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1. 发明申请

WO2015130560A1 GETTER STRUCTURE AND METHOD FOR FORMING SUCH STRUCTURE 审中-公开
标题翻译：形成这种结构的结构和方法
公开(公告)号：WO2015130560A1
公开(公告)日：2015-09-03
申请号：PCT/US2015/016736
申请日：2015-02-20
申请人： RAYTHEON COMPANY
发明人： GOOCH, Roland , KENNEDY, Adam, M. , BLACK, Stephen, H. , KOCIAN, Thomas, Allan , DIEP, Buu
IPC分类号： G01J5/04 , G02B19/00 , H01L23/26
CPC分类号： C23C14/28 , B32B3/10 , B32B15/04 , B32B2255/205 , B32B2457/00 , C23C14/06 , G01J5/045 , H01L23/26 , H01L2924/0002 , Y10T428/24802 , H01L2924/00
摘要： A getter structure and method wherein a layer of seed material is deposited on a predetermined region of a surface of a structure under conditions to form a plurality of nucleation sites on a surface of the structure. The nucleation sites have an average height over the surface area of the predetermined region of less than one molecule thick. Subsequently a getter material is deposited over the surface to form a plurality of getter material members projecting outwardly from the nucleation sites.
摘要翻译：一种吸气剂结构和方法，其中在结构的表面上形成多个成核位置的条件下，将种子材料层沉积在结构表面的预定区域上。成核位置具有小于一分子厚的预定区域的表面积的平均高度。随后，吸气剂材料沉积在表面上以形成从成核位置向外突出的多个吸气材料构件。

2. 发明申请

WO2012154575A1 USING A MULTI-CHIP SYSTEM IN A PACKAGE (MCSiP) IN IMAGING APPLICATIONS TO YIELD A LOW COST, SMALL SIZE CAMERA ON A CHIP 审中-公开
标题翻译：在包装中使用多芯片系统（MCSiP）在成像应用中成本低成本，小尺寸相机在芯片上
公开(公告)号：WO2012154575A1
公开(公告)日：2012-11-15
申请号：PCT/US2012/036557
申请日：2012-05-04
申请人： RAYTHEON COMPANY , KENNEDY, Adam , BLACK, Stephen, H. , BAUR, Stefan, T.
发明人： KENNEDY, Adam , BLACK, Stephen, H. , BAUR, Stefan, T.
IPC分类号： H04N5/33 , H04N5/335 , H04N5/225
CPC分类号： H04N5/2257 , H01L27/14618 , H01L2224/48091 , H01L2224/48465 , H04N5/33 , H04N5/335 , H01L2924/00014 , H01L2924/00
摘要： According to some embodiments, a camera includes a multi-chip system in a package (MCSiP). The MCSiP comprising a set of electronics, an encapsulate, and a plurality of interconnects. The set of electronics includes a plurality of bare integrated circuit dies and other passive or active electronic components. Each die is operable to provide a functional component of a computing system operable to receive a signal describing electromagnetic radiation detected by an imaging sensor and facilitate generating an image according to the signal. The encapsulate comprises an adhesive molding compound deposited outwardly from the set of electronics in order to hold the set of electronics in position. The interconnects communicatively couple each die to other dies, the other electronic components, or components external to the MCSiP.
摘要翻译：根据一些实施例，相机包括封装（MCSiP）中的多芯片系统。 MCSiP包括一组电子器件，封装和多个互连。该组电子器件包括多个裸露集成电路管芯和其它无源或有源电子部件。每个管芯可操作以提供计算系统的功能部件，其可操作以接收描述由成像传感器检测到的电磁辐射的信号，并且便于根据该信号生成图像。包封物包括从该组电子装置向外沉积的粘合剂模塑料，以便将该组电子器件保持就位。互连通信地将每个管芯耦合到其它管芯，其它电子部件或MCSiP外部的部件。

