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    • 6. 发明申请
    • IN-SITU SPUTTERING APPARATUS
    • 现场飞溅设备
    • WO2014133565A1
    • 2014-09-04
    • PCT/US2013/035374
    • 2013-04-05
    • POOLE VENTURA, INC.
    • ERICKSON, Mark, R.POOLE, Henry, J.CUSTER, Arthur, W.
    • C23C14/34
    • C23C14/046C23C14/35C23C14/351H01J37/32669
    • A sputtering apparatus (100) that includes at least a target (164) presented as an inner surface of a confinement structure (166), the inner surface of the confinement structure is preferably an internal wall of a circular tube. A cathode (102, 104) is disposed adjacent the internal wall of the circular tube. The cathode preferably provides a hollow core, within which a magnetron is disposed. Preferably, an actuator (168, 170, 196) is attached to the magnetron, wherein a position of the magnetron within the hollow core is altered upon activation of the actuator. Additionally, a carriage (112) supporting the cathode and communicating with the target is preferably provided, and a cable bundle (120) interacting with the cathode and linked to a cable bundle take up mechanism (146) provided power and coolant to the cathode, magnetron, actuator and an anode (108) of the sputtering apparatus.
    • 至少包括作为限制结构(166)的内表面的靶(164)的溅射装置(100),限制结构的内表面优选为圆管的内壁。 阴极(102,104)邻近圆管的内壁设置。 阴极优选地提供中空芯,其中设置有磁控管。 优选地,致动器(168,170,196)附接到磁控管,其中在激活致动器时磁控管在中空芯内的位置被改变。 此外,优选地设置支撑阴极并与靶连通的托架(112),并且与阴极相互作用并连接到电缆束卷取机构(146)的电缆束(120)向阴极提供电源和冷却剂, 磁控管,致动器和溅射装置的阳极(108)。
    • 10. 发明申请
    • IN-SITU SPUTTERING APPARATUS
    • 现场飞溅设备
    • WO2014143078A1
    • 2014-09-18
    • PCT/US2013/035384
    • 2013-04-05
    • POOLE VENTURA, INC.
    • ERICKSON, Mark, R.POOLE, Henry, J.CUSTER, Arthur, W.JAMSHIDI, NaderHERSHCOVITCH, Ady
    • C23C14/34
    • C23C14/35C23C14/046H01J37/32394H01J37/3405H01J37/3435H01J37/3438H01J37/3444
    • Λ sputtering apparatus (100) that includes at least a target (164) presented as an inner surface of a confinement structure (166), the inner surface of the confinement structure is preferably an internal wall of a circular tube. A cathode (102. 104) is disposed adjacent the internal wall of the circular tube. The cathode preferably provides a hollow core, within which a magnetron is disposed. Preferably, an actuator (168, 170, 196, 256) is attached to the magnetron, wherein a position of the magnetron within the hollow core is altered upon activation of the actuator. Additionally, a carriage (112, 222) supporting the cathode and communicating with the target is preferably provided, and a cable bundle (120, 220) interacting with the cathode and linked to a cable bundle take up mechanism (146) provides power and coolant to the cathode, magnetron, actuator and an anode (108) of the sputtering apparatus.
    • Λ溅射装置(100)至少包括作为限制结构(166)的内表面的靶(164),限制结构的内表面优选为圆管的内壁。 阴极(102.104)被设置成邻近圆管的内壁。 阴极优选地提供中空芯,其中设置有磁控管。 优选地,致动器(168,170,196,256)附接到磁控管,其中在激活致动器时磁控管在中空芯内的位置被改变。 此外,优选地提供支撑阴极并与靶连通的托架(112,222),并且与阴极相互作用并连接到电缆束卷取机构(146)的电缆束(120,220)提供电力和冷却剂 到阴极,磁控管,致动器和溅射装置的阳极(108)。