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1. 发明申请

US20130306559A1 CHEMICAL CLEANING METHOD FOR IMMERSED MEMBRANE ELEMENT 审中-公开
标题翻译：化学清洗方法用于渗透膜元件
公开(公告)号：US20130306559A1
公开(公告)日：2013-11-21
申请号：US13992518
申请日：2011-11-25
申请人： Seiko Kantani , Atsushi Kitanaka , Masahiro Kihara , Toshiro Miyoshi
发明人： Seiko Kantani , Atsushi Kitanaka , Masahiro Kihara , Toshiro Miyoshi
IPC分类号： B01D65/06
CPC分类号： B01D65/06 , B01D65/02 , B01D2315/06 , B01D2321/16 , B01D2321/162 , B01D2321/26 , B01D2321/28 , C02F3/1273 , C02F2303/16 , Y02W10/15
摘要： The present invention relates to a cleaning method for a submerged membrane element used in a membrane bioreactor treatment in which organic wastewater containing 1 mg/L or more of manganese is subjected a biological treatment in a bioreactor treatment tank and then subjected to solid-liquid separation by a membrane filtration device provided in the bioreactor treatment tank, in which after a first liquid containing an oxidizing agent is injected from a secondary side of the submerged membrane element to a primary side thereof and maintained for a certain period of time, the first liquid containing an oxidizing agent is suction-discharged from the secondary side to the outside of the system, and then a second liquid containing an acid is injected from the secondary side of the submerged membrane element to the primary side thereof and maintained for a certain period of time, followed by conducting suction filtration operation.
摘要翻译：本发明涉及一种用于膜生物反应器处理的浸没膜元件的清洗方法，其中含有1mg / L以上锰的有机废水在生物反应器处理槽中进行生物处理，然后进行固液分离通过设置在生物反应器处理槽中的膜过滤装置，其中在将含有氧化剂的第一液体从浸没的膜元件的二次侧注入其一次侧并保持一定时间后，第一液体含有氧化剂的二次侧吸附到体系外侧，然后将含有酸的第二液体从浸没膜元件的二次侧注入其一次侧，并保持一定时间时间，然后进行抽滤操作。

2. 发明授权

US08371027B2 Electronic components mounting method 有权
标题翻译：电子元件安装方式
公开(公告)号：US08371027B2
公开(公告)日：2013-02-12
申请号：US12279024
申请日：2007-04-12
申请人： Masafumi Inoue , Mitsuhaya Tsukamoto , Masahiro Kihara , Syoichi Nishi
发明人： Masafumi Inoue , Mitsuhaya Tsukamoto , Masahiro Kihara , Syoichi Nishi
IPC分类号： H05K3/36
CPC分类号： H05K3/3484 , H05K1/0269 , H05K3/0008 , H05K3/303 , H05K13/0812 , H05K2203/0195 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/53091 , Y10T29/53174
摘要： In an electronic components mounting process fabricating a mount circuit board due to an electronic components mounting system formed of a plurality of electronic components mounting apparatuses by connecting them to each other, data of solder paste position which is printed on the circuit board is transmitted as feedforward data to an electronic components placement apparatus and a placement state inspecting apparatus. A control parameter which controls a placing position in a components placement operation due to the electronic components placement apparatus and an inspection parameter which indicates a standard position of the components in a placement state inspection are updated on the basis of the soldering position data. Therefore, it is possible to achieve a precise mounting by effectively and properly using inspection information obtained from each process.
摘要翻译：在由多个电子部件安装装置形成的电子部件安装系统通过彼此连接而构成安装电路基板的电子部件安装工序中，印刷在电路基板上的焊锡膏位置的数据作为前馈数据到电子元件放置装置和放置状态检查装置。基于焊接位置数据，更新控制参数，该控制参数控制由于电子元件放置设备而导致的元件放置操作中的放置位置和指示在放置状态检查中的元件的标准位置的检查参数。因此，可以通过有效且适当地使用从各处理获得的检查信息来实现精确的安装。

