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1. 发明申请

US20120112263A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20120112263A1
公开(公告)日：2012-05-10
申请号：US13351965
申请日：2012-01-17
申请人： Masayuki Tanaka , Daikuse Nishida , Ryota Fujitsuka , Katsuyuki Sekine , Akihito Yamamoto , Katsuaki Natori , Yoshio Ozawa
发明人： Masayuki Tanaka , Daikuse Nishida , Ryota Fujitsuka , Katsuyuki Sekine , Akihito Yamamoto , Katsuaki Natori , Yoshio Ozawa
IPC分类号： H01L29/788
CPC分类号： H01L29/42324 , H01L27/115 , H01L27/11521 , H01L29/7883
摘要： A semiconductor device includes a semiconductor substrate, a first insulating film formed on the semiconductor substrate, a charge storage layer formed on the first insulating film, a second insulating film formed on the charge storage layer, and a control electrode formed on the second insulating film, the second insulating film including a lower silicon nitride film, a lower silicon oxide film formed on the lower silicon nitride film, an intermediate insulating film formed on the lower silicon oxide film and containing a metal element, the intermediate insulating film having a relative dielectric constant of greater than 7, an upper silicon oxide film formed on the intermediate insulating film, and an upper silicon nitride film formed on the upper silicon oxide film.
摘要翻译：半导体器件包括半导体衬底，形成在半导体衬底上的第一绝缘膜，形成在第一绝缘膜上的电荷存储层，形成在电荷存储层上的第二绝缘膜，以及形成在第二绝缘膜上的控制电极，所述第二绝缘膜包括下氮化硅膜，形成在所述下氮化硅膜上的下氧化硅膜，形成在所述下氧化硅膜上并含有金属元素的中间绝缘膜，所述中间绝缘膜具有相对电介质大于7的常数，形成在中间绝缘膜上的上部氧化硅膜和形成在上部氧化硅膜上的上部氮化硅膜。

2. 发明授权

US07635890B2 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US07635890B2
公开(公告)日：2009-12-22
申请号：US11783934
申请日：2007-04-13
申请人： Yoshio Ozawa , Akihito Yamamoto , Masayuki Tanaka , Katsuaki Natori , Katsuyuki Sekine , Daisuke Nishida , Ryota Fujitsuka
发明人： Yoshio Ozawa , Akihito Yamamoto , Masayuki Tanaka , Katsuaki Natori , Katsuyuki Sekine , Daisuke Nishida , Ryota Fujitsuka
IPC分类号： H01L29/76
CPC分类号： H01L29/7883 , H01L27/115 , H01L27/11521 , H01L29/42324
摘要： A semiconductor device includes a semiconductor substrate, a plurality of nonvolatile memory cells provided on the semiconductor substrate, each of the plurality of nonvolatile memory cells comprising a first insulating film provided on the semiconductor substrate, a charge storage layer provided on the first insulating film, a control gate electrode provided above the charge storage layer, a second insulating film provided between the control gate electrode and the charge storage layer, the second insulating film between adjacent charge storage layers including a first region having permittivity lower than that of the second insulating film on a top surface of the charge storage layer in a cross-section view of a channel width direction of the nonvolatile memory cell, and the first region having composition differing from that of the second insulating film on the top surface of the charge storage layer.
摘要翻译：半导体器件包括半导体衬底，设置在半导体衬底上的多个非易失性存储单元，所述多个非易失性存储单元中的每一个包括设置在所述半导体衬底上的第一绝缘膜，设置在所述第一绝缘膜上的电荷存储层，设置在所述电荷存储层上方的控制栅电极，设置在所述控制栅电极和所述电荷存储层之间的第二绝缘膜，所述相邻电荷存储层之间的所述第二绝缘膜包括具有低于所述第二绝缘膜的介电常数的第一区域在电荷存储层的顶表面上，以非易失性存储单元的沟道宽度方向的横截面视图，并且第一区域具有与电荷存储层的顶表面上的第二绝缘膜不同的组成。

