专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

EP1017221B1 IMAGE SENSOR SUBSTRATE AND IMAGE SENSOR EMPLOYING IT 有权
标题翻译：基板图像传感器和使用该摄像元件的ENDER
公开(公告)号：EP1017221B1
公开(公告)日：2008-12-17
申请号：EP98940659.0
申请日：1998-08-31
申请人： ROHM CO., LTD.
发明人： SAKO, Teruhisa, Rohm Co., Ltd. , HAYASHI, Hiroaki, Rohm Co., Ltd. , YOKOYAMA, Eiji, Rohm Co., Ltd.
IPC分类号： H04N1/028 , H01L27/14 , H01L27/146 , H01L31/0232
CPC分类号： H04N1/0318 , H01L27/14623 , H01L27/14678 , H01L31/02325 , H04N1/02815 , H04N1/02835 , H04N1/02885 , H04N2201/02456 , H04N2201/02472 , H04N2201/02485 , H04N2201/02493 , H04N2201/03112 , H04N2201/03125 , H04N2201/03141 , H04N2201/03145
摘要： An image sensor according to the present invention includes a casing (4), a light source disposed in the casing (4) for emitting light toward an object (K) to be read, and an image sensor board (6) provided, on an obverse surface thereof, with a plurality of light receiving elements (52) for generating image signals upon receiving light reflected by the object (K). The image sensor board (6) is disposed so that the obverse surface thereof is directed inwardly of the casing (4). The substrate (6) is provided with a light shielding layer (61) for covering the reverse surface of the substrate at least entirely over a portion of the obverse surface where the plurality of light receiving elements (52) are mounted, so that disturbing external light is prevented from entering inside the casing (4).

2. 发明公开

EP1017221A1 IMAGE SENSOR SUBSTRATE AND IMAGE SENSOR EMPLOYING IT 有权
标题翻译： SUBSTREFÜREINEN BILDSENSOR UND DIESES GEBRAUCHENDER BILDSENSOR
公开(公告)号：EP1017221A1
公开(公告)日：2000-07-05
申请号：EP98940659.0
申请日：1998-08-31
申请人： Rohm Co., Ltd.
发明人： SAKO, Teruhisa, Rohm Co., Ltd. , HAYASHI, Hiroaki, Rohm Co., Ltd. , YOKOYAMA, Eiji, Rohm Co., Ltd.
IPC分类号： H04N1/028 , H01L27/14
CPC分类号： H04N1/0318 , H01L27/14623 , H01L27/14678 , H01L31/02325 , H04N1/02815 , H04N1/02835 , H04N1/02885 , H04N2201/02456 , H04N2201/02472 , H04N2201/02485 , H04N2201/02493 , H04N2201/03112 , H04N2201/03125 , H04N2201/03141 , H04N2201/03145
摘要： An image sensor according to the present invention includes a casing (4), a light source disposed in the casing (4) for emitting light toward an object (K) to be read, and an image sensor board (6) provided, on an obverse surface thereof, with a plurality of light receiving elements (52) for generating image signals upon receiving light reflected by the object (K). The image sensor board (6) is disposed so that the obverse surface thereof is directed inwardly of the casing (4). The substrate (6) is provided with a light shielding layer (61) for covering the reverse surface of the substrate at least entirely over a portion of the obverse surface where the plurality of light receiving elements (52) are mounted, so that disturbing external light is prevented from entering inside the casing (4).
摘要翻译：根据本发明的图像传感器包括壳体（4），设置在壳体（4）中以朝向要读取的物体（K）发射光的光源，以及设置在其上的图像传感器板（6）具有多个光接收元件（52），用于在接收到由物体（K）反射的光时产生图像信号。图像传感器板（6）被设置为使得其正面指向壳体（4）的内部。衬底（6）设置有遮光层（61），用于至少整个地覆盖安装多个光接收元件（52）的正面的一部分上的基板的反面，使得外部干扰防止光进入壳体（4）内部。

