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1. 发明申请

US20200059544A1 ELECTRONIC DEVICE 审中-公开
公开(公告)号：US20200059544A1
公开(公告)日：2020-02-20
申请号：US16484683
申请日：2018-01-31
申请人： Samsung Electronics Co., Ltd.
发明人： Hochul HWANG , Janghoon KANG , Youngbae PARK , Hanbom PARK , Byounguk YOON , Kyunghee LEE , Joonrae CHO
IPC分类号： H04M1/02 , H04R3/00 , H04M1/03 , H04R1/24 , H04R17/00 , H04R9/06
摘要： An electronic device according to various embodiments of the present invention can comprise: a housing including a first plate, a second plate, and a side member surrounding the space between the first plate and the second plate; a processor arranged in the space; a display exposed through a part of the first plate; a communication circuit arranged in the space; a piezoelectric actuator arranged in the space and providing vibration to the first plate; a speaker arranged in the space near the edge of the first plate; an audio processing circuit arranged in the space and electrically connected to the piezoelectric actuator and the speaker; and a memory arranged in the space and electrically connected to the processor. According to various embodiments, when instructions, which can be included by the memory, are executed, the processor wirelessly connects to an external device by using the communication circuit, receives an audio signal through the communication circuit, and provides the audio signal to the audio processing circuit. According to various embodiments, the side member can be separated from or integrated with the second plate. According to various embodiments, the audio processing circuit can provide, to the piezoelectric actuator, a first signal having a first frequency band and can provide, to the speaker, a second frequency band lower than the first frequency band, on the basis of at least a part of the audio signal. Additional various embodiments are possible.

2. 发明公开

US20230336900A1 ELECTRONIC DEVICE COMPRISING MICROPHONE MODULE 审中-公开
公开(公告)号：US20230336900A1
公开(公告)日：2023-10-19
申请号：US18338806
申请日：2023-06-21
申请人： Samsung Electronics Co., Ltd.
发明人： Heejun RYU , Heeseok JUNG , Hanbom PARK , Sunghyup LEE , Sungkeun KOO , Myeongjin KIM , Dongju YEON
IPC分类号： H04R1/02 , G06F1/16 , H04R1/04 , H04R1/08
CPC分类号： H04R1/083 , G06F1/1658 , G06F1/1684 , H04R1/028 , H04R1/04 , H04M1/026 , H04R2499/11
摘要： An electronic device is provided. The electronic device includes a rear plate which includes a first through-hole, a flash member which includes a flash lens and a support structure accommodating the flash lens and including a second through-hole opposite to the rear plate, and at least a part of which is disposed in the first through-hole, a support member which supports the flash member and includes a third through-hole opposite to at least a part of the second through-hole, and a microphone module which is disposed under the support member and covers the third through-hole.

3. 发明申请

US20210144242A1 ELECTRONIC DEVICE HAVING MICROPHONE 有权
公开(公告)号：US20210144242A1
公开(公告)日：2021-05-13
申请号：US17092716
申请日：2020-11-09
申请人： Samsung Electronics Co., Ltd.
发明人： Nakhyun CHOI , Hojong KIM , Hanbom PARK , Sungkeun KOO , Jaeyoung HUH
IPC分类号： H04M1/03 , G06F1/16 , H04R1/04 , H04R1/08
摘要： In accordance with one aspect of the disclosure, an electronic device comprises a plate at least partially forming one surface of a housing and including a first through-hole; a printed circuit board disposed in the housing under the plate, the printed circuit having a second through-hole at least partly overlapping the first through-hole when viewed from above the first surface; a microphone disposed on a surface of the printed circuit board facing away from the plate, and at least partly overlapping the second through-hole when viewed from above the first surface; a seal member that is disposed between the plate and the printed circuit board around the first through-hole or the second through-hole; a support member that includes a first portion that faces the printed circuit board and includes an opening, the opening penetrated by the microphone, and a second portion that extends from the first portion and faces the plate; a first fixture the printed circuit board and the first portion; and a second fixture that is disposed between the plate and the second portion.

4. 发明申请

US20230057510A1 SPEAKER MODULE AND ELECTRONIC DEVICE, INCLUDING THE SAME 有权
公开(公告)号：US20230057510A1
公开(公告)日：2023-02-23
申请号：US17888817
申请日：2022-08-16
申请人： Samsung Electronics Co., Ltd.
发明人： Jihoon PARK , Hanbom PARK , Byunggun CHOI
IPC分类号： G06F1/16 , H04R1/32 , H04R1/28
摘要： An electronic device according to various embodiments of the disclosure includes: a first housing; a second housing configured to be unfolded by a specified angle with respect to the first housing and to rotate about a folding axis; at least one hinge structure including a hinge providing the folding axis and disposed between the first housing and the second housing to rotatably connect the first housing and the second housing; a hinge cover accommodating at least a portion of the hinge structure therein and selectively exposed based on the rotation of the second housing; a first speaker module including a speaker accommodated in the first housing; and a second speaker module including a speaker accommodated in the second housing, wherein in the first state, the first speaker module is configured to discharge sound to the outside of the electronic device via a first area provided in the first housing, a second area provided in the hinge structure and contact with the first area, and a first through-hole extending through the hinge cover, is exposed to the outside in the first state, and is configured to be selectively closed based on the rotation of the second housing.

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