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1. 发明专利

JP2005200676A Composite material and its production method 有权
标题翻译：复合材料及其生产方法
公开(公告)号：JP2005200676A
公开(公告)日：2005-07-28
申请号：JP2004005629
申请日：2004-01-13
申请人： Morinobu Endo , Shimane Pref Gov , 島根県 , 守信遠藤
发明人： ENDO MORINOBU , SATO KIMINORI , OZOE NOBUAKI , OGAWA JINICHI , KOMATSUBARA SATOSHI , UENO TOSHIYUKI
IPC分类号： B82B1/00 , B32B5/12 , C01B31/02 , C22C47/20 , C22C49/14 , C22C101/10
摘要： PROBLEM TO BE SOLVED: To provide an easily producible composite material whose control in a heat flow direction is possible, and to provide its production method.
SOLUTION: In at least one kind CF 11 selected from carbon fibers and carbon nanotubes, the fiber axial direction thereof is drawn-up, and they are sandwiched by metallic layers 12 at least comprising aluminum to compose a composite sheet 10. Then, the plurality of composite sheets 10 are stacked in such a manner that the fibrous axial direction is made the same or is made alternately different, and while performing heating at prescribed temperature, they are press-fitted and integrated under prescribed pressure so as to be composed into block-shaped composite materials 20, 30 and 40.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种易于生产的复合材料，其可以在热流方向上进行控制，并提供其制造方法。解决方案：在选自碳纤维和碳纳米管的至少一种CF 11中，其纤维轴向被拉伸，并且它们被至少包含铝的金属层12夹在中以构成复合片10.然后多个复合片10以使纤维轴方向相同或交替不同的方式层叠，在规定温度下进行加热的同时，将其按规定的压力压配合成一体，组成块状复合材料20,30和40.版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2009290238A Semiconductor light emitting module, and manufacturing method thereof 有权
标题翻译：半导体发光模块及其制造方法
公开(公告)号：JP2009290238A
公开(公告)日：2009-12-10
申请号：JP2009206380
申请日：2009-09-07
申请人： Shimane Denshi Imafuku Seisakusho:Kk , Shimane Pref Gov , 島根県 , 株式会社島根電子今福製作所
发明人： KOMATSUBARA SATOSHI , UENO TOSHIYUKI , FUKUDA KENICHI , FURUTA TORU
IPC分类号： H01L33/00 , H01L33/62 , H01L33/64
CPC分类号： F21K9/00 , F21S2/005 , F21V29/20 , F21V29/70 , F21V29/74 , F21V29/83 , F21Y2115/10 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2924/01078 , H01L2924/01087 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor light emitting module which achieves high luminance light emission by temporally keeping a light reflectivity high improvingly, obtaining uniform light and raising a light extraction efficiency. SOLUTION: The semiconductor light emitting module 2501 includes: a highly reflective plate 2502 performing heat dissipation and having light reflecting function; an insulating film 2503 performing insulation by covering the highly reflective plate 2502; and a power distribution film 2504 additionally laminated via the insulating film 2503, which acts as another electrode. One or more semiconductor light emitting elements 2511 which are supplied with electric power and emits light actually, are connected with the power distribution film 2504 through elctrically conductive wires 2512. Preferably the highly reflective plate 2502 has a total reflectivity of 98% or more, although it is possible to extract a sufficient amount of light if the total reflectivity is 95% or more. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：提供一种半导体发光模块，其通过在时间上保持光反射率高度地获得高亮度发光，获得均匀的光并提高光提取效率。解决方案：半导体发光模块2501包括：执行散热并具有光反射功能的高反射板2502; 通过覆盖高反射板2502进行绝缘的绝缘膜2503; 以及作为另一电极的绝缘膜2503进一步层叠的配电膜2504。提供电力并实际发光的一个或多个半导体发光元件2511通过电导线2512与配电膜2504连接。优选地，高反射板2502的总反射率为98％以上，尽管如果总反射率为95％以上，则能够提取足量的光。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2009004576A Cooling device 审中-公开
标题翻译：冷却装置
公开(公告)号：JP2009004576A
公开(公告)日：2009-01-08
申请号：JP2007164191
申请日：2007-06-21
申请人： Shimane Pref Gov , 島根県
发明人： ONO MIKIYA , UENO TOSHIYUKI
IPC分类号： H01L23/36 , H01L23/373 , H05K7/20
摘要： PROBLEM TO BE SOLVED: To provide a cooling device capable of facilitating process management in an assembly process of the cooling device, reducing thermal resistance in an electronic device formed by the assembly process and a cooling member, and restraining a secular change.
