变电阻器通过在电极之间施加电压而在两个或多个不同的电阻状态之间变化。 改变后的电阻状态保持非挥发性。 在存储单元阵列用于存储用户数据之前,将存储单元阵列中的所有存储单元的可变电阻元件设置为处于未使用状态的两个或多个不同电阻状态中的最高值。
    • 6. 发明授权
    • Control circuit for forming process on nonvolatile variable resistive element and control method for forming process
    • 用于在非易失性可变电阻元件上形成工艺的控制电路和用于形成工艺的控制方法
    • US08120944B2
    • 2012-02-21
    • US12722851
    • 2010-03-12
    • Suguru KawabataKazuya IshiharaYoshiji Ohta
    • Suguru KawabataKazuya IshiharaYoshiji Ohta
    • G11C11/00
    • G11C13/0007G11C13/0011G11C13/0064G11C13/0069G11C2013/0083G11C2213/34G11C2213/72G11C2213/79H01L27/24
    • A nonvolatile semiconductor memory device can carry out a forming process simultaneously on the nonvolatile variable resistive elements of memory cells and make the forming time shorter. The nonvolatile semiconductor memory device has a forming detection circuit provided between the memory cell array and the second selection line (bit line) decoder. The forming detection circuit detects the completion of the forming process for memory cells by measuring the fluctuation in the potential of second selection lines or the current flowing through the second selection lines when applying a voltage pulse for a forming process through the second selection lines simultaneously to the memory cells on which a forming process is to be carried out connected to the same first selection line (word line), and prevents a voltage from being applied to the second selection lines connected to the memory cells where the completion of the forming process is detected.
    • 非易失性半导体存储器件可以在存储单元的非易失性可变电阻元件上同时进行形成处理,并且使形成时间更短。 非易失性半导体存储器件具有设置在存储单元阵列和第二选择线(位线))解码器之间的形成检测电路。 形成检测电路通过测量当通过第二选择线同时施加用于形成处理的电压脉冲时第二选择线的电位的波动或流过第二选择线的电流来检测存储单元的形成处理的完成, 要在其上执行形成处理的存储单元连接到相同的第一选择线(字线),并且防止电压施加到连接到形成处理完成的存储单元的第二选择线 检测到。
    • 8. 发明授权
    • Non-volatile semiconductor device
    • 非易失性半导体器件
    • US08530877B2
    • 2013-09-10
    • US13182696
    • 2011-07-14
    • Junya OnishiShinobu YamazakiKazuya IshiharaYushi InoueYukio TamaiNobuyoshi Awaya
    • Junya OnishiShinobu YamazakiKazuya IshiharaYushi InoueYukio TamaiNobuyoshi Awaya
    • H01L47/00
    • H01L45/04H01L27/2436H01L45/1233H01L45/146
    • A variable resistance element that can stably perform a switching operation with a property variation being reduced by suppressing a sharp current that accompanies completion of forming process, and a non-volatile semiconductor memory device including the variable resistance element are realized. The non-volatile semiconductor memory device uses the variable resistance element for storing information in which a resistance changing layer is interposed between a first electrode and a second electrode, and a buffer layer is inserted between the first electrode and the resistance changing layer where a switching interface is formed. The buffer layer and the resistance changing layer include n-type metal oxides, and materials of the buffer layer and the resistance changing layer are selected such that energy at a bottom of a conduction band of the n-type metal oxide configuring the buffer layer is lower than that of the n-type metal oxide configuring the resistance changing layer.