3. 发明公开

EP0999065A1 CONSTRUCTION OF THERMAL PRINT HEAD AND METHOD OF FORMING PROTECTIVE COATING 失效
标题翻译：高压头：用于形成保护涂层和方法
公开(公告)号：EP0999065A1
公开(公告)日：2000-05-10
申请号：EP98933901.5
申请日：1998-07-22
申请人： Rohm Co., Ltd.
发明人： HAYASHI, Hiroaki, Rohm Co., Ltd. , YOKOYAMA, Eiji, Rohm Co., Ltd. , YAMADE, Takumi, Rohm Co., Ltd.
IPC分类号： B41J2/335
CPC分类号： B41J2/3353 , B41J2/3355 , B41J2/3357 , B41J2/3359
摘要： A thermal printhead includes a head substrate (1), a heating resistor (5) provided on the head substrate, a plurality of individual electrodes (2) connected to the heating resistor, and a common electrode (3) connected to the heating resistor. The thermal printhead is further provided with a first coating layer (6) covering the heating resistor, the individual electrodes and the common electrode, and a second coating layer (7) which is formed on the first coating layer and made of sialon containing a conductive material as an additive. The first coating layer is formed with at least one through-hole (6a) or notch (6a'), so that the second coating layer is electrically connected to the common electrode via the through-hole or the notch.
摘要翻译：一种热打印头包括一个头衬底（1），（5）设置在头基板，单独电极的多个（2）连接到加热电阻器的加热电阻器，和公共电极（3）连接到加热电阻器。热敏打印头还设置有覆盖所述加热电阻，独立电极和共用电极，以及第二涂敷层（7）的所有其上形成有第一涂层上且由赛隆含有导电的第一涂层（6）材料作为添加剂。第一涂层上形成具有至少一个通孔（6a）中或凹口（6a）中，所以没有第二涂层电连接到通过通孔或凹口的公共电极。

4. 发明授权

EP1052102B1 THERMAL PRINTING HEAD AND PROTECTIVE COVER USED FOR THE SAME 有权
标题翻译：热打印头和用于该打印头的防护盖
公开(公告)号：EP1052102B1
公开(公告)日：2010-04-21
申请号：EP99901905.2
申请日：1999-01-28
申请人： ROHM CO., LTD.
发明人： NAGAHATA, Takaya, Rohm Co., Ltd. , YOSHIKAWA, Yasuhiro, Rohm Co., Ltd. , YOKOYAMA, Eiji, Rohm Co., Ltd.
IPC分类号： B41J2/335
CPC分类号： B41J2/335 , B41J2/345

5. 发明公开

EP1052102A1 THERMAL PRINTING HEAD AND PROTECTIVE COVER USED FOR THE SAME 有权
标题翻译：热打印头和用于该打印头的防护盖
公开(公告)号：EP1052102A1
公开(公告)日：2000-11-15
申请号：EP99901905.2
申请日：1999-01-28
申请人： Rohm Co., Ltd.
发明人： NAGAHATA, Takaya, Rohm Co., Ltd. , YOSHIKAWA, Yasuhiro, Rohm Co., Ltd. , YOKOYAMA, Eiji, Rohm Co., Ltd.
IPC分类号： B41J2/335
CPC分类号： B41J2/335 , B41J2/345
摘要： A protective cover (9) is provided which is used for a thermal printhead including a heat sink plate (1) formed with a plurality of fixing holes (10), a head substrate (2), and a circuit board (3). The heat sink plate (1) is formed with a groove (1a) which divides the upper surface of the heat sink plate (1) into a first region (1b) and a second region (1c). The head substrate (2) is provided with a heating resistor (4) and drive ICs (5). The drive ICs (5) are covered with a coating resin layer (6). The circuit board (3) is formed with through-holes (11). The protective cover (9) includes a main body (9a) having an obverse surface and a reverse surface, and a plurality of pins (12) extending from the reverse surface. Each of the pins (12) is formed with a slit (12a), which facilitates press-fitting of the pin (12) into a respective one of the fixing holes (10).
摘要翻译：提供一种用于包括形成有多个固定孔（10）的散热板（1），头基板（2）和电路板（3）的热敏打印头的保护盖（9）。散热板（1）形成有将散热板（1）的上表面分成第一区域（1b）和第二区域（1c）的槽（1a）。头基板（2）设置有加热电阻器（4）和驱动IC（5）。驱动IC（5）被覆盖树脂层（6）覆盖。电路板（3）形成有通孔（11）。保护罩（9）包括具有正面和背面的主体（9a）以及从背面延伸的多个销（12）。每个销（12）形成有狭缝（12a），其便于将销（12）压配合到相应的一个固定孔（10）中。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式