3. 发明申请

US20080197403A1 SEMICONDUCTOR DEVICE 失效
标题翻译：半导体器件
公开(公告)号：US20080197403A1
公开(公告)日：2008-08-21
申请号：US12026942
申请日：2008-02-06
申请人： Yoshio OZAWA , Akihito Yamamoto , Katsuaki Natori , Masayuki Tanaka , Katsuyuki Sekine , Daisuke Nishida , Ryota Fujitsuka
发明人： Yoshio OZAWA , Akihito Yamamoto , Katsuaki Natori , Masayuki Tanaka , Katsuyuki Sekine , Daisuke Nishida , Ryota Fujitsuka
IPC分类号： H01L27/115
CPC分类号： H01L21/28273 , H01L27/115 , H01L27/11521 , H01L29/512 , H01L29/513 , H01L29/66825 , H01L29/7881
摘要： A semiconductor device includes a semiconductor substrate, and nonvolatile memory cells, each of the cells including a channel region having a channel length and a channel width, a tunnel insulating film, a floating gate electrode, a control gate electrode, an inter-electrode insulating film between the floating and control gate electrodes, and an electrode side-wall insulating film on side-wall surfaces of the floating and control gate electrodes, the electrode side-wall insulating film including first and second insulating films having first and second dielectric constants, the first dielectric constant being higher than the second dielectric constant, the second dielectric constant being higher than a dielectric constant of a silicon nitride film, the first insulating film being in a central region of a facing region between the floating and control gate electrodes, the second insulating region being in the both end regions of the facing region and protruding from the both end portions.
摘要翻译：半导体器件包括半导体衬底和非易失性存储单元，每个单元包括具有沟道长度和沟道宽度的沟道区，隧道绝缘膜，浮栅电极，控制栅电极，电极间绝缘在浮置控制栅电极和控制栅极电极的侧壁表面之间的电极侧壁绝缘膜，电极侧壁绝缘膜包括具有第一和第二介电常数的第一和第二绝缘膜，所述第一介电常数高于所述第二介电常数，所述第二介电常数高于氮化硅膜的介电常数，所述第一绝缘膜位于所述浮动栅极和控制栅电极之间的面对区域的中心区域中，第二绝缘区域位于面对区域的两端区域中并从两端口突出 ons。

4. 发明申请

US20080014745A1 Method of manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US20080014745A1
公开(公告)日：2008-01-17
申请号：US11727981
申请日：2007-03-29
申请人： Ryota Fujitsuka , Katsuaki Natori , Daisuke Nishida , Masayuki Tanaka , Katsuyuki Sekine , Yoshio Ozawa , Akihito Yamamoto
发明人： Ryota Fujitsuka , Katsuaki Natori , Daisuke Nishida , Masayuki Tanaka , Katsuyuki Sekine , Yoshio Ozawa , Akihito Yamamoto
IPC分类号： H01L21/44
CPC分类号： H01L21/31608 , H01L21/02164 , H01L21/02178 , H01L21/02271 , H01L21/0228 , H01L21/02332 , H01L21/02337 , H01L21/0234 , H01L21/28273 , H01L21/3141 , H01L21/3162 , H01L21/31641 , H01L21/31645 , H01L27/115 , H01L27/11521 , H01L29/66825
摘要： A method of manufacturing a semiconductor device comprising a first insulating film formed on a semiconductor substrate, a charge storage layer formed on the first insulating film, a second insulating film formed on the charge storage layer, and a control electrode formed on the second insulating film, forming the second insulating film comprises forming a lower insulating film containing oxygen and a metal element, thermally treating the lower insulating film in an atmosphere containing oxidizing gas, and forming an upper insulating film on the thermally treated lower insulating film using film forming gas containing at least one of hydrogen and chlorine.
摘要翻译：一种制造半导体器件的方法，包括形成在半导体衬底上的第一绝缘膜，形成在第一绝缘膜上的电荷存储层，形成在电荷存储层上的第二绝缘膜，以及形成在第二绝缘膜上的控制电极形成第二绝缘膜包括形成含有氧和金属元素的下绝缘膜，在含氧化气体的气氛中对下绝缘膜进行热处理，并且在热处理的下绝缘膜上形成上绝缘膜，使用含有氢和氯中的至少一种。

5. 发明授权

US08609487B2 Method of manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US08609487B2
公开(公告)日：2013-12-17
申请号：US12686005
申请日：2010-01-12
申请人： Katsuaki Natori , Masayuki Tanaka , Akihito Yamamoto , Katsuyuki Sekine , Ryota Fujitsuka , Daisuke Nishida , Yoshio Ozawa
发明人： Katsuaki Natori , Masayuki Tanaka , Akihito Yamamoto , Katsuyuki Sekine , Ryota Fujitsuka , Daisuke Nishida , Yoshio Ozawa
IPC分类号： H01L21/336
CPC分类号： H01L27/11568 , H01L27/115 , H01L27/11521
摘要： A method of manufacturing a semiconductor device comprising a first insulating film formed on a semiconductor substrate, a charge storage layer formed on the first insulating film, a second insulating film formed on the charge storage layer, and a control electrode formed on the second insulating film, wherein forming the second insulating film comprises forming an insulating film containing silicon using source gas not containing chlorine, and forming an insulating film containing oxygen and a metal element on the insulating film containing silicon.
摘要翻译：一种制造半导体器件的方法，包括形成在半导体衬底上的第一绝缘膜，形成在第一绝缘膜上的电荷存储层，形成在电荷存储层上的第二绝缘膜，以及形成在第二绝缘膜上的控制电极其中，形成所述第二绝缘膜包括使用不含氯的源气体形成含硅的绝缘膜，以及在含有硅的绝缘膜上形成含有氧和金属元素的绝缘膜。

