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1. 发明申请

US20120211267A1 PRINTED CIRCUIT BOARD SUBSTRATE 审中-公开
标题翻译：印刷电路板基板
公开(公告)号：US20120211267A1
公开(公告)日：2012-08-23
申请号：US13461749
申请日：2012-05-01
申请人： PAI-HUNG HUANG , CHIH-KANG YANG , CHENG-HSIEN LIN
发明人： PAI-HUNG HUANG , CHIH-KANG YANG , CHENG-HSIEN LIN
IPC分类号： H05K1/05 , H05K1/03
CPC分类号： H05K3/0097 , H05K3/0082 , H05K3/064 , H05K2203/1554 , Y10T29/49162
摘要： A printed circuit board substrate includes a metal-clad substrate and a number of N spaced circuit substrates arranged on the metal-clad substrate along an imaginary circle, and N is a natural number greater than 2. The circuit substrates are equiangularly arranged about the center of the circle, and each of the circuit substrates is oriented 360/N degrees with respect to a neighboring printed circuit board.
摘要翻译：印刷电路板基板包括金属包覆基板和沿着假想圆布置在金属包覆基板上的多个N个间隔开的电路基板，N是大于2的自然数。电路基板围绕中心等角地布置的圆，并且每个电路基板相对于相邻的印刷电路板定向成360度/ N度。

2. 发明申请

US20090260867A1 PRINTED CIRCUIT BOARD SUBSTRATE AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS USING SAME 有权
标题翻译：印刷电路板基板及使用其制造印刷电路板的方法
公开(公告)号：US20090260867A1
公开(公告)日：2009-10-22
申请号：US12332321
申请日：2008-12-10
申请人： PAI-HUNG HUANG , CHIH-KANG YANG , CHENG-HSIEN LIN
发明人： PAI-HUNG HUANG , CHIH-KANG YANG , CHENG-HSIEN LIN
IPC分类号： H05K1/11 , H05K3/10
CPC分类号： H05K3/0097 , H05K3/0082 , H05K3/064 , H05K2203/1554 , Y10T29/49162
摘要： A printed circuit board substrate includes a metal-clad substrate and a number of N spaced circuit substrates arranged on the metal-clad substrate along an imaginary circle, N is a natural number greater than 2. The circuit substrates are equiangularly arranged about the center of the circle, and each of the circuit substrates is oriented 360/N degrees with respect to a neighboring printed circuit board.
摘要翻译：印刷电路板基板包括金属包覆基板和沿着假想圆布置在金属包覆基板上的多个N个间隔开的电路基板，N是大于2的自然数。电路基板绕等角度地布置在圆圈和每个电路基板相对于相邻的印刷电路板定向成360度/ N度。

3. 发明申请

US20090013526A1 INNER SUBSTRATE FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARDS AND METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARDS USING THE SAME 有权
标题翻译：用于制造多层印刷电路板的内部基板和使用其制造多层印刷电路板的方法
公开(公告)号：US20090013526A1
公开(公告)日：2009-01-15
申请号：US11959212
申请日：2007-12-18
申请人： CHIH-KANG YANG , CHENG-HSIEN LIN
发明人： CHIH-KANG YANG , CHENG-HSIEN LIN
IPC分类号： H05K3/36 , H05K3/42
CPC分类号： H05K3/0097 , H05K1/0393 , H05K3/06 , H05K3/242 , H05K3/4611 , H05K3/4635 , H05K3/4652 , H05K3/4691 , H05K2201/055 , H05K2201/09036 , H05K2201/09063 , H05K2201/1028 , H05K2203/1536 , H05K2203/1545 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49135 , Y10T29/49165 , Y10T428/15
摘要： An exemplary inner substrate for manufacturing multilayer printed circuit boards is provided. The inner substrate has a number of substrate units and a number of transverse folding portions alternately arranged along a longitudinal direction of the inner substrate. Each of the substrate units is configured for forming a unitary printed circuit board. Each of the folding portions is interconnected between neighboring substrate units. Each of the folding portions defines at least one line weakness perpendicular to the longitudinal direction of the inner substrate for facilitating folding and unfolding the neighboring substrate units to each other. An exemplary method for manufacturing multilayer printed circuit boards using the inner substrate is also provided. The method can improve efficiency of manufacturing multilayer printed circuit boards.
摘要翻译：提供了用于制造多层印刷电路板的示例性内基板。内部基板具有多个基板单元和沿着内部基板的纵向方向交替排列的多个横向折叠部。每个基板单元被构造成用于形成一体的印刷电路板。每个折叠部分在相邻的基板单元之间互连。每个折叠部分限定垂直于内部基板的纵向方向的至少一条线弱点，以便于相邻的基板单元相互折叠和展开。还提供了使用内部基板制造多层印刷电路板的示例性方法。该方法可以提高制造多层印刷电路板的效率。