3. 发明申请

US20120102726A1 DEVICE AND METHOD FOR MOUNTING ELECTRONIC COMPONENTS 有权
标题翻译：用于安装电子元件的装置和方法
公开(公告)号：US20120102726A1
公开(公告)日：2012-05-03
申请号：US13381245
申请日：2010-05-07
申请人： Kenichi Kaida , Hideki Sumi , Masahiro Kihara , Kenichirou Ishimoto , Noboru Higashi
发明人： Kenichi Kaida , Hideki Sumi , Masahiro Kihara , Kenichirou Ishimoto , Noboru Higashi
IPC分类号： B23P21/00
CPC分类号： H05K13/0452 , H01L23/552 , H01L25/50 , H01L2924/0002 , H05K13/0812 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/53022 , H01L2924/00
摘要： An object is to provide an electronic component mounting method in which an adequate component mounting work to which a check result is correctly reflected is enabled and it is possible to satisfy both reduction of the failure occurrence rate and improvement of the working efficiency. An electronic component mounting apparatus in which an appearance checking section which checks a board to detect existence or non-existence of a failure item, and a component mounting section which transfers and mounts an allocated mounting object component to the board in which the check is ended are integrally disposed includes a mounting availability determination processing section 28d which determines an availability of an execution of an operation of mounting the mounting object component, based on a result of detection of a failure item. In a mounting availability determining process, an availability of an execution of a mounting operation for the mounting object component is automatically determined based on preset failure patterns of the detection result.
摘要翻译：本发明的目的是提供一种电子部件安装方法，其中能够正确反映检查结果的适当部件安装工作，并且可以同时满足故障发生率的降低和工作效率的提高。一种电子部件安装装置，其中检查板以检测故障项目的存在或不存在的外观检查部分以及将分配的安装对象部件传送并安装到检查结束的板的部件安装部分一体地设置有基于故障项目的检测结果的安装可用性判定处理部28d，其确定安装对象部件的安装的动作的可行性。在安装可用性确定过程中，基于检测结果的预设故障模式自动确定对安装对象部件的安装操作的执行的可用性。

4. 发明授权

US07841079B2 Electronic component mounting system and electronic component mounting method 有权
标题翻译：电子元件安装系统和电子元件安装方法
公开(公告)号：US07841079B2
公开(公告)日：2010-11-30
申请号：US12123950
申请日：2008-05-20
申请人： Masafumi Inoue , Fumio Kikutsugi , Masahiro Kihara
发明人： Masafumi Inoue , Fumio Kikutsugi , Masahiro Kihara
IPC分类号： H05R3/34
CPC分类号： H05K3/3484 , H01L23/544 , H01L24/81 , H01L24/83 , H01L2223/54426 , H01L2223/54473 , H01L2224/81121 , H01L2224/81801 , H01L2224/83121 , H01L2224/83801 , H01L2924/01068 , H05K1/0269 , H05K3/0097 , H05K3/1216 , H05K3/303 , H05K2201/09918 , H05K2203/0165 , H05K2203/0545 , H05K2203/166 , Y02P70/613 , Y10T29/49131 , Y10T29/49144 , Y10T29/49179 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191 , H01L2924/3512 , H01L2924/00
摘要： In electronic component mounting for a plurality of individual substrates held on a carrier, solder position deviation data is calculated for each individual substrate based on a mark position recognition result on a carrier after solder printing, a solder position recognition result, and electrode position information indicating the position of an electrode on each individual substrate, an operation of calculating position correction data, which is used to correct the positional deviation to mount electronic components at proper positions, is performed for each individual substrate based on the calculated solder position deviation data and the calculated position correction data is feed-forwarded to an electronic component mounting apparatus, and an electronic component mounting operation of a component mounting mechanism is controlled based on the mark position recognition result and the position correction data.
摘要翻译：在用于保持在载体上的多个单独基板的电子部件安装中，基于焊料印刷后的载体上的标记位置识别结果，焊料位置识别结果和表示电极位置信息的电极位置信息，针对各个基板计算焊接位置偏差数据基于所计算的焊接位置偏差数据，对每个单独的基板执行每个单独基板上的电极的位置，用于计算位置校正数据的操作，该位置校正数据用于校正将电子部件安装在适当位置的位置偏差，计算出的位置校正数据被馈送到电子部件安装装置，并且基于标记位置识别结果和位置校正数据来控制部件安装机构的电子部件安装操作。