6. 发明授权

US08278697B2 Semiconductor device and method for manufacturing the same 有权
公开(公告)号：US08278697B2
公开(公告)日：2012-10-02
申请号：US13351965
申请日：2012-01-17
申请人： Masayuki Tanaka , Daisuke Nishida , Ryota Fujitsuka , Katsuyuki Sekine , Akihito Yamamoto , Katsuaki Natori , Yoshio Ozawa
发明人： Masayuki Tanaka , Daisuke Nishida , Ryota Fujitsuka , Katsuyuki Sekine , Akihito Yamamoto , Katsuaki Natori , Yoshio Ozawa
IPC分类号： H01L29/788
CPC分类号： H01L29/42324 , H01L27/115 , H01L27/11521 , H01L29/7883
摘要： A semiconductor device includes a semiconductor substrate, a first insulating film formed on the semiconductor substrate, a charge storage layer formed on the first insulating film, a second insulating film formed on the charge storage layer, and a control electrode formed on the second insulating film, the second insulating film including a lower silicon nitride film, a lower silicon oxide film formed on the lower silicon nitride film, an intermediate insulating film formed on the lower silicon oxide film and containing a metal element, the intermediate insulating film having a relative dielectric constant of greater than 7, an upper silicon oxide film formed on the intermediate insulating film, and an upper silicon nitride film formed on the upper silicon oxide film.

7. 发明授权

US08008152B2 Method of manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US08008152B2
公开(公告)日：2011-08-30
申请号：US11727981
申请日：2007-03-29
申请人： Ryota Fujitsuka , Katsuaki Natori , Daisuke Nishida , Masayuki Tanaka , Katsuyuki Sekine , Yoshio Ozawa , Akihito Yamamoto
发明人： Ryota Fujitsuka , Katsuaki Natori , Daisuke Nishida , Masayuki Tanaka , Katsuyuki Sekine , Yoshio Ozawa , Akihito Yamamoto
IPC分类号： H01L21/00
CPC分类号： H01L21/31608 , H01L21/02164 , H01L21/02178 , H01L21/02271 , H01L21/0228 , H01L21/02332 , H01L21/02337 , H01L21/0234 , H01L21/28273 , H01L21/3141 , H01L21/3162 , H01L21/31641 , H01L21/31645 , H01L27/115 , H01L27/11521 , H01L29/66825
摘要： A method of manufacturing a semiconductor device comprising a first insulating film formed on a semiconductor substrate, a charge storage layer formed on the first insulating film, a second insulating film formed on the charge storage layer, and a control electrode formed on the second insulating film, forming the second insulating film comprises forming a lower insulating film containing oxygen and a metal element, thermally treating the lower insulating film in an atmosphere containing oxidizing gas, and forming an upper insulating film on the thermally treated lower insulating film using film forming gas containing at least one of hydrogen and chlorine.
摘要翻译：一种制造半导体器件的方法，包括形成在半导体衬底上的第一绝缘膜，形成在第一绝缘膜上的电荷存储层，形成在电荷存储层上的第二绝缘膜，以及形成在第二绝缘膜上的控制电极形成第二绝缘膜包括形成含有氧和金属元素的下绝缘膜，在含氧化气体的气氛中对下绝缘膜进行热处理，并且在热处理的下绝缘膜上形成上绝缘膜，使用含有氢和氯中的至少一种。

8. 发明授权

US07927949B2 Semiconductor memory device and method of manufacturing the same 有权
标题翻译：半导体存储器件及其制造方法
公开(公告)号：US07927949B2
公开(公告)日：2011-04-19
申请号：US12755532
申请日：2010-04-07
申请人： Yoshio Ozawa , Isao Kamioka , Junichi Shiozawa , Akihito Yamamoto , Ryota Fujitsuka , Yoshihiro Ogawa , Katsuaki Natori , Katsuyuki Sekine , Masayuki Tanaka , Daisuke Nishida
发明人： Yoshio Ozawa , Isao Kamioka , Junichi Shiozawa , Akihito Yamamoto , Ryota Fujitsuka , Yoshihiro Ogawa , Katsuaki Natori , Katsuyuki Sekine , Masayuki Tanaka , Daisuke Nishida
IPC分类号： H01L21/336 , H01L21/8238 , H01L21/3205 , H01L21/4763
CPC分类号： H01L27/115 , H01L27/11521
摘要： A semiconductor memory device manufacturing method includes forming a floating gate electrode above a semiconductor substrate, forming an interelectrode insulating film above the floating gate electrode, forming a first radical nitride film on a surface of the interelectrode insulating film by first radical nitriding, and forming a control gate electrode on the first radical nitride film.
摘要翻译：一种半导体存储器件制造方法，包括在半导体衬底上形成浮置栅电极，在浮置栅电极上形成电极间绝缘膜，通过第一自由基氮化在电极间绝缘膜的表面上形成第一自由基氮化物膜，第一自由基氮化物膜上的控制栅电极。