SOLUTION: The cooling device 100 comprises a cooling member 102 arranged nearly opposite to the electronic device 106, and a plurality of carbon nanotubes 104 provided between the electronic device 106 and the cooling member 102. Both ends of the carbon nanotube 104 come into contact with a surface 110 of the electronic device 106 opposite to the cooling member 102 and a surface 108 of the cooling member 102 opposite to the electronic device 106 respectively, thus composing the reduction structure of contact thermal resistance. A bundle 104 of carbon nanotubes faces a direction nearly vertical to the surface 110 of the electronic device 106 and the surface of the cooling member 102.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够有助于冷却装置的组装过程中的过程管理的冷却装置，降低通过组装过程形成的电子设备中的热阻和冷却构件，并且抑制长期变化。解决方案：冷却装置100包括与电子设备106几乎相对设置的冷却构件102，以及设置在电子设备106和冷却构件102之间的多个碳纳米管104.碳纳米管104的两端到达与电子设备106的与冷却构件102相对的表面110和与电子设备106相对的冷却构件102的表面108接触，从而构成接触热阻的还原结构。碳纳米管束104面向几乎垂直于电子设备106的表面110和冷却构件102的表面的方向。（C）2009，JPO＆INPIT

4. 发明专利

JP2008112893A Manufacturing method of high thermal conduction composite material 有权
标题翻译：高导热复合材料的制造方法
公开(公告)号：JP2008112893A
公开(公告)日：2008-05-15
申请号：JP2006295596
申请日：2006-10-31
申请人： Hitachi Metals Ltd , Shimane Pref Gov , 島根県 , 日立金属株式会社
发明人： UENO TOSHIYUKI , YOKOYAMA SHINICHIRO
IPC分类号： H01L23/36
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a high thermal conduction composite material capable of ensuring that it enables a precise electric and electronic part to have high reliability.
SOLUTION: The manufacturing method of this invention comprises processes of coating the surface of a carbon fiber bundle with core forming high thermal conduction metal of a thermal conductivity 100 W/(m K) or above or depositing core forming high thermal conduction metal of a thermal conductivity 100 W/(m K) or above on the surface of a carbon fiber bundle, cutting the carbon fiber bundle in the prescribed length, subjecting the cut pieces to a pressure sintering method, such as a pulse current sintering method etc, as they are stacked up, obtaining a core material, arranging housing forming high thermal conduction metal of a thermal conductivity 100 W/(m K) or above around all the core material, and furthermore subjecting the core material to a pressure sintering method, such as a pulse current sintering method etc. It is preferable that the volume rate Vf of carbon fiber of the core material is set at 30 to 90%. The core forming high thermal conduction metal and housing forming high thermal conduction metal are of the same kind, and it is preferable that the above metal is selected from copper, copper alloy, aluminum, and aluminum alloy.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够确保精确的电气和电子部件具有高可靠性的高导热复合材料的制造方法。解决方案：本发明的制造方法包括用导热率为100W /（m·K）以上的芯形成高导热性金属的芯的碳纤维束的表面或者形成高导热性金属的芯在碳纤维束的表面上的导热率为100W /（m·K）以上的热导率，切割规定长度的碳纤维束，对切断片进行如脉冲电流烧结法等的加压烧结法堆叠起来，获得芯材，在芯材周围形成导热率为100W /（m·K）以上的导热性高导热性金属的外壳，再对芯材进行加压烧结，例如脉冲电流烧结法等。芯材的碳纤维的体积率Vf优选为30〜90％。形成高导热金属的芯和形成高导热金属的外壳是相同的，并且上述金属优选选自铜，铜合金，铝和铝合金。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2008078188A Insulation structure for high thermal conductor 审中-公开