5. 发明申请

US20100066955A1 SUBSTRATE FOR USE IN A LIQUID CRYSTAL DISPLAY AND LIQUID CRYSTAL DISPLAY USING THE SAME 审中-公开
标题翻译：用于液晶显示的基板和使用该液晶显示器的液晶显示器
公开(公告)号：US20100066955A1
公开(公告)日：2010-03-18
申请号：US12623192
申请日：2009-11-20
申请人： Atuyuki Hoshino , Shiro Hirota , Naoto Kondo , Tetsuya Fujikawa , Masahiro Kihara , Katsunori Misaki , Seiji Doi , Tomoshige Oda , Akira Komorita , Akihiro Matsui , Manabu Sawasaki , Masahiro Ikeda , Takashi Takagi , Tomonori Tanose , Takuya Saguchi , Hidetoshi Sukenori , Hiroyasu Inoue
发明人： Atuyuki Hoshino , Shiro Hirota , Naoto Kondo , Tetsuya Fujikawa , Masahiro Kihara , Katsunori Misaki , Seiji Doi , Tomoshige Oda , Akira Komorita , Akihiro Matsui , Manabu Sawasaki , Masahiro Ikeda , Takashi Takagi , Tomonori Tanose , Takuya Saguchi , Hidetoshi Sukenori , Hiroyasu Inoue
IPC分类号： G02F1/1335
CPC分类号： G02F1/13458 , G02F1/136227 , G02F1/136286 , G02F2001/136222
摘要： The invention relates to a substrate for use in a liquid crystal display of a CF-on-TFT structure in which a color filter is formed on the side of an array substrate in which a switching element is formed, and has an object to provide a substrate for use in a liquid crystal display, which enables simplification of a manufacturing process typified by a photolithography process and has high reliability. The substrate for use in the liquid crystal display is constructed to include external connection terminals which include first terminal electrodes electrically connected to gate bus lines led out from a plurality of pixel regions arranged on a glass substrate in a matrix form, second terminal electrodes formed of forming material of a pixel electrode and directly on the glass substrate, and electrode coupling regions for electrically connecting the first and the second terminal electrodes, and which electrically connect an external circuit and the gate bus lines.
摘要翻译：本发明涉及一种在TFT-TFT结构的液晶显示器中使用的基板，其中滤色器形成在其中形成有开关元件的阵列基板的侧面上，并且其目的是提供一种用于液晶显示器的基板，其能够简化以光刻工艺为代表的制造工艺，并且具有高可靠性。用于液晶显示器的基板被构造成包括外部连接端子，该外部连接端子包括电连接到以矩阵形式布置在玻璃基板上的多个像素区域引出的栅极总线的第一端子电极，第二端子电极由形成像素电极的材料并且直接在玻璃基板上，以及用于电连接第一和第二端子电极并且将外部电路和栅极总线电连接的电极耦合区域。

6. 发明授权

US08166875B2 Screen printing apparatus and screen printing method 有权
标题翻译：丝网印刷设备和丝网印刷方法
公开(公告)号：US08166875B2
公开(公告)日：2012-05-01
申请号：US12123959
申请日：2008-05-20
申请人： Masafumi Inoue , Fumio Kikutsugi , Masahiro Kihara
发明人： Masafumi Inoue , Fumio Kikutsugi , Masahiro Kihara
IPC分类号： B41M1/12 , H01L21/44
CPC分类号： B41F15/26 , B41F15/0818 , B41F33/0036 , H05K1/0269 , H05K3/0008 , H05K3/1216 , H05K3/3484 , H05K2203/163
摘要： In supply of feedback data to improve a positional deviation quantity and a deviation state of a soldering paste printed on individual substrates held on the carrier, a plurality of average values of individual positional deviation for each of the individual substrates are obtained, and then, if the deviation value ΔM indicating a difference between the maximum value Mmax and the minimum value Mmin of the plurality of average values M of individual positional deviation is less than or equal to the tolerance value Δ(t), an intermediate value of the maximum value Mmax and the minimum value Mmin is obtained, and the positioning parameters of the mask plate and the carrier are corrected based on the intermediate value (Mmax+Mmin)/2.
摘要翻译：在提供反馈数据以改善印刷在保持在载体上的各个基板上的焊膏的位置偏差量和偏移状态时，获得每个单独基板的单独位置偏差的多个平均值，然后，如果指示个体位置偏差的多个平均值M的最大值Mmax与最小值Mmin之间的差的偏差值＆Dgr; M小于或等于公差值＆Dgr;（t），获得最大值Mmax和最小值Mmin，并且基于中间值（Mmax + Mmin）/ 2来校正掩模板和载体的定位参数。

