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    • 1. 发明授权
    • Organic field effect transistor and semiconductor device
    • 有机场效应晶体管和半导体器件
    • US08362474B2
    • 2013-01-29
    • US13280596
    • 2011-10-25
    • Shinobu FurukawaRyota ImahayashiKaoru Kato
    • Shinobu FurukawaRyota ImahayashiKaoru Kato
    • H01L51/30
    • C07D209/88H01L51/0059H01L51/006H01L51/0061H01L51/0072H01L51/0508
    • It is an object to provide an organic field effect transistor including an electrode which can reduce an energy barrier at an interface between a conductive layer and a semiconductor layer, and a semiconductor device including the organic field effect transistor. A composite layer containing an organic compound and an inorganic compound is provided in at least part of one of a source electrode and a drain electrode in an organic field effect transistor, and as the organic compound, a carbazole derivative represented by the general formula (1) is used. By providing the composite layer in at least part of one of the source electrode and the drain electrode, an energy barrier at an interface between a conductive layer and a semiconductor layer can be reduced.
    • 本发明的目的是提供一种包括能够降低导电层和半导体层之间的界面处的能量势垒的电极的有机场效应晶体管,以及包括该有机场效应晶体管的半导体器件。 在有机场效应晶体管中的源电极和漏电极的至少一部分中设置含有有机化合物和无机化合物的复合层,作为有机化合物,可以使用通式(1)表示的咔唑衍生物 ) 用来。 通过在源电极和漏电极中的至少一部分中提供复合层,可以减少导电层和半导体层之间的界面处的能量势垒。
    • 2. 发明授权
    • Method for reprocessing semiconductor substrate, method for manufacturing reprocessed semiconductor substrate, and method for manufacturing SOI substrate
    • 半导体基板的再加工方法,再加工半导体基板的制造方法以及SOI基板的制造方法
    • US08318588B2
    • 2012-11-27
    • US12859547
    • 2010-08-19
    • Ryota ImahayashiHideto Ohnuma
    • Ryota ImahayashiHideto Ohnuma
    • H01L21/46H01L21/36
    • H01L21/76254H01L21/02024H01L21/02032H01L21/02052H01L21/0206H01L21/30604H01L21/3221
    • It is an object of the invention is to provide a method suitable for reprocessing a semiconductor substrate having favorable planarity. Another object of the invention is to manufacture a reprocessed semiconductor substrate by using the method suitable for reprocessing a semiconductor substrate having favorable planarity, and to manufacture an SOI substrate by using the reprocessed semiconductor substrate. A projecting portion of a semiconductor substrate is removed using a method capable of selectively removing a semiconductor region which is damaged by ion irradiation or the like. Further, an oxide film is formed on a surface of the semiconductor substrate when the semiconductor substrate is planarized by a polishing treatment typified by a CMP method, whereby the semiconductor substrate is evenly polished at a uniform rate. Moreover, a reprocessed semiconductor substrate is manufactured using the aforementioned method, and an SOI substrate is manufactured using the reprocessed semiconductor substrate.
    • 本发明的目的是提供一种适于对具有良好平坦度的半导体衬底进行再加工的方法。 本发明的另一个目的是通过使用适合于对具有良好平面性的半导体衬底进行再处理的方法来制造再处理的半导体衬底,以及通过使用再处理的半导体衬底来制造SOI衬底。 使用能够选择性地去除由离子照射等损坏的半导体区域的方法来去除半导体衬底的突出部分。 此外,当通过以CMP方法为代表的抛光处理使半导体衬底平坦化时,在半导体衬底的表面上形成氧化物膜,由此以均匀的速率均匀地抛光半导体衬底。 此外,使用上述方法制造再处理的半导体衬底,并且使用再处理的半导体衬底制造SOI衬底。