3. 发明申请

WO2014099123A1 GETTER STRUCTURE FOR WAFER LEVEL VACUUM PACKAGED DEVICE 审中-公开
标题翻译：水平真空包装设备的结构
公开(公告)号：WO2014099123A1
公开(公告)日：2014-06-26
申请号：PCT/US2013/065883
申请日：2013-10-21
申请人： RAYTHEON COMPANY
发明人： GOOCH, Roland , KENNEDY, Adam, M. , BLACK, Stephen, H. , KOCIAN, Thomas, Allan , DIEP, Buu
IPC分类号： G01J5/02 , G01J5/04 , H01L23/26 , G01J5/08 , B81B7/00
CPC分类号： H01L31/0203 , B81B7/0038 , G01J5/0285 , G01J5/045 , G01J5/0875 , H01L23/26 , H01L27/14618 , H01L27/14649 , H01L2924/0002 , Y10T29/4998 , Y10T428/24521 , H01L2924/00
摘要： A wafer level vacuum packaged (WLVP) device having a first substrate having an array of detectors and a second substrate bonded to the first substrate having a plurality of protrusions and a plurality of getter material members projecting outwardly from a sidewall of the protrusions members are disposed at oblique angles to the sidewalls and have ends extending into gaps between the protrusions. The device is formed by: forming protrusions into a surface of a substrate; and depositing getter material by physical vapor deposition from an evaporating source of the getter material at an oblique angle to the sidewalls, atoms of the getter material initially forming nucleation sites on the sidewalls with subsequent atoms attaching to the nucleation sites and shadowing area surrounding each nucleation site, the getter material thereby growing into structures towards the evaporating source.
摘要翻译：晶片级真空封装（WLVP）器件具有具有检测器阵列的第一衬底和与第一衬底接合的第二衬底，其具有多个突起和从突出构件的侧壁向外突出的多个吸气材料构件与侧壁成倾斜的角度并且具有延伸到突起之间的间隙的端部。该装置通过以下方式形成：将突起形成在基板的表面中; 并且通过物理气相沉积从吸气材料的蒸发源以与侧壁倾斜的角度沉积吸气剂材料，吸气材料的原子最初在侧壁上形成成核位点，随后的原子附着于成核位置和围绕每个成核的阴影区域吸气剂材料因此生长成朝向蒸发源的结构。

4. 发明申请

WO2014031200A1 METHOD OF STRESS RELIEF IN ANTI-REFLECTIVE COATED CAP WAFERS FOR WAFER LEVEL PACKAGED INFRARED FOCAL PLANE ARRAYS 审中-公开
标题翻译：用于水平包装的红外焦平面阵列的抗反射涂层盖子中的应力消除方法
公开(公告)号：WO2014031200A1
公开(公告)日：2014-02-27
申请号：PCT/US2013/042649
申请日：2013-05-24
申请人： RAYTHEON COMPANY
发明人： GOOCH, Roland, W. , DIEP, Buu, Q. , BLACK, Stephen, H. , KOCIAN, Thomas, A. , KENNEDY, Adam, M.
IPC分类号： B81C1/00 , B81B7/00
CPC分类号： B81C1/00325 , B05D5/061 , B81B7/0067 , B81B2201/0207 , B81C2203/0118
摘要： Methods for reducing wafer bow induced by an anti -reflective coating of a cap wafer are provided. The method may utilize a shadow mask having at least one opening therein that is positioned opposite recessed regions in a cap wafer. The method may further include depositing at least one layer of an anti-reflective coating material through the shadow mask onto a planar side of a cap wafer to provide a discontinuous coating on the planar side.
摘要翻译：提供了通过盖晶片的防反射涂层引起的减少晶片弓的方法。该方法可以利用其中具有至少一个开口的荫罩，其位于帽晶片中的相对凹陷区域。该方法还可以包括将至少一层抗反射涂层材料通过荫罩沉积到盖晶片的平面侧上，以在平面侧上提供不连续的涂层。

5. 发明申请

WO2009055102A3 A SYSTEM AND METHOD FOR VIEWING AN AREA USING AN OPTICAL SYSTEM POSITIONED INSIDE OF A DEWAR 审中-公开
公开(公告)号：WO2009055102A3
公开(公告)日：2009-04-30
申请号：PCT/US2008/069135
申请日：2008-07-03
申请人： RAYTHEON COMPANY , GIBBONS, Robert, C. , BLACK, Stephen, H. , MULLINS, Richard, N.
发明人： GIBBONS, Robert, C. , BLACK, Stephen, H. , MULLINS, Richard, N.
IPC分类号： G01J5/06 , G01J5/08 , G02B27/62
摘要： According to one embodiment of the present invention, a system for viewing an area includes a dewar and an optical system positioned within the dewar. The dewar permits operation of the flux detector at cryogenic temperatures, in some embodiments. The optical system includes an infrared radiation system capable of focusing one or more light beams. The inclusion of the optical system within the cryogenic space of the dewar allows reduction of the overall system length and weight, if desired.