    • 通过抑制伴随着成形处理的完成的尖锐电流,可以稳定地进行具有特性变化的开关动作的可变电阻元件,以及包括该可变电阻元件的非易失性半导体存储器件。 非易失性半导体存储器件使用可变电阻元件来存储在第一电极和第二电极之间插入电阻变化层的信息,并且缓冲层插入在第一电极和电阻变化层之间,其中开关 界面形成。 缓冲层和电阻变化层包括n型金属氧化物,并且选择缓冲层和电阻变化层的材料,使得构成缓冲层的n型金属氧化物的导带的底部的能量为 低于构成电阻变化层的n型金属氧化物。
    • 9. 发明申请
    • NON-VOLATILE SEMICONDUCTOR DEVICE
    • 非挥发性半导体器件
    • US20120025163A1
    • 2012-02-02
    • US13182696
    • 2011-07-14
    • Junya ONISHIShinobu YamazakiKazuya IshiharaYushi InoueYukio TamaiNobuyoshi Awaya
    • Junya ONISHIShinobu YamazakiKazuya IshiharaYushi InoueYukio TamaiNobuyoshi Awaya
    • H01L45/00
    • H01L45/04H01L27/2436H01L45/1233H01L45/146
    • A variable resistance element that can stably perform a switching operation with a property variation being reduced by suppressing a sharp current that accompanies completion of forming process, and a non-volatile semiconductor memory device including the variable resistance element are realized. The non-volatile semiconductor memory device uses the variable resistance element for storing information in which a resistance changing layer is interposed between a first electrode and a second electrode, and a buffer layer is inserted between the first electrode and the resistance changing layer where a switching interface is formed. The buffer layer and the resistance changing layer include n-type metal oxides, and materials of the buffer layer and the resistance changing layer are selected such that energy at a bottom of a conduction band of the n-type metal oxide configuring the buffer layer is lower than that of the n-type metal oxide configuring the resistance changing layer.
    • 通过抑制伴随着成形处理的完成的尖锐电流,可以稳定地进行具有特性变化的开关动作的可变电阻元件,以及包括该可变电阻元件的非易失性半导体存储器件。 非易失性半导体存储器件使用可变电阻元件来存储在第一电极和第二电极之间插入电阻变化层的信息,并且缓冲层插入在第一电极和电阻变化层之间,其中开关 界面形成。 缓冲层和电阻变化层包括n型金属氧化物,并且选择缓冲层和电阻变化层的材料,使得构成缓冲层的n型金属氧化物的导带的底部的能量为 低于构成电阻变化层的n型金属氧化物。
    • 10. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE
    • 半导体存储器件
    • US20120075909A1
    • 2012-03-29
    • US13212457
    • 2011-08-18
    • Mitsuru NAKURAKazuya IshiharaShinobu YamazakiSuguru Kawabata
    • Mitsuru NAKURAKazuya IshiharaShinobu YamazakiSuguru Kawabata
    • G11C11/21
    • G11C13/0007G11C13/0064G11C13/0069G11C2213/32G11C2213/79
    • Provided is a semiconductor memory device that is capable of stably programming with desirable controllability to a desired electric resistance state in a random access programming action and is provided with a variable resistance element. Regardless of a resistance state of a variable resistance element of a memory cell that is a target of a writing action (erasing and programming actions), an erasing voltage pulse for bringing the resistance state of the variable resistance element to an erased state having a lowest resistance value is applied. Thereafter, a programming voltage pulse for bringing the resistance state of the variable resistance element to a desired programmed state is applied to the variable resistance element of the programming action target memory cell. By always applying the programming voltage pulse after having applied the erasing voltage pulse, a plurality of programming voltage pulses being sequentially applied can be avoided.
    • 提供一种半导体存储器件,其能够在随机存取编程动作中以期望的可控制性稳定地编程到期望的电阻状态,并且具有可变电阻元件。 无论作为写入动作(擦除和编程动作)的目标的存储单元的可变电阻元件的电阻状态,将可变电阻元件的电阻状态变为最低的擦除状态的擦除电压脉冲 电阻值被应用。 此后,将用于使可变电阻元件的电阻状态变为期望编程状态的编程电压脉冲被施加到编程动作目标存储单元的可变电阻元件。 通过在施加擦除电压脉冲之后始终应用编程电压脉冲,可以避免顺序施加的多个编程电压脉冲。