9. 发明申请

US20110012190A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20110012190A1
公开(公告)日：2011-01-20
申请号：US12888140
申请日：2010-09-22
申请人： Masayuki Tanaka , Daisuke Nishida , Ryota Fujitsuka , Katsuyuki Sekine , Akihito Yamamoto , Katsuaki Natori , Yoshio Ozawa
发明人： Masayuki Tanaka , Daisuke Nishida , Ryota Fujitsuka , Katsuyuki Sekine , Akihito Yamamoto , Katsuaki Natori , Yoshio Ozawa
IPC分类号： H01L29/68
CPC分类号： H01L29/42324 , H01L27/115 , H01L27/11521 , H01L29/7883
摘要： A semiconductor device includes a semiconductor substrate, a first insulating film formed on the semiconductor substrate, a charge storage layer formed on the first insulating film, a second insulating film formed on the charge storage layer, and a control electrode formed on the second insulating film, the second insulating film including a lower silicon nitride film, a lower silicon oxide film formed on the lower silicon nitride film, an intermediate insulating film formed on the lower silicon oxide film and containing a metal element, the intermediate insulating film having a relative dielectric constant of greater than 7, an upper silicon oxide film formed on the intermediate insulating film, and an upper silicon nitride film formed on the upper silicon oxide film.
摘要翻译：半导体器件包括半导体衬底，形成在半导体衬底上的第一绝缘膜，形成在第一绝缘膜上的电荷存储层，形成在电荷存储层上的第二绝缘膜，以及形成在第二绝缘膜上的控制电极，所述第二绝缘膜包括下氮化硅膜，形成在所述下氮化硅膜上的下氧化硅膜，形成在所述下氧化硅膜上并含有金属元素的中间绝缘膜，所述中间绝缘膜具有相对电介质大于7的常数，形成在中间绝缘膜上的上部氧化硅膜和形成在上部氧化硅膜上的上部氮化硅膜。

10. 发明申请

US20080149932A1 SEMICONDUCTOR DEVICE 失效
标题翻译：半导体器件
公开(公告)号：US20080149932A1
公开(公告)日：2008-06-26
申请号：US11946606
申请日：2007-11-28
申请人： Katsuaki Natori , Katsuyuki Sekine , Daisuke Nishida , Ryota Fujitsuka , Masayuki Tanaka , Kazuaki Nakajima , Yoshio Ozawa , Akihito Yamamoto
发明人： Katsuaki Natori , Katsuyuki Sekine , Daisuke Nishida , Ryota Fujitsuka , Masayuki Tanaka , Kazuaki Nakajima , Yoshio Ozawa , Akihito Yamamoto
IPC分类号： H01L27/115
CPC分类号： H01L27/11521 , H01L21/28273 , H01L27/115 , H01L29/513 , H01L29/7881
摘要： A semiconductor device includes a semiconductor substrate, and a memory cell array provided on the semiconductor substrate and including a plurality of memory cells arranged on the semiconductor substrate, each of the plurality of the memory cells including a first insulating film provided on the semiconductor substrate, a charge storage layer provided on the first insulating film, a second insulating film provided on the charge storage layer, and a control electrode containing metal or metal silicide provided on the charge storage layer via the second insulating film, wherein a corner of a lower part of the control electrode includes semiconductor and fails to contain the metal or the metal silicide in a channel width direction view of the memory cell.
摘要翻译：半导体器件包括半导体衬底和设置在半导体衬底上并且包括布置在半导体衬底上的多个存储单元的存储单元阵列，多个存储单元中的每一个包括设置在半导体衬底上的第一绝缘膜，设置在所述第一绝缘膜上的电荷存储层，设置在所述电荷存储层上的第二绝缘膜，以及经由所述第二绝缘膜设置在所述电荷存储层上的含有金属或金属硅化物的控制电极，的控制电极包括半导体，并且在存储单元的沟道宽度方向视图中不能容纳金属或金属硅化物。

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