6. 发明申请

WO2016024946A1 HERMETICALLY SEALED PACKAGE HAVING STRESS REDUCING LAYER 审中-公开
标题翻译：具有应力减少层的人造密封包装
公开(公告)号：WO2016024946A1
公开(公告)日：2016-02-18
申请号：PCT/US2014/050589
申请日：2014-08-11
申请人： RAYTHEON COMPANY
发明人： KENNEDY, Adam, M. , DIEP, Buu, Q. , BLACK, Stephen, H. , WONG, Tse, E. , KOCIAN, Thomas, Allan , TRACY, Gregory, D.
IPC分类号： B81C1/00 , H01L23/10 , H01L23/00
CPC分类号： H01L23/10 , B81B7/0051 , B81B2201/0207 , B81C2203/0109 , B81C2203/035 , H01L23/562 , H01L2924/0002 , H01L2924/00
摘要： A sealed package having a device 102 disposed on a wafer structure and a lid structure 108 bonded to the device wafer. The device wafer includes: a substrate 104; a metal ring 107DW disposed on a surface portion of substrate around the device and a bonding material 118 disposed on the metal ring. A first layer of the metal ring includes a stress relief buffer layer 109DW having a higher ductility than that of the surface portion of the substrate and a width greater than the width of the bonding material. The metal ring extends laterally beyond at least one of the inner and outer edges of the bonding material. The stress relief buffer layer has a coefficient of thermal expansion greater than the coefficient of expansion of the surface portion of the substrate and less than the coefficient of expansion of the bonding material.
摘要翻译：密封包装，其具有设置在晶片结构上的装置102和结合到装置晶片的盖结构108。器件晶片包括：衬底104; 设置在设备周围的基板的表面部分上的金属环107DW和设置在金属环上的接合材料118。金属环的第一层包括具有比衬底的表面部分更高的延展性的应力消除缓冲层109DW以及大于接合材料的宽度的宽度。金属环横向延伸超出接合材料的内边缘和外边缘中的至少一个。应力消除缓冲层的热膨胀系数大于衬底表面部分的膨胀系数，小于接合材料的膨胀系数。

7. 发明申请

WO2013180908A1 INFRARED THERMAL IMAGING SYSTEM AND METHOD 审中-公开
标题翻译：红外热成像系统及方法
公开(公告)号：WO2013180908A1
公开(公告)日：2013-12-05
申请号：PCT/US2013/039830
申请日：2013-05-07
申请人： RAYTHEON COMPANY
发明人： KUIKEN, Matthew, T. , BLACK, Stephen, H.
IPC分类号： H04N5/33 , H04N5/365
CPC分类号： H04N5/33 , H04N5/23293 , H04N5/3651
摘要： An infrared thermal imaging system includes a focal plane array (FPA) of infrared detectors, read out integrated circuitry (ROIC) operatively coupled to the FPA, and a microcontroller having at least one video display interface operatively coupled to the ROIC. The FPA is configured to generate an output signal in response to infrared radiation impinging upon the infrared detectors. The microcontroller is configured to send data to the ROIC via the at least one video display interface, the data including non-uniformity correction terms for correcting non-uniformities of the FPA.
摘要翻译：红外热成像系统包括红外检测器的焦平面阵列（FPA），读出可操作地耦合到FPA的集成电路（ROIC）以及具有可操作地耦合到ROIC的至少一个视频显示接口的微控制器。 FPA被配置为响应于照射在红外检测器上的红外辐射而产生输出信号。微控制器被配置为经由至少一个视频显示接口向ROIC发送数据，该数据包括用于校正FPA的不均匀性的非均匀性校正项。

