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1. 发明申请

WO2014142975A1 THERMAL DIFFUSION CHAMBER WITH CONVECTION COMPRESSOR 审中-公开
标题翻译：带膨胀压缩机的热扩散室
公开(公告)号：WO2014142975A1
公开(公告)日：2014-09-18
申请号：PCT/US2013/032132
申请日：2013-03-15
申请人： POOLE VENTURA, INC.
发明人： ERICKSON, Mark, R. , POOLE, Henry, J. , JAMSHIDI, Nader , CUSTER, Arthur, W. , DINGUS, Aaron, L.
IPC分类号： F28F27/00
CPC分类号： F27B5/04 , F27B5/14 , F27B5/18 , F27B17/0016 , F27B17/0025 , F27B17/0075 , F27D19/00 , F27D21/00 , F28D1/0477 , F28D2021/0077 , F28F1/32
摘要： Preferably, a frame (104) supporting a containment chamber ( 102), with a sealed process chamber (168) confined within the containment chamber, and at least one fluid inlet structure (112) in fluidic communication with an exterior of the sealed process chamber, the fluid inlet structure including at least a flow adjustment structure (136) to control a fluid flow from a fluid source (912) around the exterior of the sealed process chamber; and an open loop fluid convection system (904) in fluidic communication with an interior of the sealed process chamber, wherein the fluid convection system includes a rotary compressor assembly (916) that extends into the sealed process chamber is disclosed.
摘要翻译：优选地，支撑容纳室（102）的框架（104）具有限定在容纳室内的密封处理室（168），以及与密封处理室的外部流体连通的至少一个流体入口结构（112），所述流体入口结构至少包括流动调节结构（136），以控制来自所述密封处理室外部的流体源（912）的流体流动; 以及与所述密封处理室的内部流体连通的开环流体对流系统（904），其中所述流体对流系统包括延伸到所述密封处理室中的旋转式压缩机组件（916）。

2. 发明申请

WO2014133565A1 IN-SITU SPUTTERING APPARATUS 审中-公开
标题翻译：现场飞溅设备
公开(公告)号：WO2014133565A1
公开(公告)日：2014-09-04
申请号：PCT/US2013/035374
申请日：2013-04-05
申请人： POOLE VENTURA, INC.
发明人： ERICKSON, Mark, R. , POOLE, Henry, J. , CUSTER, Arthur, W.
IPC分类号： C23C14/34
CPC分类号： C23C14/046 , C23C14/35 , C23C14/351 , H01J37/32669
摘要： A sputtering apparatus (100) that includes at least a target (164) presented as an inner surface of a confinement structure (166), the inner surface of the confinement structure is preferably an internal wall of a circular tube. A cathode (102, 104) is disposed adjacent the internal wall of the circular tube. The cathode preferably provides a hollow core, within which a magnetron is disposed. Preferably, an actuator (168, 170, 196) is attached to the magnetron, wherein a position of the magnetron within the hollow core is altered upon activation of the actuator. Additionally, a carriage (112) supporting the cathode and communicating with the target is preferably provided, and a cable bundle (120) interacting with the cathode and linked to a cable bundle take up mechanism (146) provided power and coolant to the cathode, magnetron, actuator and an anode (108) of the sputtering apparatus.
摘要翻译：至少包括作为限制结构（166）的内表面的靶（164）的溅射装置（100），限制结构的内表面优选为圆管的内壁。阴极（102,104）邻近圆管的内壁设置。阴极优选地提供中空芯，其中设置有磁控管。优选地，致动器（168,170,196）附接到磁控管，其中在激活致动器时磁控管在中空芯内的位置被改变。此外，优选地设置支撑阴极并与靶连通的托架（112），并且与阴极相互作用并连接到电缆束卷取机构（146）的电缆束（120）向阴极提供电源和冷却剂，磁控管，致动器和溅射装置的阳极（108）。

3. 发明申请

WO2014143078A1 IN-SITU SPUTTERING APPARATUS 审中-公开
标题翻译：现场飞溅设备
公开(公告)号：WO2014143078A1
公开(公告)日：2014-09-18
申请号：PCT/US2013/035384
申请日：2013-04-05
申请人： POOLE VENTURA, INC.
发明人： ERICKSON, Mark, R. , POOLE, Henry, J. , CUSTER, Arthur, W. , JAMSHIDI, Nader , HERSHCOVITCH, Ady
IPC分类号： C23C14/34
CPC分类号： C23C14/35 , C23C14/046 , H01J37/32394 , H01J37/3405 , H01J37/3435 , H01J37/3438 , H01J37/3444
摘要： Λ sputtering apparatus (100) that includes at least a target (164) presented as an inner surface of a confinement structure (166), the inner surface of the confinement structure is preferably an internal wall of a circular tube. A cathode (102. 104) is disposed adjacent the internal wall of the circular tube. The cathode preferably provides a hollow core, within which a magnetron is disposed. Preferably, an actuator (168, 170, 196, 256) is attached to the magnetron, wherein a position of the magnetron within the hollow core is altered upon activation of the actuator. Additionally, a carriage (112, 222) supporting the cathode and communicating with the target is preferably provided, and a cable bundle (120, 220) interacting with the cathode and linked to a cable bundle take up mechanism (146) provides power and coolant to the cathode, magnetron, actuator and an anode (108) of the sputtering apparatus.
摘要翻译： Λ溅射装置（100）至少包括作为限制结构（166）的内表面的靶（164），限制结构的内表面优选为圆管的内壁。阴极（102.104）被设置成邻近圆管的内壁。阴极优选地提供中空芯，其中设置有磁控管。优选地，致动器（168,170,196,256）附接到磁控管，其中在激活致动器时磁控管在中空芯内的位置被改变。此外，优选地提供支撑阴极并与靶连通的托架（112,222），并且与阴极相互作用并连接到电缆束卷取机构（146）的电缆束（120,220）提供电力和冷却剂到阴极，磁控管，致动器和溅射装置的阳极（108）。

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