标题翻译：高导热体绝缘结构
公开(公告)号：JP2008078188A
公开(公告)日：2008-04-03
申请号：JP2006252612
申请日：2006-09-19
申请人： Fujitsu General Ltd , Shimane Pref Gov , 島根県 , 株式会社富士通ゼネラル
发明人： EBISU NAOKI , SATO KIMINORI , OZOE NOBUAKI , UENO TOSHIYUKI , FUKUDA KENICHI , YOSHIOKA HISASHI
IPC分类号： H05K7/20 , H01B17/56 , H01J7/24
摘要： PROBLEM TO BE SOLVED: To provide an insulation structure that insulates carbon fiber or carbon nanofiber as a high thermal conductor and has high strength and is durable against high temperature. SOLUTION: A holding carrier 10 or a holding carrier 6b is formed by sintering an insulative material, e.g. silicon dioxide (SiO2) powder. For example, a heat transmissive fiber flux 6a wherein cross sections are arranged as plane is piled up on the insulative holding carrier 10 as shown in the diagram 3 (A). In addition, as shown in the diagram 3 (B), the insulative holding carrier 10 is piled up on the upper and lower sides of the heat transmissive fiber flux 6a wherein cross sections are arranged as plane. Furthermore, as shown in the diagram 3 (C), the holding carrier 6b covers the vicinity of the heat transmissive fiber flux 6a wherein cross section are arranged like plane. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供将碳纤维或碳纳米纤维作为高热导体绝缘并具有高强度并耐高温的绝缘结构。解决方案：保持载体10或保持载体6b通过烧结绝缘材料形成。二氧化硅（SiO2）粉末。例如，如图3（A）所示，其中横截面被布置为平面的透热光纤6a堆积在绝缘保持载体10上。此外，如图3（B）所示，绝缘保持架10堆叠在透光性光纤6a的上侧和下侧，其横截面布置为平面。此外，如图3（C）所示，保持载体6b覆盖横截面像平面一样布置的透光光纤6a的附近。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2006307358A Nanofiber-containing pitch-based carbon fiber and method for producing the same 有权
标题翻译：含有纳米纤维的基于沥青的碳纤维及其制造方法
公开(公告)号：JP2006307358A
公开(公告)日：2006-11-09
申请号：JP2005128218
申请日：2005-04-26
申请人： Shimane Pref Gov , 島根県
发明人： KATO OSAMU , UENO TOSHIYUKI
IPC分类号： D01F9/145
摘要： PROBLEM TO BE SOLVED: To provide a new composite material able to perform high-efficient heat transport by organizing and arranging very fine nanofibers, especially making use of a high heat conductivity of the same.
SOLUTION: The nanofiber-containing pitch-based carbon fiber contains 0.5-60 wt.% nanofiber having ≤300nm diameter and ≥10 aspect ratio (ratio of length/diameter) in a carbon matrix having 5-20μm thickness from the surface to the central part and is graphitized.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供能够通过组织和布置非常细的纳米纤维来进行高效热输送的新型复合材料，特别是利用其高的导热性。解决方案：含有纳米纤维的沥青类碳纤维含有0.5〜60重量％的纳米纤维，其直径为300nm，厚度为5-20μm的碳基体的长径比（长度/直径比）≥10 到中部，石墨化。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2009004577A Method of manufacturing cooling device 审中-公开
标题翻译：制冷装置的制造方法
公开(公告)号：JP2009004577A
公开(公告)日：2009-01-08
申请号：JP2007164192
申请日：2007-06-21
申请人： Shimane Pref Gov , 島根県
发明人： ONO MIKIYA , UENO TOSHIYUKI
IPC分类号： H01L23/36
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a cooling device capable of facilitating process management in an assembly process of the cooling device, reducing heat resistance in an electronic device formed by the assembly process and a cooling member, and restraining a secular change.