7. 发明申请

US20110292981A1 INFORMATION PROCESSING APPARATUS AND INFORMATION GENERATION METHOD 失效
标题翻译：信息处理装置和信息生成方法
公开(公告)号：US20110292981A1
公开(公告)日：2011-12-01
申请号：US12952492
申请日：2010-11-23
申请人： Masahiro Kihara , Tsutomu Togo
发明人： Masahiro Kihara , Tsutomu Togo
IPC分类号： H04B17/00
CPC分类号： H04N17/004
摘要： An information processing apparatus includes: a reception unit configured to receive a packet string in which packet groups including data on a plurality of video frames and having an identifier indicating a beginning of the video frame assigned to respective packets including each initial part of the plurality of video frames are arranged in a video reproduction order; a counting unit configured to count a number of received packets corresponding to each of the plurality of video frames based on respective initial packets in the packet string; and a generation unit configured to generate video quality estimation information for each of the plurality of video frames to estimate a quality of the video in which the plurality of video frames are decoded on a reception terminal based on the number of received packets corresponding to each of the plurality of video frames.
摘要翻译：一种信息处理装置，包括：接收单元，被配置为接收分组串，其中包括多个视频帧上的数据的分组组，并且具有指示分配给包括多个视频帧的每个初始部分的各个分组的视频帧的开始的标识符视频帧以视频再现顺序排列; 计数单元，被配置为基于所述分组串中的各个初始分组来对与所述多个视频帧中的每一个相对应的接收分组的数量进行计数; 以及生成单元，被配置为针对所述多个视频帧中的每一个产生视频质量估计信息，以基于与每个视频帧对应的接收分组的数量来估计在接收终端上对所述多个视频帧进行解码的视频的质量多个视频帧。

8. 发明授权

US08020286B2 Electronic component mounting system and electronic component mounting method 有权
标题翻译：电子元件安装系统和电子元件安装方法
公开(公告)号：US08020286B2
公开(公告)日：2011-09-20
申请号：US12090274
申请日：2006-12-20
申请人： Masafumi Inoue , Mitsuhaya Tsukamoto , Syoichi Nishi , Masahiro Kihara
发明人： Masafumi Inoue , Mitsuhaya Tsukamoto , Syoichi Nishi , Masahiro Kihara
IPC分类号： H05K3/36 , H05K3/20
CPC分类号： H05K13/082 , Y10T29/49128 , Y10T29/4913 , Y10T29/53174
摘要： One objective of the present invention is to provide an electronic component mounting system and an electronic component mounting method that can prevent a mounting defect due to a positioning error in the direction of the thickness of a substrate, and that can deliver a specific mounting quality. According to an electronic component mounting system, which is constituted by coupling a plurality of apparatuses used for mounting electronic components, the height measurement device 22 of a printing inspection apparatus measures the heights at height measurement points, designated on the upper face of a substrate, and outputs the measurement results as substrate height data. Then, once the substrate has been delivered to an electronic component placing apparatus, the substrate height measurement apparatus again measures the height of the substrate at specific height measurement points to obtain substrate height correction data, and based on the initial substrate height data and the substrate height correction data, updates a control parameter for controlling the component placing operation performed by a loading head. In this manner, discrepancies in the positions of the heights of individual substrates can be accurately corrected, and mounting defects due to positioning errors in the direction of the heights of the substrates can be prevented.
摘要翻译：本发明的一个目的是提供一种电子部件安装系统和电子部件安装方法，其可以防止由于基板的厚度方向上的定位误差引起的安装缺陷，并且可以提供特定的安装质量。根据通过连接多个用于安装电子部件的装置的电子部件安装系统，印刷检查装置的高度测量装置22测量在基板的上表面上指定的高度测量点处的高度，并输出测量结果作为衬底高度数据。然后，一旦基板被输送到电子部件放置装置，基板高度测量装置再次测量特定高度测量点处的基板的高度，以获得基板高度校正数据，并且基于初始基板高度数据和基板高度校正数据，更新用于控制由装载头执行的部件放置操作的控制参数。以这种方式，可以精确地校正单个基板的高度位置的差异，并且可以防止由于基板的高度方向上的定位误差而导致的安装缺陷。