4. 发明申请

US20110274866A1 INNER SUBSTRATE FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARDS 审中-公开
标题翻译：用于制造多层印刷电路板的内部基板
公开(公告)号：US20110274866A1
公开(公告)日：2011-11-10
申请号：US13186486
申请日：2011-07-20
申请人： CHIH-KANG YANG , CHENG-HSIEN LIN
发明人： CHIH-KANG YANG , CHENG-HSIEN LIN
IPC分类号： B65D65/28
CPC分类号： H05K3/0097 , H05K1/0393 , H05K3/06 , H05K3/242 , H05K3/4611 , H05K3/4635 , H05K3/4652 , H05K3/4691 , H05K2201/055 , H05K2201/09036 , H05K2201/09063 , H05K2201/1028 , H05K2203/1536 , H05K2203/1545 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49135 , Y10T29/49165 , Y10T428/15
摘要： An exemplary inner substrate for manufacturing multilayer printed circuit boards is provided. The inner substrate has a number of substrate units and a number of transverse folding portions alternately arranged along a longitudinal direction of the inner substrate. Each of the substrate units is configured for forming a unitary printed circuit board. Each of the folding portions is interconnected between neighboring substrate units. Each of the folding portions defines at least one line of weakness perpendicular to the longitudinal direction of the inner substrate for facilitating folding and unfolding the neighboring substrate units to each other. Each of the folding portions defines at least one groove in at least one side thereof along the at least one line of weakness.
摘要翻译：提供了用于制造多层印刷电路板的示例性内基板。内部基板具有多个基板单元和沿着内部基板的纵向方向交替排列的多个横向折叠部。每个基板单元被构造成用于形成一体的印刷电路板。每个折叠部分在相邻的基板单元之间互连。每个折叠部分限定垂直于内部基板的纵向方向的至少一条弱线，以便于相邻的基板单元相互折叠和展开。每个折叠部分沿着至少一条弱点在其至少一侧限定至少一个凹槽。

5. 发明申请

US20100139966A1 INNER SUBSTRATE FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARDS 审中-公开
标题翻译：用于制造多层印刷电路板的内部基板
公开(公告)号：US20100139966A1
公开(公告)日：2010-06-10
申请号：US12702439
申请日：2010-02-09
申请人： CHIH-KANG YANG , CHENG-HSIEN LIN
发明人： CHIH-KANG YANG , CHENG-HSIEN LIN
IPC分类号： H05K1/11
CPC分类号： H05K3/0097 , H05K1/0393 , H05K3/06 , H05K3/242 , H05K3/4611 , H05K3/4635 , H05K3/4652 , H05K3/4691 , H05K2201/055 , H05K2201/09036 , H05K2201/09063 , H05K2201/1028 , H05K2203/1536 , H05K2203/1545 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49135 , Y10T29/49165 , Y10T428/15
摘要： An exemplary inner substrate for manufacturing multilayer printed circuit boards is provided. The inner substrate has a number of substrate units and a number of transverse folding portions alternately arranged along a longitudinal direction of the inner substrate. Each of the substrate units is configured for forming a unitary printed circuit board. Each of the folding portions is interconnected between neighboring substrate units. Each of the folding portions defines at least one line of weakness perpendicular to the longitudinal direction of the inner substrate for facilitating folding and unfolding the neighboring substrate units to each other.
摘要翻译：提供了用于制造多层印刷电路板的示例性内基板。内部基板具有多个基板单元和沿着内部基板的纵向方向交替排列的多个横向折叠部。每个基板单元被构造成用于形成一体的印刷电路板。每个折叠部分在相邻的基板单元之间互连。每个折叠部分限定垂直于内部基板的纵向方向的至少一条弱线，以便于相邻的基板单元相互折叠和展开。