SOLUTION: A plurality of CNTs 104 are vertically grown from a surface 108 of the cooling member 102. In the growth of the CNTs, although the present invention produces an effect when in-plane density is not less than 20%, the in-plane density should be desirably high as much as possible. The electronic device 106 and the cooling member 102 are arranged nearly oppositely by fastening or the like so that the end of the grown CNT 104 comes into contact. The length of the CNT 104 should be desirably approximately 1-4 times larger than surface roughness Rz of the electronic device 106 to be arranged oppositely.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造冷却装置的方法，该冷却装置能够便于冷却装置的组装过程中的过程管理，降低由组装过程形成的电子装置和冷却构件中的耐热性，并且限制一个长期的变化。解决方案：多个CNT 104从冷却构件102的表面108垂直生长。在CNT的生长中，尽管本发明在面内密度不小于20％时产生效果，平面密度应尽可能地高。电子装置106和冷却构件102通过紧固等几乎相反地布置，使得生长的CNT 104的端部接触。 CNT104的长度宜期望相对于电子设备106的表面粗糙度Rz大约1-4倍。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2007323881A Light source device and projector equipped with light source device 审中-公开
标题翻译：光源设备和投影仪配备光源设备
公开(公告)号：JP2007323881A
公开(公告)日：2007-12-13
申请号：JP2006151121
申请日：2006-05-31
申请人： Fujitsu General Ltd , Shimane Pref Gov , 島根県 , 株式会社富士通ゼネラル
发明人： TOKUDA SATORU , EBISU NAOKI , OZOE NOBUAKI , OGAWA JINICHI , KOMATSUBARA SATOSHI , UENO TOSHIYUKI , FUKUDA KENICHI , YOSHIOKA HISASHI
IPC分类号： H01J61/52 , F21V29/00 , G03B21/14 , G03B21/16 , H01J61/86
摘要： PROBLEM TO BE SOLVED: To provide a projector with thermal conductivity improved, between a sealed part and a thermal conductive part of an arc tube provided on a light source device, reducing noise of a fan by structuring the projector without using a fan, and without light leakage from the light source device to outside a chassis.
SOLUTION: The light source device 1 is structured by a reflector 2, a heat radiating part 5 fixed at the reflector, an arc tube 3 equipped with a fixed part 3d made of a copper plate provided on a sealing part 3b, a thermal conductive part 4 (a copper sleeve) arranged in free sliding on an outer peripheral surface of the sealing part 3b and equipped with a slit 4a in accordance with the fixed part 3d, a spring 5b (a biasing means) in a coil shape, and a stopper 5c. And also, the fixed part 3d is fixed at a guide part 2b of the reflector 2. An end part of the thermal conductive part 4 is formed in a semi-circle shape of its cross-section so as to be tightly attached to the light-emitting part 3a, and the spring 5b (the biasing means) biases the thermal conductive part 4 toward a direction of the light-emitting part 3a.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供改善导热性的投影仪，在设置在光源装置上的电弧管的密封部分和导热部分之间，通过在不使用风扇的情况下构造投影机来降低风扇的噪声，并且没有从光源装置到底盘外部的光泄漏。解决方案：光源装置1由反射器2，固定在反射器处的散热部分5，设置有设置在密封部分3b上的由铜板制成的固定部分3d的发光管3构成，在密封部3b的外周面自由滑动配置的导热部4（铜套筒），配置有与固定部3d对应的狭缝4a，线圈形状的弹簧5b（偏置构件）和塞子5c。此外，固定部3d固定在反射体2的引导部2b上。导热部4的端部形成为其横截面的半圆形状，以紧贴于光并且弹簧5b（偏置装置）朝着发光部分3a的方向偏压导热部分4。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2007323879A Light source device, and projector using the same 审中-公开
标题翻译：光源装置和使用该光源的投影仪
公开(公告)号：JP2007323879A
公开(公告)日：2007-12-13
申请号：JP2006151098
申请日：2006-05-31
申请人： Fujitsu General Ltd , Shimane Pref Gov , Sps Syntex Inc , Spsシンテックス株式会社 , 島根県 , 株式会社富士通ゼネラル
发明人： EBISU NAOKI , TOKUDA SATORU , KOMATSUBARA SATOSHI , UENO TOSHIYUKI , YOSHIOKA HISASHI , TOKITA MASAO
IPC分类号： H01J61/52 , F21V29/00 , G03B21/14 , G03B21/16 , H01J61/86
摘要： PROBLEM TO BE SOLVED: To provide a projector improving thermal conductivity between a sealing part of an arc tube provided for a light source device and a heat conductive part, and capable of eliminating noise of a fan, and of preventing light from the light source device from leaking to the outside of a housing.
