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1. 发明专利

JP2009130353A Substrate treating apparatus 有权
标题翻译：基板处理装置
公开(公告)号：JP2009130353A
公开(公告)日：2009-06-11
申请号：JP2008287905
申请日：2008-11-10
申请人： Semes Co Ltd , セメス株式会社Semes Co., Ltd.
发明人： PARK GI HONG
IPC分类号： H01L21/027 , G02F1/13 , H01L21/304 , H01L21/306
摘要： PROBLEM TO BE SOLVED: To provide a substrate treating apparatus which can control effusion of treating liquid to the outside of a chamber. SOLUTION: The substrate treating apparatus includes: a chamber providing a treatment space of a substrate; a first delivery line arranged in the chamber, extended in a first direction, and in which treating liquid provided from the outside of the chamber to both ends flows; a jetting portion configured to communicate with the first delivery line, extended to the substrate, and jetting the treating liquid toward the substrate; and a drive unit rotating the first delivery line without contacting the first delivery line in order to make the jetting portion swing in a second direction perpendicular to the first direction. Therefore, the substrate treating apparatus uniformly supplies the treating liquid to the whole of the substrate. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够控制处理液体到室外的液体的基板处理装置。基板处理装置包括：提供基板的处理空间的室; 布置在所述腔室中的第一输送管线，沿第一方向延伸，并且其中从所述腔室的外部设置到两端的处理液体流动; 喷射部，被配置为与所述第一输送管线连通，延伸到所述基板，并且将所述处理液体朝向所述基板喷射; 以及驱动单元，其旋转第一输送管线而不接触第一输送管线，以使得喷射部分沿与第一方向垂直的第二方向摆动。因此，基板处理装置将处理液均匀地供给到基板的整体。版权所有（C）2009，JPO＆INPIT

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