8. 发明申请

WO2013123350A1 METHOD AND APPARATUS FOR INHIBITING DIVERSION OF DEVICES USING AN EMBEDDED ACCELEROMETER 审中-公开
标题翻译：使用嵌入式加速度计抑制装置分流的方法和装置
公开(公告)号：WO2013123350A1
公开(公告)日：2013-08-22
申请号：PCT/US2013/026379
申请日：2013-02-15
申请人： RAYTHEON COMPANY
发明人： BLACK, Stephen, H. , MASINI, Paolo
IPC分类号： G01P15/08 , G08B21/00
CPC分类号： H04N5/23241 , G01J1/0228 , G01J2001/0257 , G01P15/00 , G01P15/0891 , H04N5/33
摘要： According to one aspect, embodiments herein provide a sensing device comprising an accelerometer configured to monitor acceleration of the sensing device and provide acceleration information including a value of the acceleration of the sensing device, and an Integrated Circuit (IC) coupled to the accelerometer, the IC configured to receive the acceleration information from the accelerometer and render the sensing device permanently inoperable in response to the value of the acceleration of the sensing device exceeding a threshold indicative of a military application of the sensing device.
摘要翻译：根据一个方面，本文的实施例提供一种感测装置，其包括加速度计，该加速度计被配置为监测感测装置的加速度并提供包括感测装置的加速度值的加速度信息，以及耦合到加速度计的集成电路（IC） IC被配置为从加速度计接收加速度信息并且使得感测装置响应于感测装置的加速度的值超过表示感测装置的军事应用的阈值而永久地不可操作。

9. 发明申请

WO2017069804A1 USE OF AN EXTERNAL GETTER TO REDUCE PACKAGE PRESSURE 审中-公开
标题翻译：使用外部吸尘器来降低包装压力
公开(公告)号：WO2017069804A1
公开(公告)日：2017-04-27
申请号：PCT/US2016/033219
申请日：2016-05-19
申请人： RAYTHEON COMPANY
发明人： BLACK, Stephen, H. , KENNEDY, Adam, M.
IPC分类号： H01L23/26 , H01L23/053
CPC分类号： H01L23/26 , H01L21/3221 , H01L21/3225 , H01L21/4817 , H01L21/54 , H01L23/041 , H01L23/10
摘要： A system and method for forming a wafer level package. In one example, a substrate used in the wafer level package includes a surface defined by a wafer level package (WLP) region and an external region, and a layer of getter material is disposed on at least a portion of the external region. According to one embodiment, the external region comprises a saw-to-reveal (STR) region of the wafer.
摘要翻译：一种用于形成晶圆级封装的系统和方法。在一个示例中，用于晶片级封装中的衬底包括由晶片级封装（WLP）区域和外部区域限定的表面，并且吸收剂材料层设置在外部区域的至少一部分上。根据一个实施例，外部区域包括晶片的锯 - 透露（STR）区域。

10. 发明申请

WO2015088771A1 METHOD OF FORMING DEPOSITED PATTERNS ON A SURFACE 审中-公开
标题翻译：在表面形成沉积图案的方法
公开(公告)号：WO2015088771A1
公开(公告)日：2015-06-18
申请号：PCT/US2014/067285
申请日：2014-11-25
申请人： RAYTHEON COMPANY
发明人： GOOCH, Roland , KOCIAN, Thomas, Allan , DIEP, Buu , KENNEDY, Adam, M. , BLACK, Stephen, H.
IPC分类号： B81C1/00
CPC分类号： H01L31/18 , B81C1/00373 , B81C2201/0188 , H01L31/02327
摘要： A method for forming a coating of material on selected portions of a surface of a substrate having a plurality of cavities (11) includes: providing a structure (16) having a release agent (18) thereon; contacting a top surface (17) of the wafer (10) with the release agent to transfer portions of the release agent to the top surface of the wafer while bottom portions of the cavities remain spaced from the release agent to produce an intermediate structure (24); the release agent disposed on the top surface of the wafer and with the bottom portions of the cavities void of the release agent; exposing the intermediate structure to the material (27) to blanket coat the material on both the release agent and the bottom portions of the cavities; and selectively removing the release agent together with the coating material while leaving the coating material on the bottom portions of the cavities.
摘要翻译：在具有多个空腔（11）的基板的表面的选定部分上形成材料涂层的方法包括：提供在其上具有脱模剂（18）的结构（16）; 使所述晶片（10）的顶表面（17）与所述脱模剂接触以将所述脱模剂的部分转移到所述晶片的顶表面，同时所述空腔的底部保持与所述脱模剂间隔开以产生中间结构（24 ）; 所述脱模剂设置在所述晶片的顶表面上，并且所述空腔的底部部分脱离所述脱模剂; 将所述中间结构暴露于所述材料（27）以将所述材料涂覆在所述空腔的所述脱模剂和所述底部两者上; 并且与涂料一起选择性地除去脱模剂，同时将涂料留在空腔的底部。

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