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JP2013016798A Substrate treating apparatus and substrate treating method 有权
标题翻译：基板处理装置和基板处理方法
公开(公告)号：JP2013016798A
公开(公告)日：2013-01-24
申请号：JP2012144065
申请日：2012-06-27
申请人： Semes Co Ltd , セメス株式会社SEMES CO., Ltd
发明人： JUN YU-SUN , KIM WO-YONG , HEO CHAYONG , PARK JONG-SONG
IPC分类号： H01L21/304
CPC分类号： H01L21/67034 , H01L21/67017
摘要： PROBLEM TO BE SOLVED: To provide a substrate treating apparatus for drying a substrate using a supercritical fluid, and a substrate treating method using the apparatus.SOLUTION: The substrate treating apparatus includes: a process chamber 2500 in which an organic solvent remaining on a substrate is dissolved using a fluid provided as a supercritical fluid to dry the substrate; and a recycling unit 4000 in which the organic solvent is separated from the fluid discharged from the process chamber to recycle the fluid. The method for treating a substrate includes the steps of: dissolving an organic solvent remaining on a substrate using a fluid provided as a supercritical fluid to dry the substrate; and separating the organic solvent from the fluid to recycle the fluid.
摘要翻译：要解决的问题：提供一种使用超临界流体干燥基板的基板处理装置和使用该装置的基板处理方法。基板处理装置包括：处理室2500，其中残留在基板上的有机溶剂使用作为超临界流体提供的流体溶解以干燥基板; 以及回收单元4000，其中有机溶剂与从处理室排出的流体分离以再循环流体。用于处理基材的方法包括以下步骤：使用作为超临界流体提供的流体将残留在基材上的有机溶剂溶解以干燥基材; 并将有机溶剂与流体分离以再循环流体。版权所有（C）2013，JPO＆INPIT

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