6. 发明申请

US20090025582A1 SCREEN PRINTING METHOD FOR PRINTING A PRINTED CIRCUIT BOARD 审中-公开
标题翻译：印刷印刷电路板的印刷方法
公开(公告)号：US20090025582A1
公开(公告)日：2009-01-29
申请号：US11952964
申请日：2007-12-07
申请人： TSO-HUNG YEH , CHIH-KANG YANG , HUNG-YI CHANG , CHIH-LUNG HSIAO
发明人： TSO-HUNG YEH , CHIH-KANG YANG , HUNG-YI CHANG , CHIH-LUNG HSIAO
IPC分类号： B41M1/12
CPC分类号： H05K3/28 , H05K3/1225 , H05K3/1233 , H05K2201/09236 , H05K2203/0139
摘要： An exemplary screen printing method for printing a printed circuit board is provided. The printed circuit board includes a number of parallel electrical traces. In the method, firstly, a screen printing stencil is disposed on a side of the printed circuit board having the electrical traces and a squeegee is disposed on the screen printing stencil. Secondly, the squeegee is drawn across the screen printing stencil in a manner such that an angle between a blade of the squeegee and the electrical traces is in a range from 20 degrees to 70 degrees so as to print an ink on the printed circuit board. The method can improve quality of the printed circuit board.
摘要翻译：提供了用于印刷印刷电路板的示例性丝网印刷方法。印刷电路板包括多个平行的电迹线。在该方法中，首先，在具有电迹线的印刷电路板的一侧设置丝网印刷模版，并且在丝网印刷模版上设置刮板。其次，将刮板沿着丝网印刷模板拉伸，使得刮板的刮刀和电迹线之间的角度在20度至70度的范围内，以便在印刷电路板上印刷油墨。该方法可以提高印刷电路板的质量。

7. 发明申请

US20090056624A1 FLUID CIRCULATING SYSTEM FOR MANUFACTURING PRINTED CIRCUIT BOARD 审中-公开
标题翻译：用于制造印刷电路板的流体循环系统
公开(公告)号：US20090056624A1
公开(公告)日：2009-03-05
申请号：US12045150
申请日：2008-03-10
申请人： CHIH-KANG YANG , HUNG-YI CHANG , CHIH-LUNG HSIAO , TUNG-YAO KUO
发明人： CHIH-KANG YANG , HUNG-YI CHANG , CHIH-LUNG HSIAO , TUNG-YAO KUO
IPC分类号： B05C3/04
CPC分类号： G03F7/16
摘要： An exemplary fluid circulating system includes a return pipe, a reservoir, a suction pipe, a supply pipe, a circulating pump, and a processing device. The reservoir is configured for containing a work fluid. The processing device is configured for processing a semi-finished printed circuit board using the work fluid. The circulating pump is configured for transferring the work fluid from the reservoir to the processing device. The suction pipe and the supply pipe are respectively coupled to an inlet and the outlet of the circulating pump. An inner diameter of the suction pipe is larger than that of the supply pipe. The return pipe is coupled to the processing device for delivering the work fluid from the processing device to the reservoir. The fluid circulating system can improve quality of the circulated work fluid.
摘要翻译：示例性的流体循环系统包括回流管，储存器，吸入管，供给管，循环泵和处理装置。储存器构造成容纳工作流体。处理装置构造成用于使用工作流体处理半成品印刷电路板。循环泵构造成用于将工作流体从储存器传送到处理装置。吸入管和供给管分别连接到循环泵的入口和出口。吸入管的内径大于供给管的内径。返回管连接到处理装置，用于将工作流体从处理装置输送到储存器。流体循环系统可以提高循环工作流体的质量。

8. 发明申请

US20090314739A1 WET PROCESSING SYSTEM AND WET PROCESSING METHOD 审中-公开
标题翻译：湿处理系统和湿处理方法
公开(公告)号：US20090314739A1
公开(公告)日：2009-12-24
申请号：US12345896
申请日：2008-12-30
申请人： CHIH-KANG YANG , WEN-CHIN LEE
发明人： CHIH-KANG YANG , WEN-CHIN LEE
IPC分类号： B44C1/22 , C23F1/08
CPC分类号： H05K3/0085 , H05K3/068 , H05K2203/0195 , H05K2203/075 , H05K2203/082 , H05K2203/1476 , H05K2203/1509 , H05K2203/166
摘要： An exemplary system for processing a workpiece comprises a conveyor, a first liquid spraying device, a second liquid spraying device, and a substrate positioning device. The conveyor is configured for conveying the workpiece along a conveying direction. The first and second liquid spraying devices for spraying liquid onto the workpiece transported on the conveyor face the conveyor and are arranged along the conveying direction. The substrate positioning device for reorienting the workpiece on the conveyor is installed between the first and second liquid spraying devices and faces the conveyor.
摘要翻译：用于处理工件的示例性系统包括输送机，第一液体喷射装置，第二液体喷射装置和基板定位装置。输送机构造成沿输送方向输送工件。第一和第二液体喷射装置，用于将液体喷射到在输送机上传送的工件上，并且沿输送方向布置。用于在输送机上重新定向工件的基板定位装置安装在第一和第二液体喷涂装置之间并面向输送机。

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