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1. 发明专利

JP2012033961A Substrate processing device 有权
标题翻译：基板处理装置
公开(公告)号：JP2012033961A
公开(公告)日：2012-02-16
申请号：JP2011236625
申请日：2011-10-28
申请人： Semes Co Ltd , セメス株式会社Semes Co., Ltd.
发明人： SONG GIL-HUN , PARK PYEONG-JAE
IPC分类号： H01L21/306 , H01L21/304
CPC分类号： H01L21/67051 , H01L21/67034 , H01L21/6708 , H01L21/68714
摘要： PROBLEM TO BE SOLVED: To provide a substrate processing device for efficiently washing or etching the upper and lower faces of a substrate.SOLUTION: In a substrate processing device, a substrate is supported and the supported substrate is rotated. At least one of chemical, washing liquid and gas is selectively injected to the lower face of the rotated substrate. At least one of chemical, washing liquid and gas being which are the same as the chemical, the washing liquid and the gas injected to the lower face of the substrate is selectively injected to the upper face of the rotated substrate. By injecting the chemical, the washing liquid or the gas to the lower part of the substrate for washing or etching the lower face of the substrate, processes for the upper face and the lower face of the substrate can be carried out at the same time.
摘要翻译：要解决的问题：提供一种用于有效地洗涤或蚀刻基板的上表面和下表面的基板处理装置。解决方案：在基板处理装置中，支撑基板并旋转支撑的基板。选择性地将化学，洗涤液体和气体中的至少一种注入旋转的基底的下表面。与化学品相同的化学品，洗涤液体和气体中的至少一种，喷射到基底的下表面的洗涤液体和气体被选择性地注入旋转的基底的上表面。通过将化学品，洗涤液或气体注入到用于洗涤或蚀刻衬底的下表面的衬底的下部，可以同时进行衬底的上表面和下表面的处理。版权所有（C）2012，JPO＆INPIT

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