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    • 5. 发明公开
    • ELECTROSTATIC PROTECTION FOR STACKED MULTI-CHIP INTEGRATED CIRCUITS
    • ELEKTROSTATISCHER SCHUTZFÜRGESTAPELTE INTEGRIERTE SCHALTUNGEN MIT MEHREREN CHIPS
    • EP2904638A1
    • 2015-08-12
    • EP13779997.9
    • 2013-10-03
    • Qualcomm Incorporated
    • HENDERSON, Brian M.TAN, Chiew-GuanUVIEGHARA, Gregory A.JALILIZEINALI, Reza
    • H01L23/60H01L23/525H01L25/065H01L25/00
    • One feature pertains to a multi-chip module that comprises at least a first integrated circuit (IC) die and a second IC die. The second IC die has an input/output (I/O) node electrically coupled to the first IC die by a through substrate via. The second die's active surface also includes a fuse that is electrically coupled to the I/O node and adapted to protect the second IC die from damage caused by an electrostatic discharge (ESD). In particular, the fuse protects the second IC die from ESD that may be generated as a result of electrically coupling the first die to the second die during the manufacturing of the multi-chip module. Upon coupling the first die to the second die, the fuse may bypass the ESD current generated by the ESD to ground. After packaging of the multi-chip module is complete, the fuse may be blown open.
    • 一个特征涉及至少包括第一集成电路(IC)管芯和第二IC管芯的多芯片模块。 第二IC芯片具有通过基板通孔电耦合到第一IC裸片的输入/输出(I / O)节点。 第二管芯的有源表面还包括电耦合到I / O节点并且适于保护第二IC管芯免受静电放电(ESD)引起的损坏的熔丝。 特别地,保险丝保护第二IC芯片免受可能由于在制造多芯片模块期间将第一裸片电耦合到第二裸片而产生的ESD。 在将第一管芯耦合到第二管芯时,熔丝可以将由ESD产生的ESD电流旁路到地。 多芯片模块封装完成后,保险丝可能会断开。
    • 7. 发明申请
    • SINGLE-LINE PMIC-HOST LOW-LEVEL CONTROL INTERFACE
    • 单线PMIC-HOST低电平控制接口
    • WO2017099937A1
    • 2017-06-15
    • PCT/US2016/061392
    • 2016-11-10
    • QUALCOMM INCORPORATED
    • MISHRA, LalanCHUN, Chrisotpher Kong YeeTAN, Chiew-GuanLEE, GordonSUTTON, Todd
    • G06F13/42
    • H04L47/12G06F13/4278G06F13/4295H04L5/14H04L49/109H04W28/0221H04W52/0229Y02D70/122Y02D70/26
    • System, methods, and apparatus are described that facilitate signaling between devices over a single bi-directional line. In an example, the apparatus couples a first device to a second device via a single bi-directional line, indicates initiation of a first action, initiated at the first device, by sending a first single transition on the single bi-directional line from the first device to the second device, and indicates initiation of a second action, initiated at the second device, by sending a second single transition on the single bi-directional line from the second device to the first device. In another example, a first device initiates a first action, indicates initiation of the first action by generating a first event on a single bi-directional line, and receives an indication of a second action initiated at a second device by observing a second event on the single bi-directional line.
    • 描述了便于在单个双向线路上的设备之间的信令的系统,方法和设备。 在一个示例中,该设备经由单个双向线路将第一设备耦合到第二设备,通过在单个双向线路上从第一设备发起的第一单动态转换指示在第一设备处发起的第一动作的发起 并且指示在所述第二设备处发起的通过在所述单个双向线上从所述第二设备向所述第一设备发送第二单个转换的第二动作的发起。 在另一示例中,第一设备发起第一动作,通过在单个双向线上生成第一事件来指示第一动作的发起,并且通过观察第二事件在第二设备处发起的第二动作的指示 单一的双向线。