9. 发明申请

US20100071195A1 ELECTRIC COMPONENT MOUNTING SYSTEM AND ELECTRIC COMPONENT MOUNTING METHOD 有权
标题翻译：电气组件安装系统和电气组件安装方法
公开(公告)号：US20100071195A1
公开(公告)日：2010-03-25
申请号：US11813872
申请日：2006-01-20
申请人： Masahiro Kihara , Masafumi Inoue , Wataru Hidese
发明人： Masahiro Kihara , Masafumi Inoue , Wataru Hidese
IPC分类号： B23P19/00
CPC分类号： H05K13/0413 , H05K13/0069 , H05K13/082 , Y10T29/49004 , Y10T29/53174
摘要： To provide an electronic component mounting system and an electronic component mounting method which can prevent a mounting failure due to positional error in a height direction of a substrate and ensure mounting quality.The electronic component mounting system includes a plurality of electronic component mounting devices connected to one another and mounts an electronic component on a substrate to manufacture a mounting substrate. A print test device for testing the substrate after solder printing measures a height position of a height measurement point set on the upper surface of the substrate 4 by a height measuring machine 22 and outputs a measurement result as substrate height data. In a component placing step using an electronic component placing device, a control parameter for controlling a component placing operation of the placing head 32 is updated. Accordingly, it is possible to correct a variation of the height position of an individual substrate and to prevent a mounting failure due to positional error in the height direction of the substrate.
摘要翻译：提供一种能够防止由于基板的高度方向上的位置误差引起的安装故障并确保安装质量的电子部件安装系统和电子部件安装方法。电子部件安装系统包括彼此连接的多个电子部件安装装置，并将电子部件安装在基板上以制造安装基板。用于在焊接印刷之后测试基板的印刷测试装置通过高度测量机22测量设置在基板4的上表面上的高度测量点的高度位置，并输出测量结果作为基板高度数据。在使用电子部件放置装置的部件放置步骤中，更新用于控制放置头32的部件放置操作的控制参数。因此，可以校正单个基板的高度位置的变化，并且可以防止由于基板的高度方向上的位置误差引起的安装故障。

10. 发明申请

US20080289518A1 SCREEN PRINTING APPARATUS AND SCREEN PRINTING METHOD 有权
标题翻译：屏幕打印设备和画面打印方法
公开(公告)号：US20080289518A1
公开(公告)日：2008-11-27
申请号：US12123959
申请日：2008-05-20
申请人： Masafumi Inoue , Fumio Kikutsugi , Masahiro Kihara
发明人： Masafumi Inoue , Fumio Kikutsugi , Masahiro Kihara
IPC分类号： B05C9/08 , B41M1/12
CPC分类号： B41F15/26 , B41F15/0818 , B41F33/0036 , H05K1/0269 , H05K3/0008 , H05K3/1216 , H05K3/3484 , H05K2203/163
摘要： In supply of feedback data to improve a positional deviation quantity and a deviation state of a soldering paste printed on individual substrates held on the carrier, a plurality of average values of individual positional deviation for each of the individual substrates are obtained, and then, if the deviation value ΔM indicating a difference between the maximum value Mmax and the minimum value Mmin of the plurality of average values M of individual positional deviation is less than or equal to the tolerance value Δ(t), an intermediate value of the maximum value Mmax and the minimum value Mmin is obtained, and the positioning parameters of the mask plate and the carrier are corrected based on the intermediate value (Mmax+Mmin)/2.
摘要翻译：在提供反馈数据以改善印刷在保持在载体上的各个基板上的焊膏的位置偏差量和偏移状态时，获得每个单独基板的单独位置偏差的多个平均值，然后，如果指示各个位置偏差的多个平均值M的最大值Mmax与最小值Mmin之间的差的偏差值DeltaM小于或等于公差值Delta（t），最大值Mmax的中间值并且获得最小值Mmin，并且基于中间值（Mmax + Mmin）/ 2来校正掩模板和载体的定位参数。

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