SOLUTION: As shown in Fig.2(A), a heat conductive part 4 of a sealing part 3b is formed as a heat conductive layer 4a on a circumferential surface of the sealing part 3b by using a discharge plasma sintering method using powder of copper. As shown in Fig.2(B), the heat conductive part 4 of the sealing part 3b is formed with a mixed heat conductive layer 4b and a metal sleeve 4c mounted on the mixed heat conductive layer 4b. Alternatively, as shown in Fig.2(C), the heat conductive part 4 of the sealing part 3b is formed with a mixed heat conductive layer 4b, and a metal layer 4d formed on the mixed heat conductive layer 4b. Alternatively, as shown in Fig.2(D), the heat conductive part 4 of the sealing part 3b is formed with a multi-stratified mixed heat conductive layer 4b, and a metal sleeve 4c mounted on the mixed heat conductive layer 4b.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种提高设置在光源装置的发光管的密封部与导热部之间的能够消除风扇噪声的热导率的投影仪，并且防止来自光源装置从外壳泄漏到外部。解决方案：如图2（A）所示，通过使用放电等离子体烧结方法，在密封部3b的周面上形成密封部3b的导热部4作为导热层4a，铜粉。如图2（B）所示，密封部3b的导热部4形成有混合导热层4b和安装在混合导热层4b上的金属套筒4c。或者，如图2（C）所示，密封部3b的导热部4形成有混合导热层4b和形成在混合导热层4b上的金属层4d。或者，如图2（D）所示，密封部3b的导热部4形成有多层混合导热层4b和安装在混合导热层4b上的金属套筒4c。版权所有（C）2008，JPO＆INPIT

10. 发明专利

JP2006260915A Electromagnetic wave heating apparatus 审中-公开
标题翻译：电磁波加热装置
公开(公告)号：JP2006260915A
公开(公告)日：2006-09-28
申请号：JP2005076055
申请日：2005-03-16
申请人： Masaji Miyake , Shimane Pref Gov , Univ Kinki , 正司三宅 , 学校法人近畿大学 , 島根県
发明人： MIYAKE MASAJI , SAJI TASABUROU , UENO TOSHIYUKI
IPC分类号： H05B6/72 , H05B6/64 , H05B6/74
CPC分类号： H05B6/70 , H05B6/76
摘要： PROBLEM TO BE SOLVED: To provide an electromagnetic wave heating apparatus which can convey an electromagnetic energy efficiently to a heated object and having an insulating structure which can prevent heat emission from the heated object.
SOLUTION: An electromagnetic wave heating apparatus has a container part which contains an object to be heated by electromagnetic waves, an electromagnetic wave emitting means fixed outside of the above container, and an inductive part, which is placed outside of the above container as well as on the route of electromagnetic waves from the above electromagnetic wave emission means, and which leads electromagnetic waves from the above electromagnetic wave emission means to the above container. The above container part has an induction part for taking inside electromagnetic waves from the above inductive part and is formed of an electric conductive material.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题：提供一种电磁波加热装置，其能够将电磁能量有效地传送到被加热物体并具有能够防止被加热物体发热的绝缘结构。解决方案：电磁波加热装置具有容纳部件，该容器部分包含被电磁波加热的物体，固定在上述容器外部的电磁波发射装置和位于上述容器外部的电感部分以及来自上述电磁波发射装置的电磁波的路径，并且将来自上述电磁波发射装置的电磁波引导到上述容器。上述容器部分具有用于从上述感应部分吸收电磁波的感应部件，并且由导电材料形成。版权所有（C）2006，JPO＆NCIPI

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